Rectifier structures for AC LED systems

• US 9,136,257 B1
• Filed: 10/15/2013
• Issued: 09/15/2015
• Est. Priority Date: 06/30/2009
• Status: Expired due to Fees

• Current Assignee: Applied Lighting Solutions, LLC
• Original Assignee: Applied Lighting Solutions, LLC
• Inventors: Shum, Frank
• Primary Examiner(s): NGO, NGAN V
• Application Number:
  US14/054,282
• Time in Patent Office: 700 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/32257 the layer connector connecting to a bonding area disposed in a recess of the surface of the item
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 28/20 Resistors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 off-chip wires
• CPC Class Codes: H01L 33/08 with a plurality of light emitting regions, e.g. laterally discontinuous light emitting layer or photoluminescent region integrated within the semiconductor body H01L27/15 takes precedence
• CPC Class Codes: H01L 33/42 Transparent materials
• CPC Class Codes: H01L 33/48 characterised by the semiconductor body packages
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
• CPC Class Codes: H05K 1/0259 Electrostatic discharge [ESD] protection
• CPC Class Codes: H05K 1/0263 High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board H05K1/0293 takes precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 2201/10106 : Light emitting diode [LED]
• CPC Class Codes: H05K 2203/049 : Wire bonding
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

A space efficient arrangement of at least one LED with a rectifying element and a current limiting element forms a compact module that can be powered using an AC voltage source.

Claims

1. A system comprising:

a power input;

a first die comprising a first light emitting diode with a light emitting surface;

a second die comprising a second light emitting diode with a light emitting surface;

a third die comprising a first current limiting element,

wherein the first current limiting element of the third die is electrically coupled to the first light emitting diode of the first die and the second light emitting diode of the second die,

the first and second dies are electrically coupled to produce a combined forward voltage greater than a forward voltage of either the first or second die, and

the third die comprises a first terminal coupled to the power input and a second terminal coupled to at least the first light emitting diode or second light emitting diode; and

a planar substrate, wherein the first, second, and third dies are formed on one side of the planar substrate.

2. The system of claim 1 wherein the third die comprises at least one electric static discharge (ESD) protection diode.

3. The system of claim 1 wherein the third die comprises at least one resistor.

4. The system of claim 1 wherein the first die comprises at least two light emitting diodes.

5. The system of claim 1 further comprising:

a fourth die comprising a light emitting diode, wherein the first and fourth dies are electrically coupled together.

6. The system of claim 1 where the first current limiting element is fabricated from a silicon material.

7. The system of claim 1 comprising:

an encapsulation material formed over the first, second or third dies, wherein the encapsulation material is a light transmitting medium.

8. The system of claim 1 wherein the first current limiting element comprises a diode.

9. The system of claim 1 wherein the first current limiting element comprises a rectifying element.

10. A system comprising:

a power input;

a first die comprising a first light emitting diode;

a second die comprising of a second light emitting diode; and

a third die comprising a first current limiting element,

wherein the third die is electrically coupled to the first and second dies,

the first and second dies are electrically coupled to produce a combined forward voltage greater than the forward voltage of either the first or second die, and

the first current limiting element comprises a first terminal coupled to the power input and a second terminal coupled to the first light emitting diode.

11. The system of claim 10 comprising:

a planar substrate, wherein the first, second, and third dies are formed on a one side of the planar substrate.

12. The system of claim 10 comprising:

a second current limiting element, comprising a first terminal coupled to the power input and a second terminal coupled to the second light emitting diode.

13. The system of claim 10 comprising:

an encapsulation material formed over at least the first and second dies, wherein the encapsulation material is a light transmitting medium.

14. The system of claim 10 wherein the first die comprises at least two light emitting diodes.

15. The system of claim 10 wherein the first current limiting element comprises a resistor.

16. The system of claim 10 wherein the first current limiting element comprises a diode.

17. The system of claim 10 wherein the first current limiting element comprises a rectifying element.

18. The system of claim 10 wherein the first light emitting diode is coupled in series with the second light emitting diode.

19. A system comprising:

a power input;

a first die comprising a first light emitting diode;

a second die comprising of a second light emitting diode;

a third die comprising a first current limiting element,

wherein the third die is electrically coupled to the first and second dies,

the first and second dies are electrically coupled to produce a combined forward voltage greater than the forward voltage of either the first or second die,

the current limiting element comprises a first terminal coupled to the power input and a second terminal coupled to the first light emitting diode, and

the second light emitting diode is coupled through the first light emitting diode to the first current limiting element;

a planar substrate, wherein the first, second, and third dies are formed on one side of the planar substrate; and

an encapsulation material formed over at least the first or second die, wherein the encapsulation material is a light transmitting medium.

20. The system of claim 19 wherein the current limiting element comprises a rectifying element.