Method of forming a magnetic tunnel junction structure
First Claim
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1. A method comprising:
- forming a magnetic tunnel junction (MTJ) structure including a conductive layer on a substrate;
depositing a sacrificial layer on the conductive layer, the sacrificial layer comprising silicon carbon;
depositing an amorphous carbon layer on the sacrificial layer, the sacrificial layer selected to have a chemical structure having substantially no impact on a resolution of a pattern definition with respect to the amorphous carbon layer;
depositing one or more hard mask and photo-resist layers on the amorphous carbon layer deposited on the sacrificial layer, the amorphous carbon layer located between the sacrificial layer and the one or more hard mask and photo-resist layers;
patterning and removing the one or more hard mask and photo-resist layers and the amorphous carbon layer; and
depositing a non-magnetic spacer film on an exposed portion of the sacrificial layer, wherein the sacrificial layer is comprised of the same material as the non-magnetic spacer film.
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Abstract
In a particular embodiment, a method is disclosed that includes forming a magnetic tunnel junction (MTJ) structure including a conductive layer on a substrate. The method also includes depositing a sacrificial layer on the conductive layer before depositing a patterning film layer.
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Citations
21 Claims
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1. A method comprising:
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forming a magnetic tunnel junction (MTJ) structure including a conductive layer on a substrate; depositing a sacrificial layer on the conductive layer, the sacrificial layer comprising silicon carbon; depositing an amorphous carbon layer on the sacrificial layer, the sacrificial layer selected to have a chemical structure having substantially no impact on a resolution of a pattern definition with respect to the amorphous carbon layer; depositing one or more hard mask and photo-resist layers on the amorphous carbon layer deposited on the sacrificial layer, the amorphous carbon layer located between the sacrificial layer and the one or more hard mask and photo-resist layers; patterning and removing the one or more hard mask and photo-resist layers and the amorphous carbon layer; and depositing a non-magnetic spacer film on an exposed portion of the sacrificial layer, wherein the sacrificial layer is comprised of the same material as the non-magnetic spacer film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method comprising:
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depositing a first electrode on a substrate; forming a magnetic tunnel junction (MTJ) structure on the first electrode, the MTJ structure including a tunnel barrier layer between two magnetic layers; depositing a second electrode on the MTJ structure; depositing a sacrificial cap layer on the second electrode before deposition of an amorphous carbon layer, the sacrificial cap layer to reduce oxidation and erosion of the second electrode during at least one patterning process, the sacrificial cap layer comprising silicon carbon; depositing the amorphous carbon layer on the sacrificial cap layer, the sacrificial cap layer selected to have a chemical structure having substantially no impact on a resolution of a pattern definition with respect to the amorphous carbon layer; depositing a hard mask layer and a photo-resist layer on the amorphous carbon layer, the amorphous carbon layer located between the sacrificial cap layer and the hard mask layer; patterning and removing the hard mask layer, the photo-resist layer, and the amorphous carbon layer; and depositing a non-magnetic spacer layer over an exposed portion of the sacrificial cap layer, wherein the sacrificial cap layer is comprised of the same material as the non-magnetic spacer layer. - View Dependent Claims (10, 11, 12, 13, 14, 20, 21)
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15. A method comprising:
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forming a magnetic tunnel junction (MTJ) structure including a tunnel barrier layer between two magnetic layers; depositing a top electrode on the MTJ structure; depositing a sacrificial cap layer onto the top electrode before depositing an amorphous carbon layer onto the top electrode, the sacrificial cap layer comprising silicon carbon; depositing the amorphous carbon layer on the sacrificial cap layer, wherein the sacrificial cap layer is selected to have a chemical structure having substantially no impact on a resolution of a pattern definition with respect to the amorphous carbon layer; depositing a hard mask layer and a photo-resist layer on the amorphous carbon layer, wherein the amorphous carbon layer is located between the sacrificial cap layer and the hard mask layer; patterning and removing the hard mask layer, the photo-resist layer, and the amorphous carbon layer; and depositing a non-magnetic spacer layer over an exposed portion of the sacrificial cap layer, wherein the sacrificial cap layer is comprised of the same material as the non-magnetic spacer layer. - View Dependent Claims (16, 17, 18, 19)
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Specification