Microelectromechanical system with a micro-scale spring suspension system and methods for making the same

• US 9,136,822 B2
• Filed: 08/19/2013
• Issued: 09/15/2015
• Est. Priority Date: 08/19/2013
• Status: Active Grant

• Current Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Rogers, John E.
• Primary Examiner(s): Summons, Barbara
• Application Number:
  US13/970,209
• Publication Number:
  US 20150048903A1
• Time in Patent Office: 757 Days
• Field of Search: 333/186
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0271 Resonators; ultrasonic resonators
• CPC Class Codes: B81B 7/0016 Protection against shocks or vibrations, e.g. vibration damping
• CPC Class Codes: H01G 5/16 using variation of distance between electrodes
• CPC Class Codes: H01G 5/40 Structural combinations of variable capacitors with other electric elements not covered by this subclass, the structure mainly consisting of a capacitor, e.g. RC combinations
• CPC Class Codes: H03H 9/462 Microelectro-mechanical filters
• CPC Class Codes: H03H 9/525 for microelectro-mechanical filters
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

Integrated Microelectromechanical System (“MEMS”) devices and methods for making the same. The MEMS devices comprise a substrate (200) and a MEMS filter device (100) mechanically suspended above a major surface of the substrate. A first gas gap (202) exists between the major surface of the substrate and the MEMS filter device. An isolation platform (600) is provided to absorb vibrations from an external environment prior to reaching the MEMS filter device. In this regard, the isolation platform comprises: a frame structure (610) framing a periphery of the MEMS filter device; and at least one resilient component (612-618) coupled between the frame structure and the MEMS filter device. The frame structure is mechanically connected to the substrate. Electronic circuitry is connected to the MEMS filter device via a resilient interconnection (204, 206) that is movable in at least one direction of the vibrations.

Claims

1. An integrated Microelectromechanical System (“

MEMS”

) device, comprising;

a substrate;

a MEMS filter device mechanically suspended above a major surface of the substrate;

a first gas gap between the major surface of the substrate and the MEMS filter device; and

an isolation platform mechanically connected to the substrate and comprising a frame structure framing a periphery of the MEMS filter device and at least one first resilient component coupled between the frame structure and the MEMS filter device, where the isolation platform absorbs vibrations from an environment prior to reaching the MEMS filter device.

2. The integrated MEMS device according to claim 1, further comprising at least one external system connected to the MEMS filter device via a resilient interconnection that is movable in at least one direction of the vibrations.

3. The integrated MEMS device according to claim 1, wherein the isolation platform is electrically coupled to ground.

4. The integrated MEMS device according to claim 1, wherein the MEMS filter device comprises a transition portion having a first portion passing through at least one aperture formed through the frame structure of the isolation platform.

5. The integrated MEMS device according to claim 4, further comprising a second gas gap between the first portion of the transition portion and the sidewalls of the aperture formed through the frame structure.

6. The integrated MEMS device according to claim 1, further comprising:

a transition portion coupled to and at least partially extending transversely away from a major surface of the substrate;

at least one second resilient component electrically connecting the transition portion to the MEMS filter device;

wherein the MEMS filter device is mechanically suspended above said major surface of the substrate by the isolation platform and the second resilient component.

7. The integrated MEMS device according to claim 6, wherein the transition portion electrically couples the MEMS filter device to electronic circuitry external thereto.

8. The integrated MEMS device according to claim 1, wherein electronic circuitry is formed on the major surface of the substrate so as to reside between the substrate and the MEMS filter device, wherein a gas gap exists between the electronic circuitry and the MEMS filter device.

9. The integrated MEMS device according to claim 8, wherein a first conductive material used to fabricate at least one of the MEMS filter device and the isolation platform has a first melting point that is different from second melting points of all second conductive material used to form the electronic circuit by no more than 100°

C.

10. The integrated MEMS device according to claim 8, wherein the MEMS filter device comprises at least two adjacent electronic elements which are electrically isolated from each other via a ground structure of a transition portion.

11. The integrated MEMS device according to claim 1, further comprising a transition portion comprising a three dimensional hollow ground structure in which an elongate center conductor is suspended.

12. A method for making an integrated Microelectromechanical System (“

MEMS”

) device, comprising;

mechanically suspending a MEMS filter device above a major surface of a substrate;

framing a periphery of the MEMS filter device with a frame structure of an isolation platform that is mechanically coupled to the substrate;

coupling at least one resilient component between the frame structure and the MEMS filter device; and

absorbing, by the resilient component, vibrations from an external environment prior to reaching the MEMS filter device.

13. The method according to claim 12, further comprising coupling electronic circuitry to the MEMS filter device via a resilient interconnection that is movable in at least one direction of the vibrations.

14. The method according to claim 12, further comprising electrically coupling the resilient component to ground.

15. The method according to claim 12, further comprising:

forming at least one aperture through the frame structure; and

disposing a first portion of a transition portion through the aperture.

16. The method according to claim 15, further comprising forming a gas gap between the first portion of the transition portion and the sidewalls of the aperture.

17. The method according to claim 12, further comprising:

forming a transition portion on the substrate such that the transition portion at least partially extends transversely away from a major surface of the substrate;

electrically connecting the transition portion to the MEMS filter device using at least one second resilient component;

wherein the MEMS filter device is mechanically suspended above said major surface of the substrate by the isolation platform and the second resilient component.

18. The method according to claim 12, further comprising forming electronic circuitry on a major surface of the substrate so as to reside between the substrate and the MEMS filter device, wherein a gas gap exists between the electronic circuitry and the MEMS filter device.

19. The method according to claim 18, wherein a first conductive material used to fabricate at least one of the MEMS filter device, the frame structure and the resilient component has a first melting point that is different from second melting points of all second conductive material used to form the electronic circuit by no more than 100°

C.

20. The method according to claim 12, further comprising forming a transition portion comprising a three dimensional hollow ground structure in which an elongate center conductor is suspended.

21. The method according to claim 12, further comprising electrically isolating at least two adjacent electronic components of the MEMS filter device from each other using a ground structure of a transition portion.