Electric power conversion apparatus
First Claim
1. A power semiconductor module, comprising:
- a plurality of power semiconductor elements that constitute an upper arm circuit and a lower arm circuit;
a conducting plate that is continuous with a terminal for supplying direct current power to the power semiconductor elements; and
a mold resin that seals part of the conducting plate, wherein;
the terminal includes a semiconductor module positive terminal and a semiconductor module negative terminal, and the conduction plate includes a positive conduction plate and a negative conducting plate;
each of the positive conducting plate and the negative conducting plate includes a main surface that is wider than other surfaces of the conducting plate and a side surface that is narrower than the main surface;
the conducting plate comprises a non-facing portion and a facing portion, in the non-facing portion the side surface of the positive conducting plate and the side surface of the negative conducting plate are formed so as not to face to one another, and in the facing portion the side surface of the positive conducting plate and the side surface of the negative conducting plate are formed so as to face to one another by bending the conducting plate;
the positive conducting plate and the negative conducting plate that form the facing portion are disposed outside the mold resin;
a terminal insulation unit is disposed between the positive conducting plate and the negative conducting plate that form the facing portion;
the semiconductor module positive terminal is formed at an end of the positive conduction plate in the facing portion; and
the semiconductor module negative terminal is formed at an end of the negative conducting plate in the facing portion.
2 Assignments
0 Petitions
Accused Products
Abstract
An electric power conversion apparatus includes a channel case in which a cooling water channel is formed; a double side cooling semiconductor module that has an upper and lower arms series circuit of an inverter circuit; a capacitor module; a direct current connector; and an alternate current connector. The semiconductor module includes first and second heat dissipation metals whose outer surfaces are heat dissipation surfaces, the upper and lower arms series circuit is disposed tightly between the first heat dissipation metal and the second heat dissipation metal, and the semiconductor module further includes a direct current positive terminal, a direct current negative terminal, and an alternate current terminal which protrude to outside. The channel case is provided with the cooling water channel which extends from a cooling water inlet to a cooling water outlet, and a first opening which opens into the cooling water channel.
54 Citations
7 Claims
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1. A power semiconductor module, comprising:
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a plurality of power semiconductor elements that constitute an upper arm circuit and a lower arm circuit; a conducting plate that is continuous with a terminal for supplying direct current power to the power semiconductor elements; and a mold resin that seals part of the conducting plate, wherein; the terminal includes a semiconductor module positive terminal and a semiconductor module negative terminal, and the conduction plate includes a positive conduction plate and a negative conducting plate; each of the positive conducting plate and the negative conducting plate includes a main surface that is wider than other surfaces of the conducting plate and a side surface that is narrower than the main surface; the conducting plate comprises a non-facing portion and a facing portion, in the non-facing portion the side surface of the positive conducting plate and the side surface of the negative conducting plate are formed so as not to face to one another, and in the facing portion the side surface of the positive conducting plate and the side surface of the negative conducting plate are formed so as to face to one another by bending the conducting plate; the positive conducting plate and the negative conducting plate that form the facing portion are disposed outside the mold resin; a terminal insulation unit is disposed between the positive conducting plate and the negative conducting plate that form the facing portion; the semiconductor module positive terminal is formed at an end of the positive conduction plate in the facing portion; and the semiconductor module negative terminal is formed at an end of the negative conducting plate in the facing portion. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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Specification