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Integrated circuit module with lead frame micro-needles

  • US 9,138,191 B1
  • Filed: 07/09/2014
  • Issued: 09/22/2015
  • Est. Priority Date: 07/09/2014
  • Status: Expired due to Fees
First Claim
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1. An integrated circuit (IC) module with lead frame micro-needle for a medical device, comprising:

  • a lead frame core including an attachment surface and a micro-needle integrally formed therein, the micro-needle extending beyond a lower planar surface of the lead frame core;

    an IC component conductively bonded to the attachment surface; and

    a packaging encapsulating the IC component and at least an upper portion of the lead frame core, wherein the micro-needle projects outside of the packaging.

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