Integrated circuit module with lead frame micro-needles

• US 9,138,191 B1
• Filed: 07/09/2014
• Issued: 09/22/2015
• Est. Priority Date: 07/09/2014
• Status: Expired due to Fees

• Current Assignee: Philips Healthcare Informatics Incorporated (Koninklijke Philips N.V.)
• Original Assignee: Qualcomm, Inc.
• Inventors: Kaskoun, Kenneth, Zhang, Rongtian, Nowak, Matthew Michael, Gu, Shiqun
• Primary Examiner(s): Parekh, Nitin
• Application Number:
  US14/326,842
• Time in Patent Office: 440 Days
• Field of Search: 257/666, 257/697, 257/787, 257/E23.031
• US Class Current: 1/1
• CPC Class Codes: A61B 2562/12 Manufacturing methods specially adapted for producing sensors for in-vivo measurements
• CPC Class Codes: A61B 5/24 Detecting, measuring or recording bioelectric or biomagnetic signals of the body or parts thereof
• CPC Class Codes: A61B 5/685 Microneedles
• CPC Class Codes: A61M 2037/0023 Drug applicators using microneedles
• CPC Class Codes: A61M 2037/0053 Methods for producing microneedles
• CPC Class Codes: A61M 37/0015 by using microneedles
• CPC Class Codes: H01L 21/306 Chemical or electrical treatment, e.g. electrolytic etching to form insulating layers H01L21/31
• CPC Class Codes: H01L 21/4842 Mechanical treatment, e.g. punching, cutting, deforming, cold welding
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/49541 Geometry of the lead-frame
• CPC Class Codes: H01L 23/49548 Cross section geometry H01L23/49562 takes precedence

Abstract

An integrated circuit (IC) module with a lead frame micro-needle for a medical device, and methods of forming the IC module are described. The methods include forming a lead frame blank including a micro-needle integrally formed therein. The micro-needle may be bent beyond an initial lower side of the lead frame blank. The initial lower side may be joined with a protection layer such that the bent micro-needle is embedded in the protection layer, which may be removably attached to the initial lower side and the bent micro-needle. An IC component may be affixed to an upper side of the lead frame blank. The IC component and an upper surface of a core of the lead frame blank may be encapsulated with a molding compound forming a packaging of the IC module. Removal of the protection layer may expose the bent micro-needle projecting away from the packaging.

Claims

1. An integrated circuit (IC) module with lead frame micro-needle for a medical device, comprising:

a lead frame core including an attachment surface and a micro-needle integrally formed therein, the micro-needle extending beyond a lower planar surface of the lead frame core;

an IC component conductively bonded to the attachment surface; and

a packaging encapsulating the IC component and at least an upper portion of the lead frame core, wherein the micro-needle projects outside of the packaging.

2. The IC module of claim 1, further comprising:

a protection layer removably attached to the lower planar surface of the lead frame core, wherein at least a tip of the micro-needle is embedded in the protection layer.

3. The IC module of claim 2, wherein removal of the protection layer exposes the micro-needle projecting away from the packaging.

4. The IC module of claim 2, wherein at least the tip of the micro-needle is kept sterile by the protection layer.

5. The IC module of claim 1, wherein the micro-needle is formed as a continuous extension of a material forming the lead frame core.

6. The IC module of claim 1, wherein the micro-needle comprises two opposed micro-needles extending away from the packaging.

7. The IC module of claim 1, further comprising:

a protection layer removably attached to the lower planar surface of the lead frame core; and

a substrate secured to the protection layer, wherein a first adhesion strength between the protection layer and the substrate is stronger than a second adhesion strength between the protection layer and the lead frame core.

8. The IC module of claim 7, wherein the substrate is configured so that when the substrate is pulled off the packaging, the protection layer remains attached to the substrate.

9. The IC module of claim 1, further comprising:

a protection layer removably attached to the lower planar surface of the lead frame core, wherein the protection layer is doped with a conductive additive; and

a circuit coupled to the conductive additive and configured to activate the IC component when the protection layer with the conductive additive is removed from the lower planar surface of the lead frame core.

10. The IC module of claim 1, further comprising a sensor coupled to the micro-needle and configured to sense a parameter when the micro-needle contacts skin of a patient.