Apparatus for manufacturing semiconductor devices

• US 9,138,980 B2
• Filed: 09/21/2012
• Issued: 09/22/2015
• Est. Priority Date: 06/22/2010
• Status: Active Grant

• Current Assignee: Sony Semiconductor Solutions Corporation (Sony Group Corp.)
• Original Assignee: Soitec S.A.
• Inventors: Broekaart, Marcel, Radu, Ionut
• Primary Examiner(s): SCHATZ, CHRISTOPHER T
• Application Number:
  US13/624,470
• Publication Number:
  US 20130032272A1
• Time in Patent Office: 1,096 Days
• Field of Search: 156/285, 156/286, 156/381, 156/382
• US Class Current: 1/1
• CPC Class Codes: B32B 2309/64 Sterile
• CPC Class Codes: B32B 2309/65 Dust free, e.g. clean room
• CPC Class Codes: B32B 2309/68 Vacuum
• CPC Class Codes: B32B 38/1858 using vacuum
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

The present invention relates to an apparatus for the manufacture of semiconductor devices wherein the apparatus includes a bonding module that has a vacuum chamber to provide bonding of wafers under pressure below atmospheric pressure; and a loadlock module connected to the bonding module and configured for wafer transfer to the bonding module. The loadlock module is also connected to a first vacuum pumping device configured to reduce the pressure in the loadlock module to below atmospheric pressure. The bonding and loadlock modules remain at a pressure below atmospheric pressure while the wafer is transferred from the loadlock module into the bonding module.

Claims

1. An apparatus for the molecular bonding of semiconductor devices, the apparatus comprising:

a bonding module comprising a vacuum chamber to provide bonding of a first wafer and a second wafer under a pressure below atmospheric pressure, and at least a first bonding chuck and a second bonding chuck configured to hold the first wafer and the second wafer, respectively, with the main surfaces of the first and second wafers arranged face-to-face in vertical orientation with respect to a horizontal plane whereupon the bonding module is located, wherein the first bonding chuck is separate from the second bonding chuck;

a loadlock module connected to the bonding module and configured and dimensioned for wafer transfer to the bonding module and also connected to a first vacuum pumping device configured to reduce the pressure in the loadlock module to below atmospheric pressure, wherein the loadlock module comprises a first gate that can be opened and closed for receipt of the first and second wafers from an external environment and a second gate that can be opened and closed for transfer of the first and second wafers from the loadlock module to the bonding module; and

a control unit configured to control the first and the second bonding chucks to move towards each other to locate the first and the second wafers at a predetermined distance from each other, such that the first and the second wafers locally become sufficiently close to each other that molecular bonding is initiated between the first wafer and the second wafer, and to release the first and second wafers at the predetermined distance, and

wherein the bonding and loadlock modules remain at a pressure below atmospheric pressure while at least one of the first wafer and the second wafer is transferred from the loadlock module into the bonding module through the second gate.

2. The apparatus according to claim 1, further comprising a second vacuum pumping device connected via a control valve to the vacuum chamber of the bonding module and configured to reduce the pressure in the vacuum chamber of the bonding module to below atmospheric pressure.

3. The apparatus according to claim 1, wherein the loadlock module comprises a multi wafer storage system for storing multiple wafers to be transferred to the bonding module.

4. The apparatus according claim 1, further comprising at least one additional loadlock module connected to the bonding module and configured and dimensioned to receive the bonded first and second wafers from the bonding module.

5. The apparatus according to claim 1, wherein the first and second bonding chucks are configured to initially hold the first and the second wafers in a parallel alignment.

6. The apparatus according to claim 1, wherein at least one of the first bonding chuck and the second bonding chuck is made of metal or ceramics that resists bending and bowing.

7. The apparatus according to claim 1, wherein the first bonding chuck and second bonding chuck are configured and dimensioned to hold first and second wafers that are at least 300 mm in diameter.

8. The apparatus according to claim 1, wherein the control unit is configured to initiate local application of a force to at least one of the first and the second wafers.

9. The apparatus according to claim 1, wherein the control unit is further configured to release the first and second wafers by decreasing the clamping force applied by the first and/or second bonding chucks in order to allow initiation of the bonding.

10. The apparatus according to claim 9, wherein the control unit is configured to control gradual or non-gradual release of the first and/or second wafer.

11. A manufacturing system comprising the apparatus of claim 1, further comprising:

a load port module configured and dimensioned to introduce the first wafer and the second wafer into the manufacturing system;

a plasma module configured to perform a plasma treatment of a surface of at least one of the first wafer and the second wafer introduced in the manufacturing system;

a cleaning module configured to clean the surface of at least one of the first wafer and the second wafer; and

a moveable robot device configured and dimensioned to transport at least one of the first wafer and the second wafer from one of either the load port module, plasma module, cleaning module, and loadlock module to any other one of these modules.