Micro electro mechanical system structures

• US 9,139,423 B2
• Filed: 01/19/2012
• Issued: 09/22/2015
• Est. Priority Date: 01/19/2012
• Status: Active Grant

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chien, Ting-Ying, Chiu, Yi Hsun, Su, Ching-Hou, Ni, Chyi-Tsong
• Primary Examiner(s): Schoenholtz, Joseph
• Application Number:
  US13/353,765
• Publication Number:
  US 20130187245A1
• Time in Patent Office: 1,342 Days
• Field of Search: None
• US Class Current: 1/1
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/019 characterised by the material or arrangement of seals between parts
• CPC Class Codes: H01L 2224/83805 involving forming a eutectic alloy at the bonding interface
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Abstract

A micro electro mechanical system (MEMS) structure includes a first substrate structure including a bonding pad structure. The bonding pad structure has at least one recess therein. A second substrate structure is bonded with the bonding pad structure of the first substrate structure.

Claims

1. A micro electro mechanical system (MEMS) structure comprising:

a first substrate structure including a bonding pad structure, the bonding pad structure having at least one recess therein, wherein a width of the at least one recess is 10 microns (μ

m) or less; and

a second substrate structure bonded with the bonding pad structure of the first substrate structure, wherein the second substrate structure comprises a second substrate and a second bonding pad structure, the second bonding pad structure extending into a substrate recess in a first substrate of the first substrate structure, and the second bonding pad structure includes a bonding pad recess located at least partially within the substrate recess.

2. The MEMS structure of claim 1, wherein the at least one recess has a first slot continuously extending in the first bonding pad structure, such that the bonding pad structure of the first substrate structure includes a first bond pad ring and a second bond pad ring that are separated from each other by the first slot and disposed around a MEMS device.

3. The MEMS structure of claim 2, wherein the at least one recess is a plurality of recesses defining a second slot continuously extending in the bonding pad structure, such that the bonding pad structure includes a third bond pad ring that is separated from the second bond pad ring by the second slot and disposed around the MEMS device.

4. The MEMS structure of claim 1, wherein the bonding pad structure of the first substrate structure includes a bonding material that continuously extends along walls of the at least one recess.

5. The MEMS structure of claim 1, wherein the second bonding pad structure is eutectically bonded with the bonding pad structure of the first substrate structure.

6. The MEMS structure of claim 5, wherein a surface of the second substrate structure is substantially level with an interface between the bonding pad structure of the first substrate structure and the second bonding pad structure.

7. The MEMS structure of claim 5, wherein a first portion of a surface of the second substrate corresponding to the bonding pad recess is farther from a closest surface of first substrate structure than a second portion of the surface of the second substrate.

8. The MEMS structure of claim 5, wherein the second substrate structure includes a first bond pad ring and a second bond pad ring that are separated from each other by the bonding pad recess, and the first bond pad ring and the second bond pad ring extend into the substrate recess.

9. The MEMS structure of claim 5, wherein a width of the bonding pad structure of the first substrate structure in the substrate recess is greater than a width of the second bonding pad structure that is bonded thereto.

10. A micro electro mechanical system (MEMS) structure comprising:

a device substrate having a MEMS device, the device substrate includes a first bond pad ring and a second bond pad ring disposed around the MEMS device; and

a handle substrate including a bonding pad structure, wherein the bonding pad structure is bonded with the first bond pad ring, and the second bond pad ring is located at least partially within a substrate recess of the device substrate.

11. The MEMS structure of claim 10, wherein the first bond pad ring is separated from the second bond pad ring.

12. The MEMS structure of claim 10, wherein the device substrate further includes a third bond pad ring that is disposed around the MEMS device and separated from the first bond pad ring and the second bond pad ring.

13. The MEMS structure of claim 10, wherein a width of the first bond pad ring is 30 microns (μ

m) or less.

14. The MEMS structure of claim 10, wherein a distance between the second bond pad ring and the first bond pad ring is 10 μ

m or less.

15. The MEMS structure of claim 10 further comprising:

a bonding material that continuously extends from the first bond pad ring to the second bond pad ring.

16. The MEMS structure of claim 10, wherein the bonding pad structure has at least one recess therein, the at least one recess being partially located in the substrate recess, and the at least one recess continuously extends in the bonding pad structure, such that the bonding pad structure includes a first bond pad ring and a second bond pad ring that are separated from each other by the at least one recess.

17. The MEMS structure of claim 10, wherein surface areas of the first and second bond pad rings in the substrate recess are smaller than a surface area of the bonding pad structure that is bonded thereto.

18. A micro electro mechanical system (MEMS) structure comprising:

a device substrate having a MEMS device, the device substrate includes a first bond pad ring and a second bond pad ring disposed around the MEMS device, wherein the first bond pad ring and the second bond pad ring each include at least one metallic material; and

a handle substrate having a first handle bond pad ring and a second handle bond pad ring, wherein the first handle bond pad ring and the second handle bond pad ring extend into a substrate recess of the device substrate, the first handle bond pad ring is bonded with the first bond pad ring in the substrate recess and the second handle bond pad ring is bonded with the second bond pad ring in the substrate recess, and the handle substrate includes at least one semiconductor-containing material.

19. The MEMS structure of claim 18, wherein the device substrate further includes a third bond pad ring that is disposed around the MEMS device and separated from the first bond pad ring and the second bond pad ring.

20. The MEMS structure of claim 18, wherein a width of the first bond pad ring is 30 microns (μ

m) or less.