Packages and methods for packaging
First Claim
1. A packaged integrated device comprising:
- a package substrate;
a package lid attached to a top surface of the package substrate with an adhesive, the package lid and the package substrate defining a package interior, the package lid including a lip extending from a perimeter of the package lid;
a three-dimensional locking feature formed in the top surface of the package substrate to enhance the attachment of the package lid to the package substrate, the lip of the package lid coupled with the three-dimensional locking feature such that at least a portion of the adhesive is disposed between the lip and the locking feature, the three-dimensional locking feature comprising a pattern of conductive regions and nonconductive regions that are alternately exposed to the adhesive, the pattern of conductive regions and nonconductive regions disposed along and generally aligned with the lip of the package lid; and
an integrated device die mounted within the package interior.
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Accused Products
Abstract
Packaged integrated devices and methods of forming the same are provided. In one embodiment, a packaged integrated device includes a package substrate, a package lid, and an integrated circuit or microelectromechanical systems (MEMS) device. The package lid is mounted to a first surface of the package substrate using an epoxy, and the package lid and the package substrate define a package interior. The package lid includes an interior coating suited to good adhesion with the epoxy, and an exterior coating suited to RF shielding, where the materials of the interior and exterior coatings are different. In one example, the interior lid coating is nickel whereas the exterior lid coating is tin.
26 Citations
20 Claims
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1. A packaged integrated device comprising:
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a package substrate; a package lid attached to a top surface of the package substrate with an adhesive, the package lid and the package substrate defining a package interior, the package lid including a lip extending from a perimeter of the package lid; a three-dimensional locking feature formed in the top surface of the package substrate to enhance the attachment of the package lid to the package substrate, the lip of the package lid coupled with the three-dimensional locking feature such that at least a portion of the adhesive is disposed between the lip and the locking feature, the three-dimensional locking feature comprising a pattern of conductive regions and nonconductive regions that are alternately exposed to the adhesive, the pattern of conductive regions and nonconductive regions disposed along and generally aligned with the lip of the package lid; and an integrated device die mounted within the package interior. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A packaged integrated device comprising:
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a package substrate; a package lid attached to a top surface of the package substrate with an adhesive, the package lid and the package substrate defining a package interior, the package lid including a lip extending from a perimeter of the package lid; a three-dimensional locking feature formed in the top surface of the package substrate to enhance the attachment of the package lid to the package substrate, the lip of the package lid coupled with the three-dimensional locking feature such that at least a portion of the adhesive is disposed between the lip and the locking feature; and an integrated device die mounted within the package interior, wherein the package lid includes a first conductive layer, a second conductive layer and a core disposed between the first and second conductive layers, wherein the first conductive layer defines a first surface of the package lid facing the package interior, and wherein the second conductive layer defines a second surface of the package lid opposite the first surface, and wherein a portion of the first conductive layer contacts the adhesive. - View Dependent Claims (12, 13, 14, 15, 16, 17)
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18. A packaged integrated device comprising:
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a package substrate comprising a nonconductive layer and a conductive layer, the package substrate comprising a pattern in which the nonconductive layer and the conductive layer are alternately exposed to an adhesive at a top surface of the package substrate; a package lid attached to the top surface of the package substrate with the adhesive, the package lid and the package substrate defining a package interior, the package lid including a lip extending from a perimeter of the package lid, the lip attached with the adhesive to the alternately exposed nonconductive and conductive layers at the top surface of the package substrate, the pattern of the alternately-exposed nonconductive and conductive layers disposed along and generally aligned with the lip of the package lid; and an integrated device die mounted within the package interior. - View Dependent Claims (19)
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20. A packaged integrated device comprising:
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a package substrate comprising a nonconductive layer and a conductive layer, the package substrate patterned such that the nonconductive layer and the conductive layer are alternately exposed at a top surface of the package substrate; a package lid attached to the top surface of the package substrate with an adhesive, the package lid and the package substrate defining a package interior, the package lid including a lip extending from a perimeter of the package lid, the lip attached with the adhesive to the alternately exposed nonconductive and conductive layers at the top surface of the package substrate; and an integrated device die mounted within the package interior, wherein the package lid includes a first conductive layer, a second conductive layer and a core disposed between the first and second conductive layers, wherein the first conductive layer defines a first surface of the package lid facing the package interior, and wherein the second conductive layer defines a second surface of the package lid opposite the first surface, and wherein a portion of the first conductive layer contacts the adhesive.
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Specification