Magnetic contacts
First Claim
1. An apparatus comprising:
- a first integrated circuit (IC) substrate having a first electrical routing feature and a first magnet coupled with the first electrical routing feature, wherein the first magnet is disposed within the first electrical routing feature;
a second integrated circuit (IC) substrate having a second electrical routing feature and a second magnet coupled with the second electrical routing feature; and
an interconnect structure coupled with the first and second electrical routing features, the interconnect structure comprising a plurality of magnetic particles, wherein the first magnet and the second magnet are configured to generate a magnetic field between the first magnet and the second magnet and wherein the magnetic particles are electrically conductive and disposed in the magnetic field.
1 Assignment
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Accused Products
Abstract
Embodiments of the present disclosure are directed to integrated circuit (IC) package assemblies with magnetic contacts, as well as corresponding fabrication methods and systems incorporating such magnetic contacts. A first IC substrate may have a first magnet coupled with a first electrical routing feature. A second IC substrate may have a second magnet coupled with a second electrical routing feature. The magnets may be embedded in the IC substrates and/or electrical routing features. The magnets may generate a magnetic field that extends across a gap between the first and second electrical routing features. Electrically conductive magnetic particles may be applied to one or both of the IC substrates to form a magnetic interconnect structure that extends across the gap. In some embodiments, magnetic contacts may be demagnetized by heating the magnets to a corresponding partial demagnetization temperature (PDT) or Curie temperature. Other embodiments may be described and/or claimed.
47 Citations
24 Claims
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1. An apparatus comprising:
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a first integrated circuit (IC) substrate having a first electrical routing feature and a first magnet coupled with the first electrical routing feature, wherein the first magnet is disposed within the first electrical routing feature; a second integrated circuit (IC) substrate having a second electrical routing feature and a second magnet coupled with the second electrical routing feature; and an interconnect structure coupled with the first and second electrical routing features, the interconnect structure comprising a plurality of magnetic particles, wherein the first magnet and the second magnet are configured to generate a magnetic field between the first magnet and the second magnet and wherein the magnetic particles are electrically conductive and disposed in the magnetic field. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A system comprising:
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a circuit board; and a package assembly coupled with the circuit board, the package assembly including a first integrated circuit substrate having a first electrical routing feature and a first magnet coupled with the first electrical routing feature, a second integrated circuit substrate having a second electrical routing feature and a second magnet coupled with the second electrical routing feature, and an interconnect structure coupled with the first and second electrical routing features, the interconnect structure comprising a plurality of magnetic particles, wherein the magnetic particles are electrically conductive and wherein the first magnet is disposed within the first electrical routing feature. - View Dependent Claims (18, 19, 20)
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21. An apparatus comprising:
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a first integrated circuit (IC) substrate having a first electrical routing feature and a first magnet coupled with the first electrical routing feature, wherein the first magnet is embedded in the first integrated circuit substrate; a second integrated circuit (IC) substrate having a second electrical routing feature and a second magnet coupled with the second electrical routing feature; and an interconnect structure coupled with the first and second electrical routing features, the interconnect structure comprising a plurality of magnetic particles, wherein the first magnet and the second magnet are configured to generate a magnetic field between the first magnet and the second magnet and wherein the magnetic particles are electrically conductive and disposed in the magnetic field. - View Dependent Claims (22)
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23. An apparatus comprising:
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a first integrated circuit (IC) substrate having a plurality of first electrical routing features and a plurality of first magnets coupled with corresponding ones of the plurality of first electrical routing features; a second integrated circuit (IC) substrate having a second plurality of electrical routing features and a plurality of second magnets coupled with corresponding ones of the plurality of second electrical routing features; and interconnect structures coupled with the plurality of first and second electrical routing features, the interconnect structures comprising a plurality of magnetic particles, wherein the first magnets and the second magnets are configured to generate a magnetic field between the first magnets and the second magnets, wherein the magnetic particles are electrically conductive and disposed in the magnetic field, and wherein the first magnets are arranged to form a checkerboard pole orientation pattern or an alternating row pole orientation pattern. - View Dependent Claims (24)
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Specification