Contactless object with integrated circuit connected to circuit terminals by capacitive coupling
First Claim
1. A contactless portable object comprising:
- terminals of an antenna circuit borne by a substrate, andan integrated circuit block comprising;
an uppermost metal layer defining an active face of the integrated circuit block,a first dielectric layer covering only the uppermost metal layer of the integrated circuit block, forming a passivation layer,circuit portions located in inner layers below a bottom surface of said passivation layer,a first and a second contact pads of the active face of the integrated circuit block, said first and second contact pads being flush with openings of said passivation layer,first vias connecting electrically said first and second contact pads to said circuit portions, andonly two connection plates connected to said terminals of the antenna circuit by capacitive coupling, wherein the first and second connection plates are positioned only above a top surface of the passivation layer, and wherein a surface area of each of said connection plates is substantially greater than a surface area of each of the contact pads, andsecond vias connecting electrically said first and second connection plates to said first and second contact pads, respectively.
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Accused Products
Abstract
The invention relates to integrated circuits (1) that comprise, on the active surface thereof, a first dielectric layer defining a passivation layer (6) and contact pads (5) flush through openings (7) in said passivation layer, wherein said integrated circuits are to be incorporated in contactless portable objects (10) for connection by capacitive coupling to the terminals (13) of an antenna-forming circuit (11) mounted on a substrate (12) of said object. The invention also relates to contactless portable objects including such circuits. The invention is characterized in that the capacitive coupling is carried out using connection plates (8) of the integrated circuits, positioned at the surface of the passivation layer and electrically connected to the contact pads. The invention can particularly be used in UHF RFID objects.
48 Citations
20 Claims
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1. A contactless portable object comprising:
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terminals of an antenna circuit borne by a substrate, and an integrated circuit block comprising; an uppermost metal layer defining an active face of the integrated circuit block, a first dielectric layer covering only the uppermost metal layer of the integrated circuit block, forming a passivation layer, circuit portions located in inner layers below a bottom surface of said passivation layer, a first and a second contact pads of the active face of the integrated circuit block, said first and second contact pads being flush with openings of said passivation layer, first vias connecting electrically said first and second contact pads to said circuit portions, and only two connection plates connected to said terminals of the antenna circuit by capacitive coupling, wherein the first and second connection plates are positioned only above a top surface of the passivation layer, and wherein a surface area of each of said connection plates is substantially greater than a surface area of each of the contact pads, and second vias connecting electrically said first and second connection plates to said first and second contact pads, respectively. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A process for producing contactless portable objects, comprising:
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providing integrated circuit blocks having inner layers equipped with circuit portions below a bottom surface of a passivation layer covering only an uppermost metal layer of the integrated circuit block, said passivation layer being equipped with openings with which contact pads of the uppermost metal layer of the integrated circuit blocks are flush, said contact pads being electrically connected to said circuit portions by first vias; on each of the integrated circuit blocks, positioning only two connection plates, each of the connection plates having a surface area substantially greater than a surface area of each of the contact pads, only above a top surface of the passivation layer, so that said plates are electrically connected to the contact pads by second vias; and positioning the integrated circuit blocks on substrates bearing antenna circuits so that the connection plates are arranged opposite terminals of said antenna circuits. - View Dependent Claims (16, 17)
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18. A process for producing contactless portable objects, comprising:
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providing an integrated circuit block comprising; an uppermost metal layer defining an active face of the integrated circuit block, a first dielectric layer covering only the uppermost metal layer of the integrated circuit block, forming a passivation layer, circuit portions located in inner layers below a bottom surface of said passivation layer, a first and a second contact pads of the active face of the integrated circuit block, said first and second contact pads being flush with openings of said passivation layer, first vias connecting electrically said first and second contact pads to said circuit portions, and only two connection plates for connection to terminals of an antenna circuit by capacitive coupling, wherein said first and second connection plates are positioned only above a top surface of the passivation layer, and wherein a surface area of each of said connection plates is substantially greater than a surface area of each of the contact pads, and second vias connecting electrically said first and second connection plates to said first and second contact pads, respectively; and positioning the integrated circuit block on a substrate bearing the antenna circuit so that the connection plates are arranged opposite the terminals of said antenna circuit. - View Dependent Claims (19, 20)
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Specification