Sensor package with exposed sensor array and method of making same
First Claim
1. A packaged sensor assembly, comprising:
- a first substrate that comprises opposing front and back surfaces;
one or more detectors formed on or in the front surface;
a plurality of contact pads formed at the front surface which are electrically coupled to the one or more detectors;
a second substrate mounted to the front surface to define a cavity between the second substrate and the front surface, wherein the second substrate includes a first opening extending from the cavity through the second substrate;
a trench formed into the front surface of the first substrate extending toward but not reaching the back surface; and
a plurality of conductive traces each extending from one of the contact pads and into the trench;
an insulation material covering upper surfaces of the plurality of conductive traces except for contact portions of the upper surfaces of the conductive traces in the trench;
a third substrate having one or more circuit layers and a plurality of contact pads electrically coupled to the one or more circuit layers;
electrical connectors each electrically connecting one of the contact portions of one of the conductive traces and one of the contact pads of the third substrate.
1 Assignment
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Accused Products
Abstract
A packaged sensor assembly and method of forming that includes a first substrate having opposing first and second surfaces and a plurality of conductive elements each extending between the first and second surfaces. A second substrate comprises opposing front and back surfaces, one or more detectors formed on or in the front surface, and a plurality of contact pads formed at the front surface which are electrically coupled to the one or more detectors. A third substrate is mounted to the front surface to define a cavity between the third substrate and the front surface, wherein the third substrate includes a first opening extending from the cavity through the third substrate. The back surface is mounted to the first surface. A plurality of wires each extend between and electrically connecting one of the contact pads and one of the conductive elements.
80 Citations
18 Claims
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1. A packaged sensor assembly, comprising:
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a first substrate that comprises opposing front and back surfaces; one or more detectors formed on or in the front surface; a plurality of contact pads formed at the front surface which are electrically coupled to the one or more detectors; a second substrate mounted to the front surface to define a cavity between the second substrate and the front surface, wherein the second substrate includes a first opening extending from the cavity through the second substrate; a trench formed into the front surface of the first substrate extending toward but not reaching the back surface; and a plurality of conductive traces each extending from one of the contact pads and into the trench; an insulation material covering upper surfaces of the plurality of conductive traces except for contact portions of the upper surfaces of the conductive traces in the trench; a third substrate having one or more circuit layers and a plurality of contact pads electrically coupled to the one or more circuit layers; electrical connectors each electrically connecting one of the contact portions of one of the conductive traces and one of the contact pads of the third substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of forming a packaged sensor assembly, comprising:
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providing a first substrate that comprises; opposing front and back surfaces, one or more detectors formed on or in the front surface, and a plurality of contact pads formed at the front surface which are electrically coupled to the one or more detectors; mounting a second substrate to the front surface to define a cavity between the second substrate and the front surface, wherein the second substrate includes a first opening extending from the cavity through the second substrate; forming a trench into the front surface of the first substrate extending toward but not reaching the back surface; and forming a plurality of conductive traces each extending from one of the contact pads and into the trench; an insulation material covering upper surfaces of the plurality of conductive traces except for contact portions of the upper surfaces of the conductive traces in the trench; providing a third substrate having one or more circuit layers and a plurality of contact pads electrically coupled to the one or more circuit layers; and forming electrical connectors each electrically connecting one of the contact portions of one of the conductive traces and one of the contact pads of the third substrate. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18)
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Specification