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Sensor package with exposed sensor array and method of making same

  • US 9,142,695 B2
  • Filed: 05/30/2014
  • Issued: 09/22/2015
  • Est. Priority Date: 06/03/2013
  • Status: Active Grant
First Claim
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1. A packaged sensor assembly, comprising:

  • a first substrate that comprises opposing front and back surfaces;

    one or more detectors formed on or in the front surface;

    a plurality of contact pads formed at the front surface which are electrically coupled to the one or more detectors;

    a second substrate mounted to the front surface to define a cavity between the second substrate and the front surface, wherein the second substrate includes a first opening extending from the cavity through the second substrate;

    a trench formed into the front surface of the first substrate extending toward but not reaching the back surface; and

    a plurality of conductive traces each extending from one of the contact pads and into the trench;

    an insulation material covering upper surfaces of the plurality of conductive traces except for contact portions of the upper surfaces of the conductive traces in the trench;

    a third substrate having one or more circuit layers and a plurality of contact pads electrically coupled to the one or more circuit layers;

    electrical connectors each electrically connecting one of the contact portions of one of the conductive traces and one of the contact pads of the third substrate.

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