Light emitting diode

• US 9,142,715 B2
• Filed: 05/02/2011
• Issued: 09/22/2015
• Est. Priority Date: 06/24/2010
• Status: Active Grant

• Current Assignee: Seoul Viosys Co., Ltd. (Seoul Semiconductor Co., Ltd.)
• Original Assignee: Seoul Viosys Co., Ltd. (Seoul Semiconductor Co., Ltd.)
• Inventors: Kim, Chang Youn, Lee, Joon Hee, You, Jong Kyun, Lim, Hong Chol, Kim, Hwa Mok
• Primary Examiner(s): GEBREMARIAM, SAMUEL A
• Application Number:
  US13/099,127
• Publication Number:
  US 20110316026A1
• Time in Patent Office: 1,604 Days
• Field of Search: 257 98-100
• US Class Current: 1/1
• CPC Class Codes: H01L 2933/0091 Scattering means in or on the semiconductor body or semiconductor body package H01L33/22 takes precedence
• CPC Class Codes: H01L 33/025 Physical imperfections, e.g. particular concentration or distribution of impurities
• CPC Class Codes: H01L 33/10 with a light reflecting structure, e.g. semiconductor Bragg reflector

Abstract

An exemplary embodiment of the present invention relates to a light emitting diode (LED) including a substrate, a first nitride semiconductor layer arranged on the substrate, an active layer arranged on the first nitride semiconductor layer, a second nitride semiconductor layer arranged on the active layer, a third nitride semiconductor layer disposed between the first nitride semiconductor layer or between the second nitride semiconductor layer and the active layer, the third nitride semiconductor layer comprising a plurality of scatter elements within the third nitride semiconductor layer, and a distributed Bragg reflector (DBR) comprising a multi-layered structure, the substrate being arranged between the DBR and the third nitride semiconductor layer.

Claims

1. A light emitting diode (LED), comprising:

a substrate;

a first nitride semiconductor layer arranged on the substrate;

an active layer arranged on the first nitride semiconductor layer;

a second nitride semiconductor layer arranged on the active layer;

a third nitride semiconductor layer disposed between the first nitride semiconductor layer and the active layer or between the second nitride semiconductor layer and the active layer, the third nitride semiconductor layer comprising a plurality of scatter elements within the third nitride semiconductor layer; and

a distributed Bragg reflector (DBR) comprising a multi-layered structure, the substrate being arranged between the DBR and the third nitride semiconductor layer,

wherein;

the scatter elements comprise air gaps surrounded on four sides by the third nitride semiconductor layer; and

the air gaps are disposed in a range of 100 nm to 1000 nm from the active layer.

2. The LED of claim 1, wherein the interval between the air gaps is in a range of 100 nm to 1000 nm.

3. The LED of claim 1, wherein each of a width and a height of the air gaps is in a range of 50 nm to 1000 nm.

4. The LED of claim 1, wherein the third nitride semiconductor layer is arranged between the first nitride semiconductor layer and the active layer, and the air gaps are arranged in a range of 100 nm to 1000 nm from the active layer.

5. The LED of claim 1, wherein the third nitride semiconductor layer is arranged between the second nitride semiconductor layer and the active layer, and the air gaps are arranged in a range of 50 nm to 500 nm from the active layer.

6. The LED of claim 5, further comprising a clad layer disposed between the air gaps and the active layer.

7. The LED of claim 1, wherein the DBR comprises a reflectance of at least 90% for light of a first wavelength in a blue wavelength region, light of a second wavelength in a green wavelength region, and light of a third wavelength in a red wavelength region.

8. The LED of claim 7, further comprising a reflective metal layer, the DBR being arranged between the substrate and the reflective metal layer.

9. The LED of claim 1, wherein the scatter elements comprise silicon oxide or silicon nitride.

10. The LED of claim 1, wherein the scatter elements comprise a matrix of islands shape, a plurality of lines, or a net-shape.

11. A light emitting diode (LED), comprising:

a semiconductor stack arranged on a support substrate, the semiconductor stack comprising;

a first conductivity-type semiconductor layer;

an active layer; and

a second conductivity-type semiconductor layer;

a first electrode arranged between the support substrate and the semiconductor stack, the first electrode being in ohmic contact with the semiconductor stack, the first electrode comprising a first region exposed to the outside of the semiconductor stack;

a first bonding pad arranged on the first region of the first electrode, the first bonding pad electrically connected to the first electrode; and

a second electrode arranged on the semiconductor stack,

wherein at least one of the first conductivity-type semiconductor layer and the second conductivity-type semiconductor layer comprises a plurality of scatter elements spaced apart from one another,

wherein the scatter elements are entirely enclosed in the first conductivity-type semiconductor layer or the second conductivity-type semiconductor layer, and

wherein the scatter elements comprise an air layer and are arranged in a range of 50 nm to 1000 nm from the active layer.

12. The LED of claim 11, wherein the first electrode comprises a reflective layer and a protection layer, wherein the reflective layer is disposed between the semiconductor stack and the protection layer.

13. The LED of claim 12, wherein the reflective layer is completely covered by the semiconductor stack and the protection layer.

14. The LED of claim 11, wherein a width and a height of each of the scatter elements is in a range of 50 nm to 1000 nm.

15. The LED of claim 11, wherein the interval between the scatter elements is in a range of 100 nm to 1000 nm.

16. The LED of claim 11, wherein the scatter elements comprise a matrix of islands shape, a plurality of lines, or a net-shape.

17. A light emitting diode (LED), comprising:

a substrate;

a first nitride semiconductor layer arranged on the substrate;

an active layer arranged on the first nitride semiconductor layer;

a second nitride semiconductor layer arranged on the active layer;

a third nitride semiconductor layer disposed between the first nitride semiconductor layer and the active layer or between the second nitride semiconductor layer and the active layer, the third nitride semiconductor layer comprising a plurality of scatter elements entirely enclosed within the third nitride semiconductor layer; and

a distributed Bragg reflector (DBR) comprising a multi-layered structure, the substrate being arranged between the DBR and the third nitride semiconductor layer,

wherein;

the scatter elements comprise air gaps surrounded on four sides by the third nitride semiconductor layer; and

the air gaps are disposed in a range of 100 nm to 1000 nm from the active layer.