Packaged LED device with castellations

• US 9,142,745 B2
• Filed: 09/19/2013
• Issued: 09/22/2015
• Est. Priority Date: 08/27/2013
• Status: Expired due to Fees

• Current Assignee: Glo AB (Shoei Electronic Materials, Inc.)
• Original Assignee: Glo AB (Shoei Electronic Materials, Inc.)
• Inventors: Harvey, Douglas, Kaneshiro, Ronald
• Primary Examiner(s): NGUYEN, DUY T V
• Application Number:
  US14/031,829
• Publication Number:
  US 20150060928A1
• Time in Patent Office: 733 Days
• Field of Search: 257/99, 257/666, 257/100
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48257 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Packaged LED devices include a first lead having a first recess in a bottom surface, a second lead having a second recess in a bottom surface, a LED die located over a top surface of at least one of the leads and electrically connected to the leads, and a package located around the LED die, the first lead and the second lead. The package contains an opening in its upper surface exposing at least the LED die. The package also contains a first castellation and a second castellation in a side surface of the package, such that the first castellation exposes at least one of the first lead and a first platable metal which is electrically connected to the first lead, and the second castellation exposes at least one of the second lead and a second platable metal which is electrically connected to the second lead.

Claims

1. A packaged light emitting diode (LED) device, comprising:

a first lead having a first recess in a bottom surface;

a second lead having a second recess in a bottom surface;

a LED die located over a top surface of at least one of the first and the second leads and electrically connected to the first lead and to the second lead; and

a package located around the LED die, the first lead and the second lead, the package comprising an upper surface, a bottom surface, and first, second, third and fourth side surfaces extending between the upper surface and the bottom surface;

wherein;

the package contains an opening in the upper surface exposing at least the LED die; and

the package contains a first castellation and a second castellation in the first side surface of the package;

the first castellation exposes at least one of the first lead and a first platable metal which is electrically connected to the first lead;

the second castellation exposes at least one of the second lead and a second platable metal which is electrically connected to the second lead;

the first recess in the first lead is exposed in the first side surface of the package by the first castellation, and the first recess is exposed in no more than one additional outer surface of the package;

the second recess in the second lead is exposed in the first side surface of the package by the second castellation, and the second recess is exposed in no more than one additional outer surface of the package, and

the first recess and the second recess are exposed in the bottom surface of the package, wherein the bottom surface of the package is different than the first side surface of the package, and the package includes no recesses exposed in both the bottom surface of the package and any of the second, third and fourth side surfaces of the package.

2. The device of claim 1, wherein the first castellation exposes an edge of the first lead and the first platable metal, and the second castellation exposes an edge of the second lead and the second platable metal.

3. The device of claim 1, wherein the LED die is electrically connected to the first lead and to the second lead by a respective first wire and second wire, and the LED die is bonded to the top surface of the at least one of the first and the second leads.

4. The device of claim 3, wherein:

the LED die is bonded only to the top surface of a rear portion of the first lead;

the first recess is located in the bottom surface in a front portion of the first lead which is different from the rear portion of the first lead; and

the second recess is located in the bottom surface in a front portion of the second lead which is wider than rear portion of the second lead.

5. The device of claim 1, wherein the package is located on a support surface in a side emitting configuration such that the side surface of the package faces the support surface.

6. The device of claim 5, wherein:

the support surface comprises a first electrical contact and a second electrical contact;

the first electrical contact electrically contacts the first lead through the first castellation;

the second electrical contact electrically contacts the second lead through the second castellation;

the opening in an upper surface of the package is located in a plane perpendicular to the support surface; and

a light emitting surface of the LED die is positioned in the package to emit light parallel to the support surface.

7. The device of claim 1, wherein the package is located on a support surface in a top emitting configuration such that the first and the second leads exposed in the bottom surface of the package contact respective first and second electrical contacts located over the support surface.

8. The device of claim 1, wherein the LED die comprises at least one green emitting LED die.

9. The device of claim 8, wherein the package further comprises:

a third lead, a fourth lead, a fifth lead and a sixth lead;

a third castellation in the side surface of the package, wherein the third castellation exposes at least one of the third lead and a third platable metal which is electrically connected to the third lead;

a fourth castellation in the side surface of the package, wherein the fourth castellation exposes at least one of the fourth lead and a fourth platable metal which is electrically connected to the fourth lead;

a fifth castellation in the side surface of the package, wherein the fifth castellation exposes at least one of the fifth lead and a fifth platable metal which is electrically connected to the fifth lead;

a sixth castellation in the side surface of the package, wherein the sixth castellation exposes

at least one of the sixth lead and a sixth platable metal which is electrically connected to the sixth lead;

at least one blue emitting LED die which is electrically connected to the third lead and to the fourth lead; and

at least one red emitting LED die which is electrically connected to the fifth lead and to the sixth lead.

10. The device of claim 9, wherein:

the package comprises an interior wall separating a first compartment containing the at least one red emitting LED die from a second compartment containing the at least one green emitting LED die and the at least one blue LED die;

the first compartment contains a first encapsulant containing a red emitting phosphor located over the at least one red emitting LED die; and

the second compartment contains a second encapsulant which lacks the red emitting phosphor located over the at least one green emitting LED die and the at least one blue emitting LED die.

11. The device of claim 1, wherein a sidewall of the package has a non-uniform thickness and contains at least one structural strength enhancing region of increased thickness.

12. The device of claim 1, wherein sides and ends of the first and the second leads are etched to increase a surface area of the first and second leads.