Electronic device, method for manufacturing thereof, and electronic apparatus

• US 9,144,159 B2
• Filed: 02/06/2013
• Issued: 09/22/2015
• Est. Priority Date: 02/09/2012
• Status: Active Grant

• Current Assignee: 138 East LCD Advancements Limited (Vector Capital Corporation)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Takagi, Shigekazu
• Primary Examiner(s): Ferguson, Dion R
• Assistant Examiner(s): BUTTAR, MANDEEP S
• Application Number:
  US13/760,626
• Publication Number:
  US 20130208438A1
• Time in Patent Office: 958 Days
• Field of Search: 361/809, 735/143.2, 735/143.6, 735/143.8, 735/141.2
• US Class Current: 1/1
• CPC Class Codes: B81B 2207/097 Interconnects arranged on the substrate or the lid, and covered by the package seal
• CPC Class Codes: B81B 7/007 Interconnections between the MEMS and external electrical signals
• CPC Class Codes: B81C 2203/0145 Hermetically sealing an opening in the lid
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 2201/09072 Hole or recess under component or special relationship between hole and component
• CPC Class Codes: H05K 2201/2045 Protection against vibrations
• CPC Class Codes: H05K 5/02 Details
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

An electronic device includes: a first member having a first surface; a second member placed on the side of the first surface; a functional element accommodated in a cavity formed by the first member and the second member; an external connection terminal disposed outside of the cavity on the side of the first surface of the first member; a groove portion disposed on the side of the first surface of the first member and extending from the inside to the outside of the cavity; a wiring disposed within the groove portion and electrically connecting the functional element with the external connection terminal; a first through-hole disposed at a position of the second member, the position overlapping the groove portion in plan view; and a filling member disposed within the first through-hole and filling the groove portion.

Claims

1. An electronic device comprising:

a first member having a first surface;

a second member placed on the first surface of the first member;

a cavity formed between the first and second members;

a functional element accommodated in the cavity;

an external connection terminal disposed outside of the cavity on the first surface of the first member;

a groove formed in the first surface of the first member, the groove extending from inside of the cavity to the external connection terminal;

a wiring disposed within the groove and electrically connecting the functional element with the external connection terminal;

a first through-hole disposed at a position of the second member, the position overlapping the groove in a plan view; and

a filling member disposed within the first through-hole, wherein

a depth of the groove is larger than a thickness of the wiring so that an aft gap is provided between the second member and a top surface of the wiring, and

the filling member is formed in the air gap of the groove below the second member so that no air communication is permitted between the inside of the cavity and the external connection terminal via the groove.

2. The electronic device according to claim 1, wherein

the first member is glass,

the second member is silicon, and

the first member and the second member are anodically bonded together.

3. The electronic device according to claim 1, wherein

the first through-hole has a tapered shape in which an opening size of the first through-hole decreases toward the first member.

4. The electronic device according to claim 1, wherein

the filling member is an insulating film.

5. The electronic device according to claim 1, further comprising:

a second through-hole disposed in the second member above the cavity and being in communication with the cavity; and

a sealing member closing the second through-hole.

6. The electronic device according to claim 1, wherein

a recess is disposed in a surface of the second member, the surface facing the wiring.

7. An electronic apparatus comprising the electronic device according to claim 1.