EMI compartment shielding structure and fabricating method thereof

• US 9,144,183 B2
• Filed: 07/31/2013
• Issued: 09/22/2015
• Est. Priority Date: 07/31/2013
• Status: Active Grant

• Current Assignee: Universal Scientific Industrial Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Universal Scientific Industrial Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: Chen, Jen-Chun, Cao, Xiao-Wen, Chang, He- Yi
• Primary Examiner(s): Smith, Courtney
• Assistant Examiner(s): FENG, ZHENGFU J
• Application Number:
  US13/955,111
• Publication Number:
  US 20150036296A1
• Time in Patent Office: 783 Days
• Field of Search: 361/728, 361/818, 361/729, 361/730, 361/736, 361/748, 361/752, 361/753, 361/760, 361/767, 361/816, 298/46, 257/428, 438/28, 438/66
• US Class Current: 1/1
• CPC Class Codes: H01K 3/10 Machines therefor
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/18 Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
• CPC Class Codes: H05K 13/00 Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
• CPC Class Codes: H05K 9/00 Screening of apparatus or components against electric or magnetic fields devices for absorbing radiation from an antenna H01Q17/00
• CPC Class Codes: H05K 9/0007 Casings standardised racks H05K9/0062
• CPC Class Codes: H05K 9/0037 Housings with compartments containing a PCB, e.g. partitioning walls
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base

Abstract

A package-integrated EMI compartment shielding structure includes an encapsulating member disposed on a mounting surface of a substrate. The substrate has a ground pad exposedly arranged thereon. The encapsulating member, who defines a peripheral surface, covers the ground pad and encapsulates at least one electronic element. A compartment structure is disposed in the encapsulating member, electrically connecting the ground pad and substantially dividing the encapsulating member into at least two package compartments. The terminal portions of the compartment structure are arranged within the encapsulating member proximal to yet without compromising the peripheral surface. A notch is disposed into the encapsulating member from the peripheral surface corresponding to the location of the terminal portions of the compartment structure to expose the lateral surface thereof across the thickness of the encapsulating member. A conformal shield is disposed on the encapsulating member, electrically connecting the compartment structure through the notch.

Claims

1. An electronic package module having integrated EMI compartment shielding structure, comprising:

a substrate having mounting surface, comprising a ground pad exposedly arranged thereon;

at least one electronic element disposed on the mounting surface;

an encapsulating member disposed on the mounting surface, covering the ground pad and encapsulating at least one of the electronic element, the encapsulating member having at least one peripheral surface,

wherein a trench is disposed in the encapsulating member to define at least two package compartments, the trench at least partially exposes the ground pad,

wherein the terminal portions of the trench is arranged within the encapsulating member proximal to yet without compromising the peripheral surface thereof;

wherein at least one notch is disposed into the encapsulating member from the peripheral surface thereof corresponding to the location of the terminal portions of the trench;

a compartment structure disposed in the trench covering the trench surface,

wherein the compartment structure electrically connects the ground pad,

wherein the notch exposes the lateral surface of the compartment structure across the thickness of the encapsulating member; and

a conformal shield disposed on the encapsulating member,

wherein the conformal shield electrically connects the compartment structure through the notch.

2. The electronic package module of claim 1, wherein the notch has a width wider than that of the trench.

3. The electronic package module of claim 1, wherein the width of the compartment structure ranges from 60 to 180 μ

m.

4. The electronic package module of claim 1, wherein the width of the notch ranges from 80 to 200 μ

m.

5. A method of providing electromagnetic interference (EMI) compartment shielding for electronic elements, comprising:

providing an electronic element mounting surface having a ground pad exposedly arranged thereon for mounting at least one electronic element;

disposing an encapsulating member on the mounting surface covering the ground pad and encapsulating at least one electronic element mounted thereon, the encapsulating member having at least one peripheral surface;

disposing a trench pattern in the encapsulating member to define at least two package compartments therein,

wherein the depth of the trench is sufficient to at least partially expose the ground pad,

wherein the terminal portions of the trench is arranged within the encapsulating member proximal yet without compromising the peripheral surface;

disposing conductive material into the trench to at least cover the trench surface for forming a compartment structure,

wherein the compartment structure electrically connects the ground pad;

disposing notches respectively into the encapsulating member from the peripheral surface thereof corresponding to the location of the terminal portions of the trench to expose the compartment structure across the thickness of the encapsulating member; and

disposing conformal shielding on the encapsulating member and establishing connection thereof with the compartment structure through the notches.

6. The method of claim 5, wherein the notch has a width wider than that of the trench.

7. The method of claim 5, wherein the disposing of conductive material for forming compartment structure utilizes spraying coating process.

8. The method of claim 5, further comprising:

defining a buffer zone between the peripheral surface of the encapsulating member and a terminal portion of the trench pattern.

9. The method of claim 5, wherein the width of the compartment structure ranges from 60 to 180 μ

m.

10. The method of claim 5, wherein the width of the notch ranges from 80 to 200 μ

m.

11. The method of claim 5, wherein the trench is formed by laser scribing.

12. The method of claim 5, further comprising:

disposing a protective mask on the encapsulating member prior to the deposition of the trench pattern.

13. The method of claim 12, further comprising:

removing the protective mask after the deposition of the compartment structure.

14. The method of claim 5, further comprising:

performing a singulation process prior to the deposition of the conformal shield.