×

Optoelectronic semiconductor chip, method of fabrication and application in an optoelectronic component

  • US 9,147,806 B2
  • Filed: 09/15/2011
  • Issued: 09/29/2015
  • Est. Priority Date: 09/20/2010
  • Status: Active Grant
First Claim
Patent Images

1. An optoelectronic semiconductor chip comprising:

  • an active layer with a first and a second major face, comprising a semiconductor material which emits or receives radiation when the semiconductor chip is in operation;

    a patterned layer comprising three-dimensional patterns for outcoupling or incoupling radiation and arranged on the first major face in a beam path of the radiation;

    wherein the patterned layer comprises an inorganic-organic hybrid material comprising

         1) a hydrolytic condensation product containing organofunctional silanes with organic substituents which are at least in part crosslinked with the organic prepolymer, and

         2) an organic prepolymer and the inorganic-organic hybrid material contain at least 20 wt. % of titanium and/or zirconium that is chemically bonded to the inorganic-organic hybrid material.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×