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Interconnect for battery packs

  • US 9,147,875 B1
  • Filed: 03/27/2015
  • Issued: 09/29/2015
  • Est. Priority Date: 09/10/2014
  • Status: Active Grant
First Claim
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1. A method of forming an interconnect circuit for interconnecting an array of battery cells, the method comprising:

  • forming a set of conductive layer openings in a conductive layer,wherein the conductive layer openings in the set are separated from each other by two or more connecting tabs,wherein the set of the conductive layer openings and the two or more connecting tabs surround and define a region of the conductive layer, andwherein, after forming the set of the conductive layer openings, the two or more connecting tabs mechanically support and maintain registration of the region of the conductive layer relative to other portions of the conductive layer;

    laminating the conductive layer comprising the set of the conductive layer openings to a support layer,wherein, after laminating the conductive layer to the support layer, the support layer mechanically supports and maintains registration of the region of the conductive layer relative to the other portions of the conductive layer; and

    removing at least one of the two or more connecting tabs,wherein removing the at least one of the two or more connecting tabs converts the set of the conductive layer openings into a continuous conductive layer channel at least partially surrounding and defining the region of the conductive layer.

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