Spin chuck for thin wafer cleaning
First Claim
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1. A device for cleaning a thin wafer comprising:
- a spin chuck comprising;
a circular shaped plate having at least three extensions spaced along the edge of the circular shaped plate, wherein top surfaces of the at least three extensions are level with a top surface of the circular shaped plate, and bottom surfaces of the at least three extensions are level with a bottom surface of the circular shaped plate;
a tape layer on the circular shaped plate and a wafer frame on the tape layer;
at least three holding clamps mounted on the extensions, wherein each holding clamp can be unlocked by placing a non-vertical side of the holding clamp at a first position and can be locked by rotating the holding clamp and placing the non-vertical side of the holding clamp at a second position, wherein the second position is rotated by 180 degrees from the first position, and wherein a distance from an axis of rotation of the holding clamp to a center of the circular shaped plate is greater than a distance from the second position to the center of the circular shaped plate, and wherein the tape layer and the holding clamp are separated by the wafer frame and the axis of rotation is outside the wafer frame; and
a rotational drive shaft connected the circular shaped plate.
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Abstract
A device and system for thin wafer cleaning is disclosed. A preferred embodiment comprises a spin chuck having at least three holding clamps. A thin wafer with a wafer frame is mounted on the spin chuck through a tape layer. When the holding clamps are unlocked, there is no interference with the removal and placement of the wafer frame. On the other hand, when the holding clamps are locked, the holding clamps are brought into contact with the outer edge of the wafer frame so as to prevent the wafer frame from moving laterally. Furthermore, the shape of the holding clamps in a locked position is capable of preventing the wafer frame from moving vertically.
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Citations
20 Claims
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1. A device for cleaning a thin wafer comprising:
a spin chuck comprising; a circular shaped plate having at least three extensions spaced along the edge of the circular shaped plate, wherein top surfaces of the at least three extensions are level with a top surface of the circular shaped plate, and bottom surfaces of the at least three extensions are level with a bottom surface of the circular shaped plate; a tape layer on the circular shaped plate and a wafer frame on the tape layer; at least three holding clamps mounted on the extensions, wherein each holding clamp can be unlocked by placing a non-vertical side of the holding clamp at a first position and can be locked by rotating the holding clamp and placing the non-vertical side of the holding clamp at a second position, wherein the second position is rotated by 180 degrees from the first position, and wherein a distance from an axis of rotation of the holding clamp to a center of the circular shaped plate is greater than a distance from the second position to the center of the circular shaped plate, and wherein the tape layer and the holding clamp are separated by the wafer frame and the axis of rotation is outside the wafer frame; and a rotational drive shaft connected the circular shaped plate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A system for cleaning a thin wafer comprising:
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a spin chuck comprising; a circular shaped plate having at least three extensions spaced along the edge of the circular shaped plate and configured to receive thereon a tape layer having a first diameter, wherein top surfaces of the at least three extensions are level with a top surface of the circular shaped plate, and bottom surfaces of the at least three extensions are level with a bottom surface of the circular shaped plate; at least three holding clamps each having an upper portion and a bottom portion mounted on the extensions, wherein each holding clamp can be unlocked in a first position and can be locked by rotating the holding clamp from the first position to a second position, wherein the second position is rotated by 180 degrees from the first position; and a rotational drive shaft connected the circular shaped plate; and a wafer frame mounted on the spin chuck and configured to secure the tape layer, wherein the holding clamp and the tape layer are separated by the wafer frame when the holding clamp is at the second position, and a height of the bottom portion is equal to a height of the wafer frame. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A system for thin wafer cleaning comprising:
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a spin chuck comprising; a circular shaped plate having at least three extensions spaced along the edge of the circular shaped plate and configured to receive thereon a tape layer, wherein top surfaces of the at least three extensions are level with a top surface of the circular shaped plate, and bottom surfaces of the at least three extensions are level with a bottom surface of the circular shaped plate; at least three holding clamps each having an upper portion and a bottom portion mounted on the extensions, wherein each holding clamp can be unlocked in a first position and can be locked by rotating the holding clamp from the first position to a second position, wherein the second position is rotated by 180 degrees from the first position; and a rotational drive shaft connected the circular shaped plate; a wafer frame mounted on the spin chuck and configured to secure the tape layer, wherein the holding clamp and the tape layer are separated by the wafer frame when the holding clamp is at the second position, and a height of the bottom portion is greater than a height of the tape layer; a cup having an inner wall and an outer wall; at least three spray nozzles attached to the inner wall of the cup and at least three pipes attached to the outer wall of the cup; a chemical solvent nozzle placed inside the cup and above the spin chuck; and a waste chemical absorber. - View Dependent Claims (17, 18, 19, 20)
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Specification