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Shielding technique for semiconductor package including metal lid and metalized contact area

  • US 9,153,543 B1
  • Filed: 01/23/2012
  • Issued: 10/06/2015
  • Est. Priority Date: 01/23/2012
  • Status: Active Grant
First Claim
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1. A semiconductor package comprising:

  • a semiconductor die having terminals and a metalized surface portion, the metalized surface portion disposed on a major surface of the semiconductor die and spaced apart from the terminals, the semiconductor die coupled to a die paddle, and the metalized surface portion electrically connected to the die paddle;

    a wire mesh formed on the metalized surface portion of the semiconductor die;

    a plurality of leads extending at least partially about the semiconductor die, wherein the semiconductor die and at least a portion of the plurality of leads are electrically connected;

    a package body covering at least portions of the plurality of leads; and

    a lid having a peripheral rim portion attached to the package body and a top portion, the top portion having a first surface facing the semiconductor die and a second surface opposite to the first surface and external to the semiconductor package, wherein the first surface is spaced apart from the package body, and wherein the wire mesh physically contacts the first surface to provide an electrically conductive path between the lid and the die paddle.

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