Method of wire bonding over active area of a semiconductor circuit

• US 9,153,555 B2
• Filed: 02/25/2007
• Issued: 10/06/2015
• Est. Priority Date: 10/15/2002
• Status: Expired due to Term

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Lee, Jin-Yuan, Chen, Ying-Chih, Lin, Mou-Shiung
• Primary Examiner(s): PIZARRO CRESPO, MARCOS D
• Application Number:
  US11/678,599
• Publication Number:
  US 20070164453A1
• Time in Patent Office: 3,145 Days
• Field of Search: 257750-766, 257/784, 257/E23.02, 257/780, 257/E23.142, 257/E23.167
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/02166 Collar structures
• CPC Class Codes: H01L 2224/023 Redistribution layers [RDL] for bonding areas
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05073 Single internal layer
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05171 Chromium [Cr] as principal constituent
• CPC Class Codes: H01L 2224/05187 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2224/05548 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05556 in side view
• CPC Class Codes: H01L 2224/05558 conformal layer on a patterned surface
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/4807 of bonding interfaces, e.g. interlocking features
• CPC Class Codes: H01L 2224/48453 of the interface with the bonding area
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/48599 Principal constituent of the connecting portion of the wire connector being Gold (Au)
• CPC Class Codes: H01L 2224/48624 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48644 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48647 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/854 : with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/85424 : Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/85444 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/85447 : Copper (Cu) as principal constituent
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01007 : Nitrogen [N]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/04941 : TiN
• CPC Class Codes: H01L 2924/04953 : TaN
• CPC Class Codes: H01L 2924/05042 : Si3N4
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor

Abstract

A method and structure are provided to enable wire bond connections over active and/or passive devices and/or low-k dielectrics, formed on an Integrated Circuit die. A semiconductor substrate having active and/or passive devices is provided, with interconnect metallization formed over the active and/or passive devices. A passivation layer formed over the interconnect metallization is provided, wherein openings are formed in the passivation layer to an upper metal layer of the interconnect metallization. Compliant metal bond pads are formed over the passivation layer, wherein the compliant metal bond pads are connected through the openings to the upper metal layer, and wherein the compliant metal bond pads are formed substantially over the active and/or passive devices. The compliant metal bond pads may be formed of a composite metal structure.

Claims

1. A circuit component comprising:

a semiconductor substrate;

an active device in said semiconductor substrate;

a first dielectric layer having a first surface directly coupled to said semiconductor substrate and said active device;

a first interconnect conductive layer on said first dielectric layer;

a second dielectric layer having a first surface on said first interconnect conductive layer and on a second surface of said first dielectric layer opposite said first surface of said first dielectric layer, said second dielectric layer having a second surface opposite said first surface;

a second interconnect conductive layer having first and second conductive interconnects each having a first surface and a second surface opposite said first surface, said second surface of each of said first and second conductive interconnects on said second surface of said second dielectric layer;

a passivation layer on sidewalls and said first surface of each of said first and second conductive interconnects of said second interconnect conductive layer and on the second surface of said second dielectric layer, wherein a first opening in said passivation layer and a second opening in said passivation layer expose a first contact point and a second contact point, respectively, of said first conductive interconnect and said second conductive interconnect of said second interconnect conductive layer, and wherein said passivation layer comprises a nitride;

a polymer layer on said passivation layer, wherein said polymer layer has a thickness that is significantly greater than a thickness of said passivation layer, and wherein an opening with sloped sidewalls is provided in said polymer layer to expose said first contact point and a sidewall of said passivation layer and a portion of said passivation layer on said surface of said second interconnect conductive layer;

a conductive pad on said polymer layer and said first contact point, wherein said conductive pad is coupled to said first contact point through said opening in said polymer layer and said first opening in said passivation layer, wherein said conductive pad comprises a titanium-containing layer on said first contact point, a gold seed layer on said titanium-containing layer, and an electroplated gold layer, a portion of said polymer within an enclosure defined between sloped sidewalls of said conductive pad and a portion of said passivation layer between said first and second conductive interconnects; and

a wirebond bonded to said conductive pad, wherein a contact between the wirebond and the conductive pad is aligned with said first contact point.

2. The circuit component of claim 1, wherein said contact between the wirebond and the conductive pad is further aligned with said second contact point opposite said passivation layer.

3. The circuit component of claim 1, wherein said polymer layer has a thickness greater than 2 micrometers.

4. The circuit component of claim 1, wherein said nitride comprises silicon nitride.

5. The circuit component of claim 1, wherein said polymer layer comprises polyimide.

6. The circuit component of claim 1, wherein said passivation layer further comprises an oxide under said nitride.

7. The circuit component of claim 1, wherein said polymer layer comprises benzocyclobutene (BCB).

8. The circuit component of claim 1, wherein said titanium-containing layer comprises a titanium-tungsten alloy.

9. The circuit component of claim 1, wherein said contact between the wirebond and the conductive pad is further aligned with said active device.

10. The circuit component of claim 1, in which a thickness of said conductive pad is selected to absorb an amount of energy used to bond the wirebond to the conductive pad.

11. A circuit component comprising:

a semiconductor substrate;

an active device in said semiconductor substrate;

a first dielectric layer having a first surface directly coupled to said semiconductor substrate and said active device;

a first interconnect conductive layer on said first dielectric layer and said semiconductor substrate;

a second dielectric layer having a first surface on said first interconnect conductive layer and on a second surface of said first dielectric layer opposite said first surface of said first dielectric layer, said second dielectric layer having a second surface opposite said first surface;

a second interconnect conductive layer having first and second conductive interconnects each having a first surface and a second surface opposite said first surface, said second surface of each of said first and second conductive interconnects on said second surface of said second dielectric layer;

a passivation layer on sidewalls and said first surface of each of said first and second conductive interconnects of said second interconnect conductive layer and on the second surface of said of said second dielectric layer, wherein a first opening in said passivation layer and a second opening in said passivation layer expose a first contact point and a second contact point, respectively, of said first conductive interconnect and said second conductive interconnect of said second interconnect conductive layer, and, wherein said passivation layer comprises a nitride;

a polymer layer on said passivation layer, wherein a thickness of said polymer layer is greater than a thickness of said passivation layer, and wherein an opening with sloped sidewalls is provided in said polymer layer to expose said first contact point and a sidewall of said passivation layer and a portion of said passivation layer on said surface of said second interconnect conductive layer;

a conductive structure on said first and second contact points and said polymer layer, wherein said conductive structure is coupled to said first contact point through said opening in said polymer layer and said first opening in said passivation layer, and wherein said conductive structure is coupled to said second contact point through said second opening, wherein said first contact point is coupled to said second contact point through said conductive structure, wherein said conductive structure comprises a glue layer, a gold seed layer on said glue layer, and an electroplated gold layer on said gold seed layer, a portion of said polymer within an enclosure defined between sloped sidewalls of said conductive pad and a portion of said passivation layer between said first and second conductive interconnects; and

a wirebond bonded to said conductive structure, wherein a contact between said wirebond and said conductive structure is aligned with said first contact point.

12. The circuit component of claim 11, wherein said contact between said wirebond and said conductive structure is further aligned with said second contact point.

13. The circuit component of claim 11, wherein said glue layer comprises a titanium-containing layer.

14. The circuit component of claim 11, wherein said glue comprises a titanium-tungsten-alloy layer.

15. The circuit component of claim 11, wherein said electroplated gold layer has a harness less than 150 Hv.

16. The circuit component of claim 11, wherein said electroplated gold layer has a gold purity greater than 97%.

17. The circuit component of claim 11, wherein said glue layer comprises a titanium-nitride layer.

18. The circuit component of claim 11, wherein said contact between said wirebond and said conductive structure is further aligned with a portion of said first interconnect conductive layer.

19. The circuit component of claim 11, wherein said polymer layer comprises polyimide.

20. The circuit component of claim 11, wherein said polymer layer comprises benzocyclobutene (BCB).

21. The circuit component of claim 11, wherein said nitride comprises silicon nitride.

22. The circuit component of claim 11, wherein said passivation layer further comprises an oxide under said nitride.

23. The circuit component of claim 11, wherein said contact between said wirebond and said conductive structure is further aligned with said active device.

24. The circuit component of claim 11, in which a thickness of said conductive structure is selected to absorb an amount of energy used to bond the wirebond to the conductive structure.