Electronic module allowing fine tuning after assembly

• US 9,155,198 B2
• Filed: 07/24/2014
• Issued: 10/06/2015
• Est. Priority Date: 05/17/2012
• Status: Active Grant

• Current Assignee: Eagantu, Ltd.
• Original Assignee: Eagantu, Ltd.
• Inventors: Dakhiya, Michael, Shaked, Eran
• Primary Examiner(s): Mayo, III, William H
• Assistant Examiner(s): Gonzalez, Hiram E
• Application Number:
  US14/339,477
• Publication Number:
  US 20140334120A1
• Time in Patent Office: 439 Days
• Field of Search: 361/761
• US Class Current: 1/1
• CPC Class Codes: H01C 17/22 adapted for trimming
• CPC Class Codes: H01L 22/14 for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2223/6655 Matching arrangements, e.g. arrangement of inductive and capacitive components
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/81439 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/81447 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/8149 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/81493 with a principal constituent of the material being a solid not provided for in groups H01L2224/814 - H01L2224/81491, e.g. allotropes of carbon, fullerene, graphite, carbon-nanotubes, diamond
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1047 Details of electrical connections between containers
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/15 Ceramic or glass substrates H01L23/142, H01L23/145, H01L23/147 take precedence
• CPC Class Codes: H01L 23/5381 Crossover interconnections, e.g. bridge stepovers
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/81 using a bump connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/105 : the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15156 : Side view
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15313 : being a land array, e.g. LGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/1579 : with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/1627 : stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H05K 1/183 : Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2203/16 : Inspection; Monitoring; Aligning
• CPC Class Codes: H05K 2203/171 : Tuning, e.g. by trimming of printed components or high frequency circuits
• CPC Class Codes: H05K 3/32 : electrically connecting electric components or wires to printed circuits
• CPC Class Codes: Y10T 29/49004 : including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/4913 : Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/53022 : with means to test work or product
• CPC Class Codes: Y10T 29/53174 : Means to fasten electrical component to wiring board, base, or substrate

Abstract

An electronic module includes a substrate, which includes a dielectric material having multiple sides, including first and second sides, and first and second cavities indented respectively within the first and second sides. First and second conductive contacts within the first and second cavities are configured for contact with at least first and second electronic components that are mounted respectively in the first and second cavities. Conductive traces within the substrate are in electrical communication with the first and second conductive contacts.

Claims

1. An electronic module, comprising:

a substrate comprising a dielectric material having multiple sides, including first, second and third sides, and first, second and third cavities indented respectively within the first, second and third sides,

wherein the second side is parallel to and opposite the first side, whereby the first and second cavities open in mutually-opposing directions, while the third side is non-parallel to the first and second sides,

wherein the substrate comprises multiple layers of the dielectric material, which are graduated in size and comprise first and second layers having respective central openings that define the first and second cavities, and

wherein the layers are joined together so as to define the cavities in the substrate, wherein the third cavity is defined by the graduated sizes of the layers;

first, second and third conductive contacts within the first, second and third cavities, configured for contact with at least first, second and third electronic components that are mounted respectively in the first, second and third cavities;

conductive traces within the substrate in electrical communication with the first, second and third conductive contacts; and

a plurality of contact pads disposed on respective exterior surfaces of at least the first and third sides of the substrate and connected to the conductive traces, wherein the contact pads on one of the respective exterior surfaces are configured for contacting a printed circuit board, while the contact pads on the other of the respective exterior surfaces are configured for contacting another module.

2. The module according to claim 1, wherein one or more of the conductive traces and contacts comprise graphene.

3. The module according to claim 1, and comprising a trimmable conductive element formed on a surface of the substrate in proximity to at least one of the cavities, wherein the trimmable conductive element is connected to the conductive traces so as to define an electrical circuit that comprises the first and second electronic components and the trimmable conductive element.

4. The module according to claim 3, wherein the at least one of the cavities is indented within the first side of the substrate, and the surface on which the trimmable conductive element is formed is located on another side of the substrate, different from the first side.

5. The module according to claim 3, wherein the substrate comprises first and second dielectric substrates that are connected together, wherein the trimmable conductive element is formed on the surface of the first dielectric substrate, while the electrical circuit comprises at least one electronic component that is mounted on the second dielectric substrate.

6. The module according to claim 3, wherein the module comprises an array of circuit components embedded in the substrate, and wherein the trimmable conductive element is configured so that trimming the trimmable conductive element disconnects one or more of the circuit components from the array.

7. The module according to claim 3, wherein the module comprises one or more discrete circuit components embedded within the dielectric substrate, and wherein the trimmable conductive element is configured so that trimming the trimmable conductive element adjusts a value of at least one of the embedded components.

8. Apparatus comprising at least first and second modules according to claim 1, which are connected together by contact between the contact pads on the first and second modules.

9. The module according to claim 1, wherein the substrate has a fourth side having a fourth cavity indented therein, wherein the fourth cavity is oriented obliquely relative to the first, second and third sides of the substrate.

10. A method for producing an electronic module, the method comprising:

providing a substrate comprising a dielectric material having multiple sides, including first, second and third sides, and first, second and third cavities indented respectively within the first, second and third sides,

wherein the second side is parallel to and opposite the first side, whereby the first and second cavities open in mutually-opposing directions, while the third side is non-parallel to the first and second sides,

wherein providing the substrate comprises joining together multiple layers of the dielectric material, which are graduated in size and comprise first and second layers having respective central openings that define the first and second cavities, so as to define the cavities in the substrate,

wherein the layers are joined together so as to define the cavities in the substrate, wherein the third cavity is defined by the graduated sizes of the layers,

wherein the substrate has first, second and third conductive contacts within the first, second and third cavities and conductive traces within the substrate in electrical communication with the first, second and third conductive contacts,

wherein a plurality of contact pads are disposed on respective exterior surfaces of at least the first and third sides of the substrate and connected to the conductive traces;

mounting at least first, second and third electronic components in the first, second and third cavities, respectively, in contact with the first, second and third contacts;

connecting the electronic module to another module by contact of the contact pads on one of the respective exterior surfaces with the other module; and

mounting the electronic module on a printed circuit board by contact of the contact pads on the other of the respective exterior surfaces with traces on the printed circuit board.

11. The method according to claim 10, wherein a trimmable conductive element is formed on a surface of the substrate in proximity to at least one of the cavities and is connected to the conductive traces so as to define an electrical circuit that comprises at least one of the first and second electronic components and the trimmable conductive element, and

wherein the method comprises trimming the trimmable conductive element so as to adjust an electrical property of the circuit.

12. The method according to claim 10, wherein the substrate has a fourth side having a fourth cavity indented therein, wherein the fourth cavity is oriented obliquely relative to the first, second and third sides of the substrate.