Packages and methods for packaging
First Claim
Patent Images
1. An integrated device package comprising:
- a first housing comprising;
a base and a wall extending from the base, the wall having a distal end portion and a proximal end portion integral with the base; and
a first conductor and a second conductor, the first conductor and the second conductor each extending from the base to the distal end portion of the wall, wherein at least the base, the wall, the first conductor, and the second conductor are monolithically integrated, andwherein the base and the wall are seamlessly integrated such that the base and the wall are joined together without joints or seams,wherein the first conductor comprises a first material and the wall comprises a second material, and wherein the first conductor and the wall are joined along a boundary surface such that portions of the first material are mixed together with portions of the second material,wherein the first conductor and the wall are joined along the boundary surface such that most of the first material is disposed on a first side of the boundary surface and most of the second material is disposed on a second side of the boundary surface, and wherein at least a portion of the second material is disposed on the first side of the boundary surface and at least a portion of the first material is disposed on the second side of the boundary surface.
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Accused Products
Abstract
A three-dimensional printing technique can be used to form a microphone package. The microphone package can include a housing having a first side and a second side opposite the first side. A first electrical lead can be formed on an outer surface on the first side of the housing. A second electrical lead can be formed on an outer surface on the second side of the housing. The first electrical lead and the second electrical lead may be electrically shorted to one another. Further, vertical and horizontal conductors can be monolithically integrated within the housing.
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Citations
40 Claims
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1. An integrated device package comprising:
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a first housing comprising; a base and a wall extending from the base, the wall having a distal end portion and a proximal end portion integral with the base; and
a first conductor and a second conductor, the first conductor and the second conductor each extending from the base to the distal end portion of the wall, wherein at least the base, the wall, the first conductor, and the second conductor are monolithically integrated, andwherein the base and the wall are seamlessly integrated such that the base and the wall are joined together without joints or seams, wherein the first conductor comprises a first material and the wall comprises a second material, and wherein the first conductor and the wall are joined along a boundary surface such that portions of the first material are mixed together with portions of the second material, wherein the first conductor and the wall are joined along the boundary surface such that most of the first material is disposed on a first side of the boundary surface and most of the second material is disposed on a second side of the boundary surface, and wherein at least a portion of the second material is disposed on the first side of the boundary surface and at least a portion of the first material is disposed on the second side of the boundary surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. An integrated device package comprising:
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a housing having a first side and a second side opposite to the first side; a first electrical lead formed on an outer surface on the first side of the housing; and a second electrical lead formed on an outer surface on the second side of the housing, wherein the first electrical lead and the second electrical lead are electrically shorted to one another, and wherein the first electrical lead comprises a first material and the housing comprises a second material different from the first material, and wherein the first electrical lead and the housing are joined along a boundary surface such that portions of the first material are mixed together with portions of the second material, wherein the first electrical lead and the housing are joined along the boundary surface such that most of the first material is disposed on a first side of the boundary surface and most of the second material is disposed on a second side of the boundary surface, and wherein at least a portion of the second material is disposed on the first side of the boundary surface and at least a portion of the first material is disposed on the second side of the boundary surface. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. An integrated device package comprising:
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a housing comprising a top side member and a bottom side member, the housing defining a package interior at least between the top side member and the bottom side member, wherein the top side member or the bottom side member first wall comprises a port to provide fluid communication between the package interior and the outside environs, the port extending through a thickness of the top side member or the bottom side member from an outer surface of the housing to an inner surface of the housing, wherein a side cross-sectional profile of the port varies through the thickness of the top side member or the bottom side member; and an electrode on the inner surface of the housing such that the electrode is exposed to the package interior, wherein the electrode comprises a first material and the housing comprises a second material, and wherein the electrode and the housing are joined along a boundary surface such that portions of the first material are mixed together with portions of the second material, wherein the electrode and the housing are joined along the boundary surface such that most of the first material is disposed on a first side of the boundary surface and most of the second material is disposed on a second side of the boundary surface, and wherein at least a portion of the second material is disposed on the first side of the boundary surface and at least a portion of the first material is disposed on the second side of the boundary surface. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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Specification