Test system with temporary test structures

• US 9,157,954 B2
• Filed: 06/03/2011
• Issued: 10/13/2015
• Est. Priority Date: 06/03/2011
• Status: Active Grant

• Current Assignee: Apple Inc.
• Original Assignee: Apple Inc.
• Inventors: Nickel, Joshua G.
• Primary Examiner(s): Phan, Huy Q
• Assistant Examiner(s): Rhodes-Vivour, Temilade S
• Application Number:
  US13/153,153
• Publication Number:
  US 20120306521A1
• Time in Patent Office: 1,593 Days
• Field of Search: 324/73.1, 324/750.16, 324/754.03, 324/754.31, 324/762.01, 438 14- 18, 343/703, 343/906
• US Class Current: 1/1
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: H01L 21/00 Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
• CPC Class Codes: H01L 2221/00 Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/44 using equipment having another main function to serve additionally as an antenna , e.g. means for giving an antenna an aesthetic aspectH01Q1/27 - H01Q1/34 take precedence
• CPC Class Codes: H01Q 9/42 with folded element, the folded parts being spaced apart a small fraction of the operating wavelength

Abstract

Electronic device structures such as a conductive housing member that forms part of an antenna may be tested during manufacturing. A test system may be provided that includes a test probe configured to energize the conductive housing member or other conductive structures under test and that includes temporary test structures that may be placed in the vicinity of or in direct contact with the device structures during testing to facilitate detection of manufacturing defects. Test equipment such as a network analyzer may provide radio-frequency test signals in a range of frequencies. An antenna probe may be used to gather corresponding wireless radio-frequency signal data. Forward transfer coefficient data may be computed from the transmitted and received radio-frequency signals. The forward transfer coefficient data or other test data may be compared to reference data to determine whether the device structures contain a fault.

Claims

1. A test system for detecting manufacturing defects in conductive electronic device antenna structures under test, comprising:

temporary test structures that are brought into contact with the conductive electronic device antenna structures under test only during testing;

a fixture that receives the conductive electronic device antenna structures under test and the temporary test structures, wherein the temporary test structures are configured to enhance the detection of manufacturing defects; and

test probe structures configured to convey radio-frequency test signals to the conductive electronic device antenna structures under test and to receive corresponding test data from the conductive electronic device antenna structures under test while the radio-frequency test signals are being conveyed to the conductive electronic device antenna structures under test.

2. The test system defined in claim 1, wherein the test probe structures comprise a first test probe configured to convey the radio-frequency test signals to the conductive electronic device antenna structures under test, and wherein the first test probe comprises a test probe selected from the group consisting of:

a wired test probe, a wireless test probe, and a capacitive coupling test probe.

3. The test system defined in claim 2, wherein the test probe structures comprise a second test probe configured to receive the corresponding test data from the conductive electronic device antenna structures under test, and wherein the second test probe comprises a test probe selected from the group consisting of:

a wired test probe, a wireless test probe, and a capacitive coupling test probe.

4. The test system defined in claim 3, wherein the temporary test structures comprise a printed circuit board on which a transmission line path is formed, and wherein the transmission line path has a first end that is coupled to a portion of the conductive electronic device antenna structures under test and a second end that is coupled to the first test probe.

5. The test system defined in claim 3, wherein the temporary test structures comprise electronic device housing structures configured to temporarily mate with the conductive electronic device antenna structures under test while the radio-frequency test signals are being conveyed to the conductive electronic device antenna structures under test.

6. The test system defined in claim 3, wherein the conductive electronic device antenna structures under test comprise a conductive peripheral housing member having at least first and second gaps, and wherein the temporary test structures comprise a conductive member having first and second ends configured to contact respective portions of the conductive peripheral housing member on opposing sides of the second gap.

7. The test system defined in claim 3, wherein the conductive electronic device antenna structures under test comprise a conductive peripheral housing member and an antenna ground member, and wherein the temporary test structures comprise a conductive member having a first end configured to contact a portion of the conductive peripheral housing member and a second end configured to contact a portion of the antenna ground member.

8. The test system defined in claim 3, wherein the temporary test structures comprise at least one conductive structure selected from the group consisting of:

a flex circuit, conductive tape, metal strip, radio-frequency cables, dielectric material, resistor, capacitor, and inductor.

9. A method for manufacturing an electronic device using test equipment, wherein the electronic device includes input-output devices that receive inputs directly from a user, wherein the electronic device includes device housing structures under test at least a portion of which serves as a housing for the electronic device, and wherein the test equipment includes test probe structures and a test fixture, the method comprising:

with the test fixture, receiving the device housing structures under test;

mating temporary test structures with the device housing structures under test;

with the test probe structures, performing radio-frequency measurements on the device housing structures under test while the temporary test structures are mated with the device housing structures under test to determine whether the device housing structures under test contain a manufacturing defect; and

removing the temporary test structures from the device housing structures under test.

10. The method defined in claim 9, further comprising:

assembling the electronic device by incorporating additional structures with the device housing structures under test, wherein the temporary test structures are configured to emulate radio-frequency characteristics associated with the additional structures when the temporary test structures are mated with the device housing structures under test during radio-frequency testing.

11. The method defined in claim 10, wherein the test probe structures comprise a first test probe and wherein performing the radio-frequency measurements on the device housing structures under test comprises:

transmitting radio-frequency test signals to the device housing structures under test using the first test probe, wherein the first test probe comprises a test probe selected from the group consisting of;

a wired test probe, a wireless test probe, and a capacitive coupling test probe.

12. The method defined in claim 11, wherein the test probe structures further comprise a second test probe and wherein performing the radio-frequency measurements on the device housing structures under test further comprises:

receiving corresponding radio-frequency test signals from the device housing structures under test using the second test probe, wherein the second test probe comprises a test probe selected from the group consisting of;

a wired test probe, a wireless test probe, and a capacitive coupling test probe.

13. The method defined in claim 12, wherein the test equipment further includes a test unit, the method further comprising:

with the test unit, computing a complex impedance magnitude based on the transmitted and received radio-frequency test signals.

14. The method defined in claim 12, wherein the temporary test structures comprise a printed circuit board on which a transmission line path is formed and wherein mating the temporary test structures with the device housing structures under test comprises:

coupling a first end of the transmission line path to a portion of the device housing structures under test; and

coupling a second end of the transmission line path to the test probe structures.

15. The method defined in claim 12, wherein the temporary test structures comprise temporary electronic device housing structures and wherein mating the temporary test structures with the device housing structures under test comprises:

temporarily bearing the temporary electronic device housing structures against at least a portion of the device housing structures under test.

16. The method defined in claim 9, wherein the input-output devices comprise a button configured to receive inputs directly from the user.

17. A method for detecting manufacturing defects in device structures under test using test equipment having test probe structures and a test fixture, the method comprising:

receiving the device structures under test with the test fixture, wherein the device structures under test comprise a peripheral conductive housing member;

with the test probe structures, performing radio-frequency measurements on the device structures under test while the peripheral conductive housing member is placed within the test fixture;

enhancing the accuracy of the radio-frequency measurements gathered using the test-probe structures by physically mating temporary test structures with the device structures under test; and

determining whether the device structures under test contain a manufacturing defect based on results gathered from the radio-frequency measurements.

18. The method defined in claim 17, wherein the peripheral conductive housing member has at least first and second gaps, wherein the temporary test structures comprise a conductive bridging member having first and second ends, and wherein performing radio-frequency measurements on the device structures under test comprises:

gathering radio-frequency test measurements on the device structures under test while the first and second ends of the conductive bridging member is placed in contact with respective portions of the peripheral conductive housing member on opposing sides of the second gap.

19. The method defined in claim 17, wherein the device structures under test further comprises an antenna ground member, wherein the temporary test structures comprises a conductive shorting member, and wherein performing radio-frequency measurements on the device structures under test comprises:

gathering radio-frequency test measurements on the device structures under test while the conductive shorting member is coupled between a portion of the peripheral conductive housing member and a portion of the antenna ground member.

20. The method defined in claim 17, wherein the temporary test structures comprise conductive structures selected from the group consisting of:

a flex circuit, conductive tape, metal strip, radio-frequency cables, dielectric material, resistor, capacitor, and inductor.

21. The method defined in claim 17, wherein the test equipment further comprises a test unit and wherein performing radio-frequency measurements on the device structures under test comprises:

with the test unit, transmitting radio-frequency test signals to the device structures under test;

with the test unit, receiving corresponding radio-frequency test signals from the device structures under test;

with the test unit, computing a complex impedance magnitude from the transmitted and received radio-frequency test signals; and

comparing the complex impedance data to reference data to determine whether the device structures under test is faulty.