Semiconductor package with an optical signal path, memory card including the same, and electronic system including the same

• US 9,158,081 B2
• Filed: 11/25/2013
• Issued: 10/13/2015
• Est. Priority Date: 07/04/2013
• Status: Active Grant

• Current Assignee: SK Hynix Inc.
• Original Assignee: SK Hynix Inc.
• Inventors: Kim, Taek Joong, Jo, Tae Ho, Park, Wan Choon, Park, Sung Su
• Primary Examiner(s): KIANNI, KAVEH C
• Application Number:
  US14/089,487
• Publication Number:
  US 20150010269A1
• Time in Patent Office: 687 Days
• Field of Search: 385/14, 385/50
• US Class Current: 1/1
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA

Abstract

A semiconductor package includes a substrate and an optical communication part. A first chip stack part and a second chip stack part are disposed over the substrate and are separate from each other, and the optical communication part is disposed in a cavity formed in the substrate to provide an optical signal path between the first and second chip stack parts.

Claims

1. A semiconductor package comprising:

a substrate;

a first chip stack structure and a second chip stack structure that are disposed over the substrate and are separate from each other;

an optical communication part including a first optical transceiver electrically coupled to the first chip stack structure and a second optical transceiver electrically coupled to the second chip stack structure, wherein the first and second optical transceivers are disposed to be faced with each other in a cavity which is formed in the substrate, and provides an optical signal path between the first and second chip stack structures; and

radiation holes disposed at a separation portion of the substrate, wherein the radiation holes are formed to pass through the separation portion so as to spread out heat that is generated from the first and second optical transceivers, and the separation portion of the substrate is disposed over the cavity and between the first and second chip stack structures.

2. The semiconductor package of claim 1,

wherein the optical communication part further includes a plurality of total reflectors which are disposed in the cavity to provide the optical signal path, and

wherein the plurality of total reflectors are aligned with the first and second optical transceivers.

3. The semiconductor package of claim 1, wherein the optical communication part further includes optical fibers which are disposed in the cavity and coupled to the first and second optical transceivers to provide the optical signal path between the first and second optical transceivers.

4. The semiconductor package of claim 1, further comprising:

first through substrate vias penetrating the substrate to electrically couple the first optical transceiver to the first chip stack structure; and

second through substrate vias penetrating the substrate to electrically couple the second optical transceiver to the second chip stack structure.

5. The semiconductor package of claim 1, wherein the first chip stack structure includes one or more memory chips that are stacked.

6. The semiconductor package of claim 5, wherein each memory chip is a DRAM chip.

7. The semiconductor package of claim 1, wherein the first chip stack structure includes a plurality of stacked memory chips which are electrically coupled to each other by through silicon vias (TSVs).

8. The semiconductor package of claim 1, wherein the second chip stack structure includes one or more logic chips that are stacked.