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System and method for heat dissipation

  • US 9,158,349 B2
  • Filed: 12/19/2013
  • Issued: 10/13/2015
  • Est. Priority Date: 10/04/2013
  • Status: Active Grant
First Claim
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1. An electronic system, comprising:

  • a first module comprising;

    at least one first-module electronic component;

    at least two first-module heat sinks thermally coupled to the at least one first-module electronic component, wherein there is a gap between the at least two first-module heat sinks;

    a second module comprising;

    at least one second-module electronic component; and

    at least one second-module heat sink thermally coupled to the at least one second-module electronic component,wherein the first and second modules are separated from each other by a predetermined distance such that the second-module heat sink is disposed in the gap between the at least two first-module heat sinks.

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