Method of making conductive patterns

• US 9,159,018 B2
• Filed: 04/26/2013
• Issued: 10/13/2015
• Est. Priority Date: 04/11/2003
• Status: Active Grant

• Current Assignee: Avery Dennison Retail Information Services LLC (Avery Dennison Corporation)
• Original Assignee: Avery Dennison Corporation
• Inventors: Coleman, James P., Edwards, David N., Forster, Ian J., Iyer, Pradeep, Licon, Mark A.
• Primary Examiner(s): PHAN, THIEM D
• Application Number:
  US13/871,097
• Publication Number:
  US 20130248608A1
• Time in Patent Office: 900 Days
• Field of Search: 296/00, 295/89, 295/91, 295/92, 298/25, 298/40, 298/46, 298/52, 298/85, 205/130, 205/135, 205/138, 205/137
• US Class Current: 1/1
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07752 using an interposer
• CPC Class Codes: G06K 19/0776 the adhering arrangement being a layer of adhesive, so that the record carrier can function as a sticker
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: H05K 2203/0117 Pattern shaped electrode used for patterning, e.g. plating or etching
• CPC Class Codes: H05K 3/00 Apparatus or processes for manufacturing printed circuits
• CPC Class Codes: H05K 3/205 using a pattern electroplated or electroformed on a metallic carrier
• CPC Class Codes: H05K 3/245 Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: Y10T 29/49016 Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49018 with other electrical component
• CPC Class Codes: Y10T 29/4902 Electromagnet, transformer or inductor
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49155 Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49224 with coating

Abstract

A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

Claims

1. A method of making conductive patterns, the method comprising:

placing an electrical component atop a conductive substrate;

creating on the conductive substrate a plurality of conductive patterns in a continuous sheet of conductive material;

treating areas of the conductive substrate or foil to alter properties

separating the continuous conductive material sheet from the conductive substrate and the conductive patterns; and

singulating the conductive patterns.

2. The method of claim 1, wherein the conductive substrate is part of a roller.

3. The method of claim 1, wherein the conductive substrate is part of a belt.

4. The method of claim 1, wherein the separating includes separating from a location within a plating bath where the plating is performed.

5. The method of claim 1, wherein the separating includes separating by pulling along the conductive material sheet.

6. The method of claim 5, further comprising winding the conductive material sheet.

7. The method of claim 1, wherein the treating includes roughening the areas.

8. The method of claim 1, wherein the treating includes depositing a granular conductive seed layer on the areas.

9. The method of claim 1, wherein the creating and the separating are performed as a continuous process.

10. The method of claim 1, further comprising operatively coupling chips to the conductive patterns to form RFID devices.

11. The method of claim 1, wherein the creating includes applying an aluminum foil.

12. A method of making conductive patterns, the method comprising:

applying a material on a substrate to form a plurality of conductive patterns in a continuous sheet of conductive material and placing an electrical component atop the conductive substrate;

treating areas of the conductive substrate or foil to alter properties of the material to create conductive patterns;

separating the continuous conductive material sheet from the substrate and the conductive patterns; and

singulating the conductive patterns.