Hybrid manganese and manganese nitride barriers for back-end-of-line metallization and methods for fabricating the same

• US 9,159,610 B2
• Filed: 10/23/2013
• Issued: 10/13/2015
• Est. Priority Date: 10/23/2013
• Status: Expired due to Fees

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: GlobalFoundries, Inc.
• Inventors: Zhang, Xunyuan, Chae, Moosung, Zhao, Larry
• Primary Examiner(s): Vu, David
• Application Number:
  US14/061,319
• Publication Number:
  US 20150108647A1
• Time in Patent Office: 720 Days
• Field of Search: 257/751, 257/288, 257/774, 438/627, 438/628, 438/618, 438/623, 438/631
• US Class Current: 1/1
• CPC Class Codes: H01L 21/76831 in via holes or trenches, e.g. non-conductive sidewall liners
• CPC Class Codes: H01L 21/76843 formed in openings in a dielectric
• CPC Class Codes: H01L 21/76846 Layer combinations
• CPC Class Codes: H01L 21/76855 After-treatment introducing at least one additional element into the layer
• CPC Class Codes: H01L 21/76856 by treatment in plasmas or gaseous environments, e.g. nitriding a refractory metal liner
• CPC Class Codes: H01L 21/76858 by diffusing alloying elements
• CPC Class Codes: H01L 23/53238 Additional layers associated with copper layers, e.g. adhesion, barrier, cladding layers
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method for fabricating an integrated circuit includes providing a conductive material overlying a semiconductor substrate and a dielectric material overlying the conductive material, wherein an opening exposes a surface of the conductive material and sidewalls of the dielectric material and selectively depositing a first layer of a first barrier material on the surface of the conductive material with the sidewalls of the dielectric material remaining exposed, the first barrier material being such that, if annealed in an annealing process, the first barrier material would diffuse into the conductive material. The method further includes modifying the first barrier material on the exposed surface to form a second barrier material, the second barrier material being such that, during an annealing process, the second barrier material does not diffuse into the conductive material and depositing a second layer of the first barrier material along the sidewalls of the opening. Still further, the method includes annealing the semiconductor substrate. Integrated circuits fabricated in accordance with the foregoing method are also disclosed.

Claims

1. A method for fabricating an integrated circuit comprising:

providing a conductive material overlying a semiconductor substrate and a dielectric material overlying the conductive material, wherein an opening exposes a surface of the conductive material and sidewalls of the dielectric material;

selectively depositing a first layer of a first barrier material on the surface of the conductive material with the sidewalls of the dielectric material remaining exposed, the first barrier material being diffusible into the conductive material at annealing temperatures;

modifying the first barrier material on the surface to form a second barrier material, the second barrier material being non-diffusable into the conductive material at annealing temperatures;

depositing a second layer of the first barrier material along the sidewalls of the opening; and

annealing the semiconductor substrate.

2. The method of claim 1, wherein providing the semiconductor substrate comprises forming the dielectric material over a metallization layer and etching the opening in the dielectric material layer to expose the metallization layer.

3. The method of claim 2, wherein forming the dielectric material comprises forming a silicon oxide material.

4. The method of claim 3, wherein etching the opening comprises exposing a copper metal inner-layer connection line.

5. The method of claim 3, wherein selectively depositing the first layer of the first barrier material comprises selectively depositing a manganese metal.

6. The method of claim 5, wherein selectively depositing the manganese metal comprises performing a chemical vapor deposition process using a manganese amidinate precursor.

7. The method of claim 5, wherein modifying the first barrier material comprises nitriding the manganese metal.

8. The method of claim 7, wherein nitriding the manganese metal comprises exposing the manganese metal to a nitrogen-containing plasma.

9. The method of claim 5, wherein depositing the second layer of the first barrier material comprises depositing a manganese metal.

10. The method of claim 9, wherein annealing the semiconductor substrate comprises forming a manganese silicate material on the sidewalls of the opening as a result of a reaction between the manganese metal deposited thereon and the silicon oxide dielectric material.

11. The method of claim 2, further comprising forming a layer of the conductive material so as to fill the opening prior to annealing the semiconductor substrate.

12. The method of claim 11, wherein forming the layer of the conductive material comprises forming a layer of copper metal.

13. The method of claim 12, further comprising polishing the layer of the conductive material subsequent to annealing the semiconductor substrate.

14. The method of claim 2, wherein providing the semiconductor substrate comprises providing a semiconductor substrate having one or more of a transistor or resistor structure formed thereon.

15. The method of claim 14, wherein providing the semiconductor substrate comprises providing a semiconductor substrate with the one or more of the transistor or resistor structure formed under the metallization layer.

16. A method for fabricating an integrated circuit comprising:

providing a conductive material and a dielectric material overlying the conductive material, wherein an opening exposes a surface of the conductive material and sidewalls of the dielectric material;

selectively depositing a first layer of a manganese metal barrier material on the exposed surface of the opening but not on the sidewalls of the opening;

modifying the manganese barrier material on the exposed surface to form a manganese nitride barrier material;

depositing a second layer of the manganese barrier material along the sidewalls of the opening; and

annealing the semiconductor substrate to form a manganese silicate material along the sidewalls of the opening.

17. The method of claim 16, wherein the semiconductor substrate is a bulk silicon substrate.

18. The method of claim 16, wherein the semiconductor substrate is a silicon-on-insulator substrate.

19. The method of claim 16, wherein a cap layer is disposed between a portion of the metallization layer and the dielectric material layer.

20. An integrated circuit structure comprising:

a semiconductor substrate;

an electrical device overlying the semiconductor substrate;

a copper metallization layer over the electrical device;

a silicon oxide dielectric material layer overlying the metallization layer, the dielectric material layer having an opening therein comprising a bottom portion and sidewalls;

a manganese nitride layer at the bottom portion of the opening and in abutting contact with the metallization layer;

a manganese silicate layer along the sidewalls; and

a copper interconnect structure filling the opening and in abutting contact with the manganese nitride layer and the manganese silicate layer.