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Method and system for template assisted wafer bonding using pedestals

  • US 9,159,631 B2
  • Filed: 04/24/2014
  • Issued: 10/13/2015
  • Est. Priority Date: 01/04/2012
  • Status: Active Grant
First Claim
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1. A method of fabricating a composite semiconductor structure, the method comprising:

  • providing a first substrate comprising;

    a first surface; and

    a pedestal, wherein;

    the pedestal extends from the first surface to a predetermined height; and

    the pedestal extends in a direction normal to the first surface;

    providing a second substrate comprising a first material and a recess;

    attaching an element made of a second material to the pedestal;

    bonding the element in the recess of the second substrate to form the composite semiconductor structure, wherein the first surface of the first substrate does not contact the second substrate; and

    removing at least a portion of the first substrate from the composite structure.

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