Method and system for template assisted wafer bonding using pedestals
First Claim
1. A method of fabricating a composite semiconductor structure, the method comprising:
- providing a first substrate comprising;
a first surface; and
a pedestal, wherein;
the pedestal extends from the first surface to a predetermined height; and
the pedestal extends in a direction normal to the first surface;
providing a second substrate comprising a first material and a recess;
attaching an element made of a second material to the pedestal;
bonding the element in the recess of the second substrate to form the composite semiconductor structure, wherein the first surface of the first substrate does not contact the second substrate; and
removing at least a portion of the first substrate from the composite structure.
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Accused Products
Abstract
A method of fabricating a composite semiconductor structure includes providing a first substrate comprising a first material and having a first surface and forming a plurality of pedestals extending to a predetermined height in a direction normal to the first surface. The method also includes attaching a plurality of elements comprising a second material to each of the plurality of pedestals, providing a second substrate having one or more structures disposed thereon, and aligning the first substrate and the second substrate. The method further includes joining the first substrate and the second substrate to form the composite substrate structure and removing at least a portion of the first substrate from the composite substrate structure.
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Citations
20 Claims
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1. A method of fabricating a composite semiconductor structure, the method comprising:
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providing a first substrate comprising; a first surface; and a pedestal, wherein; the pedestal extends from the first surface to a predetermined height; and the pedestal extends in a direction normal to the first surface; providing a second substrate comprising a first material and a recess; attaching an element made of a second material to the pedestal; bonding the element in the recess of the second substrate to form the composite semiconductor structure, wherein the first surface of the first substrate does not contact the second substrate; and removing at least a portion of the first substrate from the composite structure.
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2. A method of fabricating a composite semiconductor structure, the method comprising:
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providing a first substrate comprising; a first surface; and a pedestal, wherein; the pedestal extends from the first surface to a predetermined height; and the pedestal extends in a direction normal to the first surface; providing a second substrate comprising a first material and a recess; attaching an element made of a second material to the pedestal; and bonding the element in the recess of the second substrate to form the composite semiconductor structure, wherein the first surface of the first substrate does not contact the second substrate. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of fabricating a composite semiconductor structure, the method comprising:
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providing a SOI substrate; providing a photonic die; providing an assembly substrate, the assembly substrate comprising; a first surface; and a pedestal, wherein; the pedestal extends from the first surface to a predetermined height; and the pedestal extends in a direction normal to the first surface; mounting the photonic die to the pedestal of the assembly substrate; and joining the photonic die to the SOI substrate to form the composite structure, wherein the first surface of the assembly substrate does not contact the SOI substrate. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification