Semiconductor device

• US 9,159,840 B2
• Filed: 08/11/2014
• Issued: 10/13/2015
• Est. Priority Date: 09/22/2011
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei, Isobe, Atsuo, Sasaki, Toshinari
• Primary Examiner(s): Feeney, Brett
• Assistant Examiner(s): NGUYEN, SOPHIA T
• Application Number:
  US14/456,330
• Publication Number:
  US 20140346508A1
• Time in Patent Office: 428 Days
• US Class Current: 1/1
• CPC Class Codes: H01L 27/12 the substrate being other than a semiconductor body, e.g. an insulating body
• CPC Class Codes: H01L 27/1225 with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
• CPC Class Codes: H01L 29/10 with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
• CPC Class Codes: H01L 29/41733 for thin film transistors with insulated gate
• CPC Class Codes: H01L 29/41775 characterised by the proximity or the relative position of the source or drain electrode and the gate electrode, e.g. the source or drain electrode separated from the gate electrode by side-walls or spreading around or above the gate electrode
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

Provided is a semiconductor device including a transistor with large on-state current even when it is miniaturized. The transistor includes a pair of first conductive films over an insulating surface; a semiconductor film over the pair of first conductive films; a pair of second conductive films, with one of the pair of second conductive films and the other of the pair of second conductive films being connected to one of the pair of first conductive films and the other of the pair of first conductive films, respectively; an insulating film over the semiconductor film; and a third conductive film provided in a position overlapping with the semiconductor film over the insulating film. Further, over the semiconductor film, the third conductive film is interposed between the pair of second conductive films and away from the pair of second conductive films.

Claims

1. A semiconductor device comprising:

a first conductive film and a second conductive film over an insulating surface;

an oxide semiconductor film over and in contact with the first conductive film and the second conductive film;

a third conductive film over the oxide semiconductor film, the third conductive film being in contact with the first conductive film;

a fourth conductive film over the oxide semiconductor film, the fourth conductive film being in contact with the second conductive film;

an insulating film over the oxide semiconductor film, the third conductive film, and the fourth conductive film; and

a fifth conductive film over the insulating film,

wherein the fifth conductive film overlaps the first conductive film and the second conductive film, and

wherein the fifth conductive film does not overlap the third conductive film and the fourth conductive film.

2. The semiconductor device according to claim 1,

wherein a length of the oxide semiconductor film in a channel width direction is smaller than a length of each of the first conductive film and the second conductive film in the channel width direction, and

wherein the length of the oxide semiconductor film in the channel width direction is larger than a length of each of the third conductive film and the fourth conductive film in the channel width direction.

3. The semiconductor device according to claim 1, wherein a gap between the third conductive film and the fourth conductive film is longer than a gap between the first conductive film and the second conductive film.

4. The semiconductor device according to claim 1,

wherein the third conductive film is provided in contact with an end portion of the first conductive film, and

wherein the fourth conductive film is provided in contact with an end portion of the second conductive film.

5. The semiconductor device according to claim 1, wherein each of the first conductive film and the second conductive film has a thickness of greater than or equal to 10 nm and less than or equal to 300 nm.

6. The semiconductor device according to claim 1, wherein the oxide semiconductor film comprises indium, gallium, and zinc.

7. The semiconductor device according to claim 1, wherein the oxide semiconductor film comprises indium, tin, and zinc.

8. A semiconductor device comprising:

a first conductive film and a second conductive film over an insulating surface;

an oxide semiconductor film over and in contact with the first conductive film and the second conductive film, the oxide semiconductor film having a first opening and a second opening;

a third conductive film over the oxide semiconductor film, the third conductive film being in contact with the first conductive film through the first opening;

a fourth conductive film over the oxide semiconductor film, the fourth conductive film being in contact with the second conductive film through the second opening;

an insulating film over the oxide semiconductor film, the third conductive film, and the fourth conductive film; and

a fifth conductive film over the insulating film,

wherein the fifth conductive film overlaps the first conductive film and the second conductive film, and

wherein the fifth conductive film does not overlap the third conductive film and the fourth conductive film.

9. The semiconductor device according to claim 8,

wherein a length of the oxide semiconductor film in a channel width direction is smaller than a length of each of the first conductive film and the second conductive film in the channel width direction, and

wherein the length of the oxide semiconductor film in the channel width direction is larger than a length of each of the third conductive film and the fourth conductive film in the channel width direction.

10. The semiconductor device according to claim 8, wherein a gap between the third conductive film and the fourth conductive film is longer than a gap between the first conductive film and the second conductive film.

11. The semiconductor device according to claim 8,

wherein the third conductive film is provided in contact with an end portion of the first conductive film, and

wherein the fourth conductive film is provided in contact with an end portion of the second conductive film.

12. The semiconductor device according to claim 8, wherein each of the first conductive film and the second conductive film has a thickness of greater than or equal to 10 nm and less than or equal to 300 nm.

13. The semiconductor device according to claim 8, wherein the oxide semiconductor film comprises indium, zinc, and one of gallium and tin.