LED on silicon substrate using zinc-sulfide as buffer layer

• US 9,159,869 B2
• Filed: 01/17/2014
• Issued: 10/13/2015
• Est. Priority Date: 08/03/2011
• Status: Active Grant

• Current Assignee: Seoul Semiconductor Co., Ltd.
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Chen, Zhen
• Primary Examiner(s): YUSHINA, GALINA G
• Application Number:
  US14/158,426
• Publication Number:
  US 20140134765A1
• Time in Patent Office: 634 Days
• Field of Search: 438/22, 438/29, 438/46, 438/47, 438/455
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01012 Magnesium [Mg]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01322 Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/3512 Cracking
• CPC Class Codes: H01L 33/007 comprising nitride compounds
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/10 with a light reflecting structure, e.g. semiconductor Bragg reflector
• CPC Class Codes: H01L 33/12 with a stress relaxation structure, e.g. buffer layer
• CPC Class Codes: H01L 33/22 Roughened surfaces, e.g. at the interface between epitaxial layers
• CPC Class Codes: H01L 33/62 : Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A vertical GaN-based blue LED has an n-type GaN layer that was grown over a ZnS layer that in turn was grown directly on a silicon substrate. In one example, the ZnS layer is a transitional buffer layer that is 50 nm thick, and the n-type GaN layer is at least 2000 nm thick. Growing the n-type GaN layer on the ZnS buffer layer reduces lattice defect density in the n-type layer. The ZnS buffer layer provides a good lattice constant match with the silicon substrate and provides a compound polar template for subsequent GaN growth. After the epitaxial layers of the LED are formed, a conductive carrier is wafer bonded to the structure. The silicon substrate and the ZnS buffer layer are then removed. Electrodes are added and the structure is singulated to form finished LED devices.

Claims

1. A method of manufacturing a light emitting device, comprising:

forming a zinc-sulfide (ZnS) layer directly on a silicon substrate;

forming a zinc-telluride (ZnTe) layer directly on the ZnS layer;

forming a template layer on the ZnTe layer;

forming an epitaxial light emitting device structure on the template layer, wherein the epitaxial light emitting device structure includes an n-type semiconductor layer, a p-type semiconductor layer and an active layer between the n-type semiconductor layer and the p-type semiconductor layer;

forming a reflective layer on the epitaxial light emitting device structure;

forming a barrier metal layer on the reflective layer;

forming a first bond metal layer on the barrier metal layer thereby forming a first structure;

bonding a conductive carrier on the first bond metal layer of the first structure thereby forming a second structure, wherein an adhesion and the barrier metal layer are formed on a first surface of the conductive carrier, and the adhesion and the barrier metal layer are sandwiched between the conductive carrier and the first bond metal layer; and

removing layers from the first structure from a side of the silicon substrate thereby exposing a surface of the n-type semiconductor layer.

2. The method of manufacturing of claim 1, further comprising:

after removing the layers from the first structure, roughening the surface of the n-type semiconductor layer.

3. The method of manufacturing of claim 1, wherein the bonding of the conductive carrier involves using a eutectic bond metal layer to wafer bond a carrier wafer structure to the first structure, and wherein the conductive carrier is a part of the carrier wafer structure.

4. The method of manufacturing of claim 1, wherein the n-type semiconductor layer has a thickness of at least two thousand nanometers.

5. The method of manufacturing of claim 1, wherein the ZnS layer is less than one hundred nanometers thick.

6. The method of manufacturing of claim 1, wherein a second bond metal layer is formed on the first surface of the conductive carrier, and the second bond metal layer is sandwiched between the adhesion and barrier metal layer and the first bond metal layer.

7. The method of manufacturing of claim 1, further comprising:

forming an electrode having a grid shape in a top view on the n-type semiconductor layer.

8. The method of manufacturing of claim 1, further comprising:

forming a metal layer on a second surface of the conductive carrier thereby forming a third structure, wherein the second surface of the conductive carrier is opposite to the first surface thereof.

9. The method of manufacturing of claim 8, further comprising:

singulating the third structure into individual light emitting devices.

10. The method of manufacturing of claim 9, further comprising:

mounting at least one of the individual light emitting devices on a printed circuit board via a bonding layer.

11. The method of manufacturing of claim 9, further comprising:

mounting the individual light emitting devices and a retaining ring on a printed circuit board, wherein the individual light emitting devices are surrounded by the retaining ring on the printed circuit board.

12. The method of manufacturing of claim 11, further comprising:

forming a phosphor surrounded by the retaining ring on the printed circuit board so that the phosphor covers the individual light emitting devices.

13. A method of manufacturing a light emitting device, comprising:

forming a zinc-sulfide (ZnS) layer directly on a silicon substrate;

forming a boron-nitride (BN) layer directly on the ZnS layer;

forming a template on the BN layer;

forming an epitaxial light emitting device structure on the template layer, wherein the epitaxial light emitting device structure includes an n-type semiconductor layer, a p-type semiconductor layer and an active layer between the n-type semiconductor layer and the p-type semiconductor layer;

forming a reflective layer on the epitaxial light emitting device structure;

forming a barrier metal layer on the reflective layer;

forming a first bond metal layer on the barrier metal layer thereby forming a first structure;

bonding a conductive carrier on the first bond metal layer of the first structure thereby forming a second structure, wherein an adhesion and the barrier metal layer are formed on a first surface of the conductive carrier, and the adhesion and the barrier metal layer are sandwiched between the conductive carrier and the first bond metal layer; and

removing layers from the first structure from a side of the silicon substrate thereby exposing a surface of the n-type semiconductor layer.

14. The method of manufacturing of claim 13, further comprising:

after removing the layers from the first structure, roughening the surface of the n-type semiconductor layer.

15. The method of manufacturing of claim 13, wherein the bonding of the conductive carrier involves using a eutectic bond metal layer to wafer bond a carrier wafer structure to the first structure, and wherein the conductive carrier is apart of the carrier wafer structure.

16. The method of manufacturing of claim 13, wherein the n-type semiconductor layer has a thickness of at least two thousand nanometers.

17. The method of manufacturing of claim 13, wherein the ZnS layer is less than one hundred nanometers thick.

18. The method of manufacturing of claim 13, further comprising:

forming an aluminum-gallium-nitride (AIGaN) on the BN layer, wherein the ZnS layer, the BN layer, and the AIGaN layer form a buffer layer.

19. The method of manufacturing of claim 13, wherein a second bond metal layer is formed on the first surface of the conductive carrier, and the second bond metal layer is sandwiched between the adhesion and barrier metal layer and the first bond metal layer.

20. The method of manufacturing of claim 13, further comprising:

forming an electrode having a grid shape in a top view on the n-type semiconductor layer.

21. The method of manufacturing of claim 13, further comprising:

forming a metal layer on a second surface of the conductive carrier thereby forming a third structure, wherein the second surface of the conductive carrier is opposite to the first surface thereof.

22. The method of manufacturing of claim 21, further comprising:

singulating the third structure into individual light emitting devices.

23. The method of manufacturing of claim 22, further comprising:

mounting at least one of the individual light emitting devices on a printed circuit board via a bonding layer.

24. The method of manufacturing of claim 22, further comprising:

mounting the individual light emitting devices and a retaining ring on a printed circuit board, wherein the individual light emitting devices are surrounded by the retaining ring on the printed circuit board.

25. The method of manufacturing of claim 24, further comprising:

forming a phosphor surrounded by the retaining ring on the printed circuit board so that the phosphor covers the individual light emitting devices.