Mobile device cover including at least one antenna

• US 9,160,061 B2
• Filed: 05/19/2014
• Issued: 10/13/2015
• Est. Priority Date: 11/26/2010
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Konanur, Anand, Karacaoglu, Ulun, Yang, Songnan, McEuen, Shawn
• Primary Examiner(s): TRAIL, ALLYSON NEEL
• Application Number:
  US14/280,796
• Publication Number:
  US 20140333489A1
• Time in Patent Office: 512 Days
• Field of Search: 235/702, 235/700, 235/745, 235/873, 343/702, 343/742, 343/700, 343/745, 343/873
• US Class Current: 1/1
• CPC Class Codes: H01Q 1/2266 disposed inside the computer
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 1/40 Radiating elements coated with or embedded in protective material
• CPC Class Codes: H01Q 21/28 Combinations of substantially independent non-interacting antenna units or systems multiple beam H01Q25/00

Abstract

Embodiments of systems and methods for providing in-mold laminate antennas are generally described herein. Other embodiments may be described and claimed.

Claims

1. A mobile device comprising:

a circuit to process wireless signals communicated by said mobile device;

at least one conductor element electrically coupled to said circuit; and

a cover including;

a housing comprising a first surface, and a second surface opposite to said first surface;

an antenna to wirelessly communicate said wireless signals, wherein at least a portion of the antenna is between said first and second surfaces; and

a connector comprising a first connector portion connected to said antenna, and a second connector portion being exposed to said second surface, wherein the second connector portion is in contact with said at least one conductor element to electrically couple said antenna to said circuit.

2. The mobile device of claim 1, wherein said second connector portion is elastically flexible.

3. The mobile device of claim 1, wherein the cover comprises an injected mold layer, said antenna being in contact with a surface of said mold layer.

4. The mobile device of claim 1, wherein said at least one conductor element comprises first and second conductor elements, said second connector portion comprises a dual connector including:

a first connector element to connect to said first conductor element; and

a second connector element to connect to said second conductor element.

5. The mobile device of claim 1, wherein said second surface faces a circuit board of said mobile device, when said second connector portion is in contact with said at least one conductor element.

6. The mobile device of claim 1 comprising a plurality of antennas between said first and second surfaces.

7. A cover to cover a mobile device, the cover including:

a housing comprising a first surface, and a second surface opposite to said first surface;

an antenna to wirelessly communicate signals of said mobile device, wherein at least a portion of the antenna is between said first and second surfaces; and

a connector including a first connector portion connected to said antenna, and a second connector portion being exposed to said second surface to electrically couple said antenna to a circuit of said mobile device.

8. The cover of claim 7, wherein said second connector portion is elastically flexible.

9. The cover of claim 7 further comprising an injected mold layer, said antenna being in contact with a surface of said mold layer.

10. The cover of claim 7, wherein said second connector portion comprises a dual connector including:

a first connector element connectable to a first conductor element; and

a second connector element connectable to a second conductor element.

11. The cover of claim 7 comprising a plurality of antennas between said first and second surfaces.

12. A mobile device comprising:

a circuit to process wireless signals communicated by said mobile device;

at least one conductor element electrically coupled to said circuit; and

a cover including;

a housing comprising a first surface, and a second surface opposite to said first surface;

first and second antennas to wirelessly communicate said signals, wherein at least a portion of said first and second antennas is between said first and second surfaces; and

a connector comprising a first connector portion connected to said first and second antennas, and a second connector portion being exposed to said second surface, wherein the second connector portion is in contact with said at least one conductor element to electrically couple said first and second antennas to said circuit.

13. The mobile device of claim 12, wherein said second connector portion is elastically flexible.

14. The mobile device of claim 12, wherein the cover comprises an injected mold layer, said first and second antennas being in contact with a surface of said mold layer.

15. The mobile device of claim 12, wherein said at least one conductor element comprises first and second conductor elements, said second connector portion comprises a dual connector including:

a first connector element to connect to said first conductor element; and

a second connector element to connect to said second conductor element.

16. The mobile device of claim 12, wherein said second surface faces a circuit board of said electronic mobile device, when said second connector portion is in contact with said at least one conductor element.