Communication module

• US 9,160,825 B2
• Filed: 09/09/2014
• Issued: 10/13/2015
• Est. Priority Date: 10/30/2013
• Status: Active Grant

• Current Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Original Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Inventors: Saji, Tetsuo, Ichikawa, Yohei, Nakamura, Hiroshi
• Primary Examiner(s): Wendell, Andrew
• Assistant Examiner(s): Soltanzadeh, Maryam
• Application Number:
  US14/481,779
• Publication Number:
  US 20150119102A1
• Time in Patent Office: 399 Days
• Field of Search: 455/575.1, 257/659, 257/660
• US Class Current: 1/1
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2225/06517 Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 23/31 characterised by the arrangement or shape
• CPC Class Codes: H01L 23/5383 Multilayer substrates H01L23/5385 takes precedence; multilayer metallisation on monolayer substrates H01L23/538
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/16 of an individual bump connector
• CPC Class Codes: H01L 24/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/014 Solder alloys
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H04B 1/38 : Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
• CPC Class Codes: H04B 1/3888 : Arrangements for carrying or protecting transceivers
• CPC Class Codes: H04B 15/02 : Reducing interference from electric apparatus by means located at or near the interfering apparatus
• CPC Class Codes: H04B 15/04 : the interference being caused by substantially sinusoidal oscillations, e.g. in a receiver or in a tape-recorder
• CPC Class Codes: H04M 1/026 : Details of the structure or mounting of specific components
• CPC Class Codes: H05K 1/0218 : by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/0243 : Printed circuits associated with mounted high frequency components
• CPC Class Codes: H05K 2201/0715 : provided by an outer layer of PCB
• CPC Class Codes: H05K 2201/10371 : Shields or metal cases
• CPC Class Codes: H05K 3/284 : for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 9/0022 : of components mounted on printed circuit boards [PCB] shields integrated within component packages H01L23/552; shields integrated within PCB H05K1/0218
• CPC Class Codes: H05K 9/0045 : being rigid plastic containers having a coating of shielding material

Abstract

A communication module includes a circuit substrate having a first high-frequency processing section related to mobile phone communication, a second high-frequency processing section that processes reception signals related to satellite positioning systems, a system section having a baseband processing section and application processing section, and a power circuit section, a sealing member covering the electronic components mounted on the circuit substrate, a conductive shield layer formed on a surface of the sealing member, and a shield wall formed in the sealing member so as to demarcate a mounting area of the first high-frequency processing section and a mounting area of the second high-frequency processing section.

Claims

1. A communication module, comprising:

a circuit substrate having (a) a first high-frequency processing section that processes high-frequency signals related to mobile phone communication, (b) a system section having a baseband processing area that processes baseband signals related to mobile phone communication and an application processing area that processes various types of mobile phone application operations, and (c) a power circuit section that includes a first power circuit section that supplies power to the first high-frequency processing section and a second power circuit section that supplies power to the system section;

a sealing member formed on an entire main surface of the circuit substrate, the sealing member covering electronic components mounted on said main surface;

a shield layer that is conductive and formed on a surface of the sealing member;

a first shield wall that fills a groove formed from a main surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating a mounting area of either one or both of the system section and the power circuit section and a mounting area of the first high-frequency processing section, the first shield wall being connected to the shield layer; and

a second shield wall that fills a groove formed from the main surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating a mounting area of the first power circuit section and a mounting area of the second power circuit section, the second shield wall being connected to the shield layer.

2. The communication module according to claim 1, wherein a primary processing part of the baseband processing area and a primary processing part of the application processing area are integrated into one integrated circuit.

5. The communication module according to claim 1,

wherein the circuit substrate is made of conductive layers and insulating layers stacked together, and has a core layer that is a conductive layer, the core layer being thicker than other conductive layers and functioning as ground, and

wherein one or more electronic components forming a part of at least one of the first high-frequency processing section, the system section, and the power circuit section are arranged in a through-hole or a recessed portion formed in the core layer of the circuit substrate.

6. The communication module according to claim 2,

wherein the circuit substrate is made of conductive layers and insulating layers stacked together, and has a core layer that is a conductive layer, the core layer being thicker than other conductive layers and functioning as ground, and

wherein one or more electronic components forming a part of at least one of the first high-frequency processing section, the system section, and the power circuit section are arranged in a through-hole or a recessed portion formed in the core layer of the circuit substrate.

3. A communication module, comprising:

a circuit substrate having (a) a first high-frequency processing section that processes high-frequency signals related to mobile phone communication and a second high-frequency processing section that is included with the circuit substrate and that processes high-frequency signals related to non-mobile phone communication, (b) a system section having a baseband processing area that processes baseband signals related to mobile phone communication and an application processing area that processes various types of mobile phone application operations, and (c) a power circuit section;

a sealing member formed on an entire main surface of the circuit substrate, the sealing member covering electronic components mounted on said main surface;

a shield layer that is conductive and formed on a surface of the sealing member;

a first shield wall that fills a groove formed from a main surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating a mounting area of either one or both of the system section and the power circuit section and a mounting area of the first high-frequency processing section, the first shield wall being connected to the shield layer; and

a second shield wall that fills a groove formed from the main surface of the sealing member toward the main surface of the circuit substrate, the groove demarcating a mounting area of either one or both of the system section and the power circuit section and a mounting area of the second high-frequency processing section, the second shield wall being connected to the shield layer.

4. The communication module according to claim 3,

wherein the mounting area of the system section is arranged between the mounting area of the first high-frequency processing section and the mounting area of the second high-frequency processing section.

7. The communication module according to claim 3, wherein the circuit substrate is made of conductive layers and insulating layers stacked together, and has a core layer that is a conductive layer, the core layer being thicker than other conductive layers and functioning as ground, and

wherein one or more electronic components forming a part of at least one of the first high-frequency processing section, the system section, and the power circuit section are arranged in a through-hole or a recessed portion formed in the core layer of the circuit substrate.

8. The communication module according to claim 4,

wherein the circuit substrate is made of conductive layers and insulating layers stacked together, and has a core layer that is a conductive layer, the core layer being thicker than other conductive layers and functioning as ground, and

wherein one or more electronic components forming a part of at least one of the first high-frequency processing section, the system section, and the power circuit section are arranged in a through-hole or a recessed portion formed in the core layer of the circuit substrate.