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Systems and methods for encapsulating electronics in a mountable device

  • US 9,161,712 B2
  • Filed: 03/26/2013
  • Issued: 10/20/2015
  • Est. Priority Date: 03/26/2013
  • Status: Active Grant
First Claim
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1. A mountable device, comprising:

  • a polymer, wherein the polymer defines at least one mounting surface of the mountable device; and

    a bio-compatible structure embedded in the polymer, wherein the bio-compatible structure has a first side and a second side opposite the first side and comprises an electronic component and sensor electrodes electrically connected to the electronic component, wherein the sensor electrodes include a first portion, a second portion, and a third portion in which the second portion is between the first and third portions, wherein a bio-compatible material fully encapsulates the bio-compatible structure except for the sensor electrodes, wherein the bio-compatible structure has at least one opening in the second side over the sensor electrodes and at least a first opening and a second opening in the first side, and wherein the first opening in the first side is connected to the at least one opening in the second side directly between the first portion and the second portion of the sensor electrodes and the second opening in the first side is connected to the at least one opening in the second side directly between the second portion and the third portion of the sensor electrodes.

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