Method and device for the removal of material by means of laser pulses

• US 9,162,319 B2
• Filed: 08/21/2006
• Issued: 10/20/2015
• Est. Priority Date: 08/22/2005
• Status: Active Grant

• Current Assignee: Rowiak GmbH
• Original Assignee: Rowiak GmbH
• Inventors: Lubatschowski, Holger, Ripken, Tammo, Rathjen, Christian
• Primary Examiner(s): Tran, Thien S
• Application Number:
  US11/990,888
• Publication Number:
  US 20090294422A1
• Time in Patent Office: 3,347 Days
• Field of Search: 219/121.68, 219/121.69, 219/121.73, 219/121.75, 219/121.76, 219/121.77, 219/121.85, 604/20, 604/289, 604/294, 600/310, 600/473, 600/476, 607/88, 607/89, 607/90, 607/92, 607/93, 607/94, 606 4- 18, 606/128
• US Class Current: 1/1
• CPC Class Codes: B23K 26/0624 using ultrashort pulses, i.e. pulses of 1ns or less
• CPC Class Codes: B23K 26/0626 Energy control of the laser beam B23K26/0622 takes precedence
• CPC Class Codes: B23K 26/38 by boring or cutting

Abstract

The invention relates to a method for removing material by means of a laser, wherein a sequence of laser pulses is generated and an area of material to be machined is irradiated with the sequence of laser pulses. Methods of this kind are used to cut a number of different materials. One problem with this method is that thermal or mechanical damage occurs in the surroundings of the area being machined and causes impairment of areas of material that are not being machined. The invention solves this problem by the pulse energy of a single pulse in the sequence of laser pulses being lower than the laser pulse energy required to produce material removal using an isolated laser pulse in the region irradiated with the single laser pulse of the sequence of laser pulses.

Claims

1. A method for removing material by means of a laser, wherein a sequence of laser pulses is generated and an area of material to be machined is irradiated with the sequence of laser pulses,

characterized in that a pulse energy of each pulse in the sequence of laser pulses is lower than a laser pulse energy required to produce the removal of material by an isolated laser pulse in the area irradiated by a single pulse of the sequence of laser pulses, wherein the irradiated area is spatially overlapped by two consecutive laser pulses of the sequence of laser pulses to an extent of less than 50%, wherein each of the two consecutive laser pulses have a substantially similar duration and intensity, wherein a continuous ablation area is removed from the material by the sequence of laser pulses, wherein the material is removed through the accumulation of thermal energy over the two consecutive laser pulses, wherein an area that is not spatially overlapped by the two consecutive laser pulses is removed from the material through diffusion of the thermal energy over the irradiated area, and wherein a repetition rate of the two consecutive laser pulses is below 100 MHz.

2. The method of claim 1,

characterized in that the laser pulse energy is reduced by reducing the laser pulse intensity or the laser pulse duration.

3. The method of claim 1,

characterized in that the irradiated area is spatially overlapped by at least two consecutive laser pulses of the sequence of laser pulses.

4. The method of claim 1,

characterized in that the laser pulse energy, the laser pulse intensity, the dimensions of a focused area, the laser pulse duration of a single laser pulse, the laser pulse repetition rate of the sequence of laser pulses or a feed speed between a laser beam of the laser and the material to be machined is preset according to the properties of the material.

5. The method of claim 1,

characterized in that at least two laser pulses are delivered to the material to be removed within a duration specific to the material to be removed.

6. The method of claim 5,

characterized in that the laser pulse repetition rate is greater than 10 Hz.

7. The method of claim 1,

characterized in that the laser pulse energy, the laser pulse intensity, the dimensions of a focused area, the laser pulse duration of a single laser pulse of the sequence of laser pulses, the laser pulse repetition rate of the sequence of laser pulses or a feed speed between a laser beam of the laser and the material to be machined is altered during the machining operation.

8. The method of claim 7,

characterized in that a first laser pulse energy is set for a first laser pulse repetition rate and a second laser pulse energy that is lower than the first laser pulse energy is set for a second laser pulse repetition rate that is higher than the first laser pulse repetition rate.

9. The method of claim 8,

characterized in that

a. the laser pulse repetition rate is automatically set according to the laser pulse energy, or

b. the laser pulse energy is automatically set according to the laser pulse repetition rate,

c. the laser pulse repetition rate is automatically set according to the feed speed, or

d. the laser pulse repetition rate, the laser pulse energy or the feed speed are automatically set according to at least one property of the material to be removed.

10. The method of claim 1,

characterized in that, in a starting region for the removal operation, the total energy introduced at one location on the material to be machined is greater than in a region during the further course of the removal operation.

11. The method of claim 1,

characterized in that the laser pulse energy or the laser pulse repetition rate is higher or a feed speed between a laser beam of the laser and the material to be machined is lower in the starting region for the removal operation than in the further course of the removal operation.

12. The method of claim 1,

characterized in that the laser pulse intensity is higher or the laser pulse duration of a single laser pulse in a starting region of the removal operation is longer than in a region during the further course of the removal operation.

13. The method of claim 1,

characterized in that the laser pulse duration is less than ten picoseconds.

14. The method of claim 1,

characterized in that a laser beam of the laser is focused such that material removal is achieved under the surface of a semi or fully transparent material, without regions of material lying which are above or below the removal region being damaged.

15. The method of claim 7,

characterized in that the removal operation is observed and a decline in removal performance causes the total energy introduced to be increased by altering one of the parameters referred to in claim 7.

24. The method of claim 1, wherein the percentage of overlap is defined as

16. A method for removing material by means of a laser, wherein a sequence of laser pulses is generated and an area of material to be machined is irradiated with the sequence of laser pulses,

characterized in that the pulse energy of each pulse in the sequence of laser pulses is lower than the laser pulse energy required to produce the removal of material by an isolated laser pulse in the area irradiated by a single pulse of the sequence of laser pulses, wherein each of the two consecutive laser pulses have a substantially similar duration and intensity, wherein a continuous ablation area is removed from the material by the sequence of laser pulses, wherein the material is removed through the accumulation of thermal energy over the two consecutive laser pulses, wherein an area that is not spatially overlapped by the two consecutive laser pulses is removed from the material through diffusion of the thermal energy over the irradiated area, and wherein a repetition rate of the two consecutive laser pulses is below 100 MHz;

and

wherein the laser pulses of the sequence of laser pulses are generated by the same laser.

17. The method of claim 16, wherein the irradiated area is spatially overlapped by two consecutive laser pulses of the sequence of laser pulses to an extent of less than 50%.

18. A method for removing material by means of a laser, wherein a sequence of laser pulses is generated and an area of material to be machined is irradiated with the sequence of laser pulses,

characterized in that the pulse energy of each pulse in the sequence of laser pulses is lower than the laser pulse energy required to produce the removal of material by an isolated laser pulse in the area irradiated by a single pulse of the sequence of laser pulses, wherein each of the two consecutive laser pulses have a substantially similar duration and intensity, wherein a continuous ablation area is removed from the material by the sequence of laser pulses, wherein the material is removed through the accumulation of thermal energy over the two consecutive laser pulses, wherein an area that is not spatially overlapped by the two consecutive laser pulses is removed from the material through diffusion of the thermal energy over the irradiated area, and wherein a repetition rate of the two consecutive laser pulses is below 100 MHz, and

wherein the removal of material is effected by photo disruption.

19. The method of claim 18, wherein the irradiated area is spatially overlapped by two consecutive laser pulses of the sequence of laser pulses to an extent of less than 50%.

20. A method for removing material by means of a laser, wherein a sequence of laser pulses is generated and an area of material to be machined is irradiated with the sequence of laser pulses,

characterized in that the pulse energy of each pulse in the sequence of laser pulses is lower than the laser pulse energy required to produce the removal of material by an isolated laser pulse in the area irradiated by a single pulse of the sequence of laser pulses, wherein each of the two consecutive laser pulses have a substantially similar duration and intensity, wherein a continuous ablation area is removed from the material by the sequence of laser pulses, wherein the material is removed through the accumulation of thermal energy over the two consecutive laser pulses, wherein an area that is not spatially overlapped by the two consecutive laser pulses is removed from the material through diffusion of the thermal energy over the irradiated area, and wherein a repetition rate of the two consecutive laser pulses is below 100 MHz, and

wherein the sequence of laser pulse comprises more than two laser pulses applied at a constant laser pulse repetition rate.

21. The method of claim 20, wherein the irradiated area is spatially overlapped by two consecutive laser pulses of the sequence of laser pulses to an extent of less than 50%.

22. A method for removing material by means of a laser, wherein a sequence of laser pulses is generated and an area of material to be machined is irradiated with the sequence of laser pulses,

characterized in that the pulse energy of each pulse in the sequence of laser pulses is lower than the laser pulse energy required to produce the removal of material by an isolated laser pulse in the area irradiated by a single pulse of the sequence of laser pulses, wherein each of the two consecutive laser pulses have a substantially similar duration and intensity, wherein a continuous ablation area is removed from the material by the sequence of laser pulses, wherein the material is removed through the accumulation of thermal energy over the two consecutive laser pulses, and wherein an area that is not spatially overlapped by the two consecutive laser pulses is removed from the material through diffusion of the thermal energy over the irradiated area, and wherein a repetition rate of the two consecutive laser pulses is below 100 MHz, and

wherein each two adjacent laser pulses in the sequence of laser pulses have a constant percentage of overlap.

23. The method of claim 22, wherein the irradiated area is spatially overlapped by two consecutive laser pulses of the sequence of laser pulses to an extent of less than 50%.