Metal mesh lid MEMS package and method

• US 9,162,871 B1
• Filed: 08/16/2013
• Issued: 10/20/2015
• Est. Priority Date: 04/28/2011
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Kuo, Bob Shih-Wei, Shumway, Russell, Troche, Louis B. Jr.
• Primary Examiner(s): YEUNG LOPEZ, FEIFEI
• Application Number:
  US13/969,052
• Time in Patent Office: 795 Days
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0257 Microphones or microspeakers
• CPC Class Codes: B81B 2201/0264 Pressure sensors
• CPC Class Codes: B81B 2207/09 Packages
• CPC Class Codes: B81B 7/0032 Packages or encapsulation processes for packaging MEMS B81C1/00261; packaging of smart-MEMS B81C1/0023
• CPC Class Codes: B81B 7/0061 suitable for fluid transfer from the MEMS out of the package or vice versa, e.g. transfer of liquid, gas, sound
• CPC Class Codes: B81B 7/0064 for protecting against electromagnetic or electrostatic interferences
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: B81C 1/00261 Processes for packaging MEMS devices MEMS packages B81B7/0032, packaging of smart-MEMS B81C1/0023
• CPC Class Codes: B81C 1/00269 Bonding of solid lids or wafers to the substrate
• CPC Class Codes: B81C 2203/01 Packaging MEMS
• CPC Class Codes: B81C 2203/0109 Bonding an individual cap on the substrate
• CPC Class Codes: B81C 2203/0154 Moulding a cap over the MEMS device
• CPC Class Codes: B81C 2203/0163 Reinforcing a cap, e.g. with ribs
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48111 the wire connector extending above another semiconductor or solid-state body
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49113 the connectors connecting different bonding areas on the semiconductor or solid-state body to a common bonding area outside the body, e.g. converging wires
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/16151 : Cap comprising an aperture, e.g. for pressure control, encapsulation
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Abstract

A metal mesh lid MEMS package includes a substrate, a MEMS electronic component coupled to the substrate, and a metal mesh lid coupled to the substrate with a lid adhesive. The metal mesh lid includes a polymeric lid body having a top port formed therein and a metal mesh cap coupled to the lid body. The metal mesh cap covers the top port and serves as both a particulate filter and a continuous conductive shield for EMI/RF interferences. Further, the metal mesh cap provides a locking feature for the lid adhesive to maximize the attach strength of the metal mesh lid to the substrate.

Claims

1. A structure comprising:

a substrate;

a Micro Electro Mechanical Systems (MEMS) electronic component coupled to the substrate; and

a metal mesh lid coupled to the substrate, the metal mesh lid comprising;

a polymeric lid body having a top port formed therein; and

a metal mesh cap embedded within the polymeric lid body, wherein the metal mesh cap covers the top port such that air may flow through the top port.

2. The structure of claim 1 wherein the metal mesh lid further comprises:

a lid plate parallel to the substrate; and

lid sidewalls extending perpendicularly from the lid plate and terminating at a lid base of the metal mesh lid.

3. The structure of claim 2 wherein the metal mesh cap is exposed from the polymeric lid body at the lid base.

4. The structure of claim 1 wherein the metal mesh cap comprises connected strands of electrically conductive material.

5. The structure of claim 4 wherein the metal mesh cap comprises holes therein through which external stimulus can pass.

6. The structure of claim 5 wherein the polymeric lid body seals the holes of the metal mesh cap.

7. The structure of claim 1 wherein the metal mesh cap forms a filtration structure that prevents contaminants from passing through the top port.

8. The structure of claim 1 further comprising a lid adhesive coupling the metal mesh lid to the substrate, wherein the metal mesh cap forms a locking feature for the lid adhesive.

9. The structure of claim 1 further comprising an electrically conductive lid adhesive coupling the metal mesh cap to ground terminals of the substrate.

10. A structure comprising:

a metal mesh lid array comprising;

a polymeric lid body array comprising lid bodies having top ports formed therein; and

a metal mesh cap array embedded within the polymeric lid body array, wherein metal mesh caps of the metal mesh cap array cover the top ports such that air may flow through the top ports.

11. The structure of claim 10 wherein the polymeric lid body array further exists between an inner surface of the polymeric lid body array and the metal mesh cap array.

12. The structure of claim 10 further comprising:

substrates coupled to the metal mesh lid array.

13. The structure of claim 12 further comprising Micro Electro Mechanical Systems (MEMS) electronic components coupled to the substrates.

14. The structure of claim 12 wherein the metal mesh lid array further comprises:

lid plates parallel to the substrates; and

lid sidewalls extending perpendicularly from the lid plates and terminating at lid bases of the metal mesh lid array.

15. The structure of claim 14 wherein the metal mesh cap array is exposed from the polymeric lid body array at the lid bases.

16. The structure of claim 14 further comprising a lid adhesive coupling the lid bases to the substrates.

17. The structure of claim 16 wherein the lid adhesive is electrically conductive.

18. A method comprising:

forming a metal mesh cap array comprising metal mesh caps; and

embedding the metal mesh cap array within a polymeric lid body array to form a metal mesh lid array, the polymeric lid body array comprising lid bodies having top ports formed therein, wherein the metal mesh caps cover the top ports such that air may flow through the to ports.

19. The method of claim 18 wherein the embedding comprises:

molding the polymeric lid body array to the metal mesh cap array.

20. The method of claim 18 wherein the polymeric lid body array further exists between an inner surface of the polymeric lid body array and the metal mesh cap array.