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Process for manufacturing a membrane microelectromechanical device, and membrane microelectromechanical device

  • US 9,162,876 B2
  • Filed: 03/13/2012
  • Issued: 10/20/2015
  • Est. Priority Date: 03/18/2011
  • Status: Active Grant
First Claim
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1. A process comprising:

  • forming a microelectromechanical device including;

    forming a structural layer on a single dielectric layer on a semiconductor substrate, the structural layer having an inner portion and an outer portion, the dielectric layer having a sacrificial portion and a support portion;

    opening a plurality of trenches through the inner portion of the structural layer, the plurality of trenches exposing the sacrificial portion of the dielectric layer;

    selectively removing the sacrificial portion of the dielectric layer through the plurality of trenches so as to cause the inner portion of the structural layer to be suspended, thereby forming a membrane the support portion of the dielectric layer remaining between the outer portion of the structural layer and the semiconductor substrate; and

    closing the plurality of trenches, the closing the plurality of trenches including exposing the structural layer to an annealing temperature for a time interval.

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