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Testing electronic components on electronic assemblies with large thermal mass

  • US 9,164,142 B2
  • Filed: 11/07/2012
  • Issued: 10/20/2015
  • Est. Priority Date: 11/07/2012
  • Status: Expired due to Fees
First Claim
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1. A method for testing an electronic assembly, the method comprising:

  • computing a first target temperature of the electronic assembly based upon one or more system parameters;

    in response to determining that a first environment is not capable of generating the first target temperature, determining that turning on power to the electronic assembly while the electronic assembly is in the first environment results in the surface temperature of the electronic assembly reaching the first target temperature;

    subjecting the electronic assembly to one or more thermal cycles, wherein each one of the thermal cycles comprises;

    placing the electronic assembly in the first environment with a first ambient temperature for a first time period;

    turning on power to the electronic assembly at least one time during the first time period when the surface temperature of the electronic assembly falls below the first target temperature;

    removing the electronic assembly from the first environment in response to the first time period expiring; and

    placing the electronic assembly in a second environment with a second ambient temperature for a second time period, wherein the second environment is at a different location than the first environment and the second ambient temperature is different than the first ambient temperature; and

    testing the electronic assembly, by one or more processors, in response to the electronic assembly being subjected to one or more thermal cycles.

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