Testing electronic components on electronic assemblies with large thermal mass

• US 9,164,142 B2
• Filed: 11/07/2012
• Issued: 10/20/2015
• Est. Priority Date: 11/07/2012
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Coq, Marc, Fishbune, Richard J.
• Primary Examiner(s): Phan, Huy Q
• Assistant Examiner(s): DICKINSON, DUSTIN R
• Application Number:
  US13/671,477
• Publication Number:
  US 20140125365A1
• Time in Patent Office: 1,077 Days
• Field of Search: 324537-75014, 702/132, 702/57
• US Class Current: 1/1
• CPC Class Codes: G01R 1/0458 related to environmental aspects, e.g. temperature
• CPC Class Codes: G01R 31/003 Environmental or reliability tests of individual semiconductors G01R31/2642; of PCB's G01R31/2817; of IC's G01R31/2855; of other circuits G01R31/2849
• CPC Class Codes: G01R 31/2817 Environmental-, stress-, or burn-in tests of IC's G01R31/2855; of individual semiconductors G01R31/2642; of other circuits G01R31/2849
• CPC Class Codes: G01R 31/2862 Chambers or ovens; Tanks

Abstract

An approach is provided in which a system under test is subjected to thermal cycling that include transferring the system under test between two different environments that generate two different ambient temperatures. In turn, a test system tests the electronic assembly in response to the electronic assembly being subjected to the thermal cycles.

Claims

1. A method for testing an electronic assembly, the method comprising:

computing a first target temperature of the electronic assembly based upon one or more system parameters;

in response to determining that a first environment is not capable of generating the first target temperature, determining that turning on power to the electronic assembly while the electronic assembly is in the first environment results in the surface temperature of the electronic assembly reaching the first target temperature;

subjecting the electronic assembly to one or more thermal cycles, wherein each one of the thermal cycles comprises;

placing the electronic assembly in the first environment with a first ambient temperature for a first time period;

turning on power to the electronic assembly at least one time during the first time period when the surface temperature of the electronic assembly falls below the first target temperature;

removing the electronic assembly from the first environment in response to the first time period expiring; and

placing the electronic assembly in a second environment with a second ambient temperature for a second time period, wherein the second environment is at a different location than the first environment and the second ambient temperature is different than the first ambient temperature; and

testing the electronic assembly, by one or more processors, in response to the electronic assembly being subjected to one or more thermal cycles.

2. The method of claim 1 further comprising:

functionally testing of the electronic assembly when the electronic assembly is placed in the second environment.

3. The method of claim 1 wherein the first environment is selected from the group consisting of an enclosed thermal oven and an unenclosed room.

4. The method of claim 1 wherein the electronic assembly comprises a plurality of printed circuit boards.

5. The method of claim 1 wherein:

the first ambient temperature is within a first temperature range;

the second ambient temperature is within a second temperature range; and

the first temperature range does not overlap the second temperature range.

6. A product made by a method comprising:

computing a first target temperature of the electronic assembly based upon one or more system parameters;

in response to determining that a first environment is not capable of generating the first target temperature, determining that turning on power to the electronic assembly while the electronic assembly is in the first environment results in the surface temperature of the electronic assembly reaching the first target temperature;

subjecting the electronic assembly to one or more thermal cycles, wherein each one of the thermal cycles comprises;

placing the electronic assembly in the first environment with a first ambient temperature for a first time period;

turning on power to the electronic assembly at least one time during the first time period when the surface temperature of the electronic assembly falls below the first target temperature;

removing the electronic assembly from the first environment in response to the first time period expiring; and

placing the electronic assembly in a second environment with a second ambient temperature for a second time period, wherein the second environment is at a different location than the first environment and the second ambient temperature is different than the first ambient temperature; and

testing the electronic assembly, by one or more processors, in response to the electronic assembly being subjected to one or more thermal cycles.

7. The product of claim 6 wherein the method further comprises:

functionally testing of the electronic assembly when the electronic assembly is placed in the second environment.

8. The product of claim 6 wherein the first environment is selected from the group consisting of an enclosed thermal oven and an unenclosed room.

9. The product of claim 6 wherein the electronic assembly comprises a plurality of printed circuit boards.

10. The product of claim 6 wherein:

the first ambient temperature is within a first temperature range;

the second ambient temperature is within a second temperature range; and

the first temperature range does not overlap the second temperature range.

11. A method comprising:

retrieving, by one or more processors, one or more system parameters that correspond to an electronic assembly;

computing, by one or more of the processors, a first target temperature and a second target temperature based upon the one or more system parameters;

determining, by one or more of the processors, whether a first environment is capable of generating a first ambient temperature that corresponds to the first target temperature;

in response to determining that the first environment is not capable of generating the first target temperature, determining that turning on power to the electronic assembly while the electronic assembly is in the first environment results in the surface temperature of the electronic assembly reaching the first target temperature;

determining, by one or more of the processors, whether a second environment is capable of generating a second ambient temperature that corresponds to the second target temperature, the second environment in a different location than the first environment;

in response to determining that the first environment with the electronic assembly turned on and the second environment are capable of generating the first ambient temperature and the second ambient temperature corresponding to the first target temperature and the second target temperature, respectively, configuring the first environment to operate at the first ambient temperature and configuring the second environment to operate at the second ambient temperature.

12. The method of claim 11 further comprising:

placing the electronic assembly in the first environment for a first time period;

removing the electronic assembly from the first environment in response to the first time period expiring;

placing the electronic assembly in the second environment for a second time period; and

testing the electronic assembly in response to the second time period expiring.

13. The method of claim 11 further comprising:

generating an error message in response to the surface temperature of the electronic assembly failing to reach the first target temperature with the power turned on to the electronic assembly.

14. The method of claim 12 wherein the testing is selected from the group consisting of functional testing, thermal corner testing, voltage bias testing, frequency bias testing and extended functional testing.

15. The method of claim 11 wherein the first environment is selected from the group consisting of an enclosed thermal oven and an unenclosed room.

16. The method of claim 11 wherein the electronic assembly comprises a plurality of printed circuit boards.

17. The method of claim 11 wherein:

the first ambient temperature is within a first temperature range;

the second ambient temperature is within a second temperature range; and

the first temperature range does not overlap the second temperature range.