Apparatus having a back-bias magnet and a semiconductor chip element
First Claim
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1. An apparatus, comprisinga back-bias magnet;
- a semiconductor chip element; and
a magnetic lens configured to amplify the magnetic field lines generated by the back-bias magnet;
wherein the semiconductor chip element has a sensor for measuring a magnetic field strength; and
wherein a contact surface is formed on a contact side of the back-bias magnet and on a contact side of the semiconductor chip element and wherein the contact side of the semiconductor chip element has one or more structures such that the contact surface of the back-bias magnet is shaped in a manner corresponding to the structures of the semiconductor chip element, andwherein the magnetic lens is arranged in the semiconductor chip element.
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Abstract
An apparatus may include a back-bias magnet; and a semiconductor chip element; wherein the semiconductor chip element has a sensor for measuring a magnetic field strength; and wherein a contact surface is formed on a contact side of the back-bias magnet and on a contact side of the semiconductor chip element and wherein the contact side of the semiconductor chip element has one or more structures such that the contact surface of the back-bias magnet is shaped in a manner corresponding to the structures of the semiconductor chip element.
55 Citations
15 Claims
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1. An apparatus, comprising
a back-bias magnet; -
a semiconductor chip element; and a magnetic lens configured to amplify the magnetic field lines generated by the back-bias magnet; wherein the semiconductor chip element has a sensor for measuring a magnetic field strength; and wherein a contact surface is formed on a contact side of the back-bias magnet and on a contact side of the semiconductor chip element and wherein the contact side of the semiconductor chip element has one or more structures such that the contact surface of the back-bias magnet is shaped in a manner corresponding to the structures of the semiconductor chip element, and wherein the magnetic lens is arranged in the semiconductor chip element. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for producing an apparatus, the method comprising:
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providing a semiconductor chip element, wherein the semiconductor chip element comprises a sensor for measuring a magnetic field strength; forming one or more structures on a contact side of the semiconductor chip element; and generating a back-bias magnet such that a contact surface is formed on a contact side of the back-bias magnet and on a contact side of the semiconductor chip element such that the contact surface of the back-bias magnet is shaped in a manner corresponding to the structures of the semiconductor chip element; wherein a magnetic lens is arranged in the semiconductor chip element between the sensor and the one or more structures. - View Dependent Claims (11, 12, 13, 14, 15)
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Specification