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Substrate for LED, LED module, and LED bulb

  • US 9,166,133 B2
  • Filed: 03/11/2013
  • Issued: 10/20/2015
  • Est. Priority Date: 03/15/2012
  • Status: Active Grant
First Claim
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1. An LED substrate comprising:

  • a translucent substrate body in which an LED chip is disposed on a front face; and

    a heat dissipation path provided in the substrate body to dissipate heat generated in the LED chip,wherein the substrate body includes a through hole that penetrates through the substrate body from the front face on which the LED chip is provided to a back face,wherein the heat dissipation path includesa heat transfer path section provided in the through hole, anda heat dissipation pattern section provided on the back face of the substrate body, and connected to the heat transfer path section, andwherein the substrate body has a plurality of the heat transfer path sections provided in a plurality of the through holes to correspond to a plurality of the LED chips provided, andthe heat dissipation pattern section having a grid or ladder-like pattern connects the heat transfer path sections.

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