Substrate for LED, LED module, and LED bulb

• US 9,166,133 B2
• Filed: 03/11/2013
• Issued: 10/20/2015
• Est. Priority Date: 03/15/2012
• Status: Active Grant

• Current Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Original Assignee: Panasonic Intellectual Property Management Co., Ltd. (Panasonic Holdings Corporation)
• Inventors: Tsuda, Kouhe
• Primary Examiner(s): Hollweg, Thomas A
• Assistant Examiner(s): QUARTERMAN, KEVIN J
• Application Number:
  US14/381,251
• Publication Number:
  US 20150091432A1
• Time in Patent Office: 953 Days
• Field of Search: 313/46, 313/47, 313/11, 313/33, 313/498, 313/512, 362/580, 362/294, 362/547, 362/218, 362/373, 257/675, 257/706, 257/712, 257/720, 257/796
• US Class Current: 1/1
• CPC Class Codes: F21K 9/23 Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/505 characterised by the shape, e.g. plate or foil
• CPC Class Codes: H01L 33/507 the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/644 in intimate contact or integrated with parts of the device other than the semiconductor body

Abstract

LED substrate of the present invention includes: translucent substrate body-in which an LED chip is disposed on a front face; and heat dissipation path provided in substrate body to dissipate heat generated in the LED chip. Substrate body includes a through hole that penetrates through the substrate body from the front face on which the LED chip is provided to a back face. Heat dissipation path includes: heat transfer path section provided in the through hole; and heat dissipation pattern section provided on the back face of substrate body, and connected to heat transfer path section. Thus, LED substrate having superior heat dissipation is realized.

Claims

1. An LED substrate comprising:

a translucent substrate body in which an LED chip is disposed on a front face; and

a heat dissipation path provided in the substrate body to dissipate heat generated in the LED chip,

wherein the substrate body includes a through hole that penetrates through the substrate body from the front face on which the LED chip is provided to a back face,

wherein the heat dissipation path includes

a heat transfer path section provided in the through hole, and

a heat dissipation pattern section provided on the back face of the substrate body, and connected to the heat transfer path section, and

wherein the substrate body has a plurality of the heat transfer path sections provided in a plurality of the through holes to correspond to a plurality of the LED chips provided, and

the heat dissipation pattern section having a grid or ladder-like pattern connects the heat transfer path sections.

2. The LED substrate according to claim 1, wherein the through hole is formed to have a funnel shape of which a back face side has an increased diameter than the front face side of the substrate body.

3. The LED substrate according to claim 1, wherein

the back face side of the substrate body has a groove, and

the heat dissipation pattern section is provided in the groove.

4. The LED substrate according to claim 1, wherein the back face of the substrate body has a connecting section connected to a heat dissipation support member.

5. The LED substrate according to claim 1, wherein

a fluorescent substance layer is further included at a position on the front face of the substrate body at which the LED chip is provided, and

the heat dissipation pattern section of the heat dissipation path is provided to be opposed to the fluorescent substance layer via the substrate body.

6. An LED module comprising:

the LED substrate according to claim 1 and an LED chip provided to a fluorescent substance layer of the LED substrate, and

translucent resin including fluorescent substance for sealing the LED chip.

7. An LED light bulb comprising the LED module of claim 6 connected to a heat dissipation support member and enclosed in a globe.

8. The LED substrate according to claim 1, wherein the heat dissipation pattern section has a shape comprising a first plurality of lines extending between respective heat transfer path sections, and a second plurality of lines intersecting the first plurality of lines.

9. The LED substrate according to claim 8, wherein

the first plurality of lines includes a short side line that connects a heat transfer path section at one side edge of the substrate body to a respective heat transfer path section at another side edge of the substrate body, and

the second plurality of lines includes a centerline that intersects a center of the short side line, the centerline formed in an area spaced from a center of the substrate body and ends of the substrate body.