Substrate for LED, LED module, and LED bulb
First Claim
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1. An LED substrate comprising:
- a translucent substrate body in which an LED chip is disposed on a front face; and
a heat dissipation path provided in the substrate body to dissipate heat generated in the LED chip,wherein the substrate body includes a through hole that penetrates through the substrate body from the front face on which the LED chip is provided to a back face,wherein the heat dissipation path includesa heat transfer path section provided in the through hole, anda heat dissipation pattern section provided on the back face of the substrate body, and connected to the heat transfer path section, andwherein the substrate body has a plurality of the heat transfer path sections provided in a plurality of the through holes to correspond to a plurality of the LED chips provided, andthe heat dissipation pattern section having a grid or ladder-like pattern connects the heat transfer path sections.
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Abstract
LED substrate of the present invention includes: translucent substrate body-in which an LED chip is disposed on a front face; and heat dissipation path provided in substrate body to dissipate heat generated in the LED chip. Substrate body includes a through hole that penetrates through the substrate body from the front face on which the LED chip is provided to a back face. Heat dissipation path includes: heat transfer path section provided in the through hole; and heat dissipation pattern section provided on the back face of substrate body, and connected to heat transfer path section. Thus, LED substrate having superior heat dissipation is realized.
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Citations
9 Claims
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1. An LED substrate comprising:
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a translucent substrate body in which an LED chip is disposed on a front face; and a heat dissipation path provided in the substrate body to dissipate heat generated in the LED chip, wherein the substrate body includes a through hole that penetrates through the substrate body from the front face on which the LED chip is provided to a back face, wherein the heat dissipation path includes a heat transfer path section provided in the through hole, and a heat dissipation pattern section provided on the back face of the substrate body, and connected to the heat transfer path section, and wherein the substrate body has a plurality of the heat transfer path sections provided in a plurality of the through holes to correspond to a plurality of the LED chips provided, and the heat dissipation pattern section having a grid or ladder-like pattern connects the heat transfer path sections. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification