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3D stacked package structure and method of manufacturing the same

  • US 9,167,686 B2
  • Filed: 03/01/2013
  • Issued: 10/20/2015
  • Est. Priority Date: 10/17/2012
  • Status: Active Grant
First Claim
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1. A 3D stacked package structure, comprising:

  • a first unit including a first substrate and at least one first electronic component disposed on and electrically connected to the first substrate, wherein the first substrate has at least one runner formed on the periphery thereof and passing through the first substrate, and the first substrate has at least one first conductive pad disposed on the bottom surface of the first substrate and adjacent to the periphery of the first substrate;

    a molding unit including a top portion disposed on the first substrate to cover the first electronic component, the top portion extending to an edge of the first substrate, a frame disposed on the bottom surface of the first substrate and adjacent to the periphery of the first substrate, and at least one connection disposed inside the runner and connected between the top portion and the frame;

    a conductive unit including at least one conductor passing through the frame and electrically connected to the first conductive pad; and

    a second unit, wherein the first unit is stacked on the second unit, and the first unit is electrically connected to the second unit through the conductor.

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