3D stacked package structure and method of manufacturing the same

• US 9,167,686 B2
• Filed: 03/01/2013
• Issued: 10/20/2015
• Est. Priority Date: 10/17/2012
• Status: Active Grant

• Current Assignee: Universal Global Scientific Industrial Company Limited (ASE Technology Holding Co., Ltd.), Universal Scientific Industrial (Shanghai) Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Original Assignee: Universal Global Scientific Industrial Company Limited (ASE Technology Holding Co., Ltd.), Universal Scientific Industrial (Shanghai) Co., Ltd. (ASE Technology Holding Co., Ltd.)
• Inventors: Chen, Jenchun, Chang, Hsin Chin
• Primary Examiner(s): Dinh, Tuan T
• Application Number:
  US13/783,161
• Publication Number:
  US 20140104799A1
• Time in Patent Office: 963 Days
• Field of Search: 361760-790, 257670-680, 257770-790
• US Class Current: 1/1
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2225/1023 the support being an insulating substrate
• CPC Class Codes: H01L 2225/1058 Bump or bump-like electrical connections, e.g. balls, pillars, posts
• CPC Class Codes: H01L 2225/1076 Shape of the containers
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49811 Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 25/162 the devices being mounted on two or more different substrates
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19106 in a mirrored arrangement on two different side of a common die mounting substrate
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

A 3D stacked package structure includes a first unit, a molding unit, a conductive unit and a second unit. The first unit includes a first substrate and at least one first electronic component, and the first substrate has at least one runner and at least one first conductive pad. The molding unit includes a top portion, a frame, and at least one connection connected between the top portion and the frame. The conductive unit includes at least one conductor passing through the frame and electrically connected to the first conductive pad. Therefore, the first unit can be stacked on the second unit through the frame of the molding unit, and the first unit can be electrically connected to the second unit through the conductor of the conductive unit.

Claims

1. A 3D stacked package structure, comprising:

a first unit including a first substrate and at least one first electronic component disposed on and electrically connected to the first substrate, wherein the first substrate has at least one runner formed on the periphery thereof and passing through the first substrate, and the first substrate has at least one first conductive pad disposed on the bottom surface of the first substrate and adjacent to the periphery of the first substrate;

a molding unit including a top portion disposed on the first substrate to cover the first electronic component, the top portion extending to an edge of the first substrate, a frame disposed on the bottom surface of the first substrate and adjacent to the periphery of the first substrate, and at least one connection disposed inside the runner and connected between the top portion and the frame;

a conductive unit including at least one conductor passing through the frame and electrically connected to the first conductive pad; and

a second unit, wherein the first unit is stacked on the second unit, and the first unit is electrically connected to the second unit through the conductor.

2. The 3D stacked package structure of claim 1, wherein the top portion, the frame and the connection are integrated with each other to form a single piece.

3. The 3D stacked package structure of claim 1, wherein the second unit includes a second substrate and at least one second electronic component disposed on and electrically connected to the second substrate, the second substrate has at least one second conductive pad disposed on the top surface of the second substrate and adjacent to the periphery of the second substrate, and the second conductive pad is electrically connected to the conductor.

4. The 3D stacked package structure of claim 1, wherein the first unit further includes at least one third electronic component disposed on and electrically connected to the first substrate, and the first electronic component and the third electronic component are respectively disposed on the top surface and the bottom surface of the first substrate.

5. The 3D stacked package structure of claim 3, wherein the conductor is electrically connected with the second conductive pad through at least one solder.

6. A 3D stacked package structure, comprising:

a first unit including a first substrate, at least one first electronic component disposed on and electrically connected to the first substrate, and at least one third electronic component disposed on and electrically connected to the first substrate, wherein the first substrate has at least one runner formed on the periphery thereof and passing through the first substrate, and the first substrate has at least one first conductive pad disposed on the bottom surface of the first substrate and adjacent to the periphery of the first substrate;

a molding unit including a top portion disposed on the first substrate to cover the first electronic component, the top portion extending to an edge of the first substrate, a frame disposed on the bottom surface of the first substrate and adjacent to the periphery of the first substrate, at least one connection disposed inside the runner and connected between the top portion and the frame, and a bottom sealant formed on the bottom surface of the first substrate for covering the at least one third electronic component;

a conductive unit including at least one conductor passing through the frame and electrically connected to the first conductive pad; and

a second unit, wherein the first unit is stacked on the second unit, and the first unit is electrically connected to the second unit through the conductor.

7. The 3D stacked package structure of claim 6, wherein the top portion, the frame, the connection and the bottom sealant are integrated with each other to form a single piece.

8. The 3D stacked package structure of claim 6, wherein the second unit includes a second substrate and at least one second electronic component disposed on and electrically connected to the second substrate, the second substrate has at least one second conductive pad disposed on the top surface of the second substrate and adjacent to the periphery of the second substrate, and the second conductive pad is electrically connected to the conductor.

9. The 3D stacked package structure of claim 6, wherein the bottom sealant is connected to the frame and surrounded by the frame.

10. The 3D stacked package structure of claim 6, wherein the conductor is electrically connected with the second conductive pad through at least one solder.

11. A method of manufacturing a 3D stacked package structure, comprising:

placing at least one first unit inside a mold structure, wherein the first unit includes a first substrate and at least one first electronic component disposed on the first substrate, and the first substrate has at least one first conductive pad and at least one runner;

filling the mold structure with a molding material to form a molding unit, wherein the molding unit includes a top portion covering the first electronic component, the top portion extending to an edge of the first substrate, a frame disposed on the bottom surface of the first substrate, and at least one connection disposed inside the runner and connected between the top portion and the frame;

removing the mold structure;

forming at least one opening passing through the frame, wherein the first conductive pad is exposed by the opening;

filling the opening with a conductor, wherein the conductor is electrically connected to the first conductive pad; and

stacking the first unit on a second unit through the frame, wherein the first unit is electrically connected to the second unit through the conductor.

12. The method of claim 11, wherein the second unit includes a second substrate and at least one second electronic component disposed on the second substrate, and the second electronic component is surround by the frame.

13. The method of claim 11, wherein the step of stacking the first unit on the second unit further comprises:

electrically connecting the conductor with at least one second conductive pad of the second unit through at least one solder.

14. The method of claim 11, wherein the step of filling the mold structure with the molding material further comprises:

pouring the molding material into the mold structure through a port of the mold structure, wherein bubbles generated by the pouring step are discharged from a plurality of exhaust runners of the mold structure.

15. The method of claim 11, wherein the opening is formed by laser drilling.

16. The method of claim 11, wherein the first unit further includes at least one third electronic component disposed on and electrically connected to the first substrate.

17. The method of claim 16, wherein the first electronic component and the third electronic component are respectively disposed on the top surface and the bottom surface of the first substrate.

18. The method of claim 16, wherein the molding unit includes a bottom sealant formed on the bottom surface of the first substrate for covering the at least one third electronic component.

19. The method of claim 18, wherein the bottom sealant is connected to the frame and surrounded by the frame.

20. The method of claim 18, wherein the top portion, the frame, the connection and the bottom sealant are integrated with each other to form a single piece.