Wafer inspection using free-form care areas

• US 9,171,364 B2
• Filed: 01/30/2014
• Issued: 10/27/2015
• Est. Priority Date: 06/21/2013
• Status: Active Grant

• Current Assignee: KLA-Tencor Corporation
• Original Assignee: KLA-Tencor Corporation
• Inventors: Wu, Kenong, Luo, Tao, Gao, Lisheng, Shifrin, Eugene, Balaji, Aravindh
• Primary Examiner(s): Alavi, Amir
• Application Number:
  US14/168,011
• Publication Number:
  US 20140376802A1
• Time in Patent Office: 635 Days
• US Class Current: 1/1
• CPC Class Codes: G06T 2207/10061 from scanning electron microscope
• CPC Class Codes: G06T 2207/30148 Semiconductor; IC; Wafer
• CPC Class Codes: G06T 7/0004 Industrial image inspection
• CPC Class Codes: G06T 7/001 using an image reference approach

Abstract

Methods and systems for detecting defects on a wafer are provided. One method includes determining characteristics of care areas for a wafer based on wafer patterns. Determining the characteristics includes determining locations of care areas, identifying at least one pattern of interest (POI) in the wafer patterns for each of the care areas, allowing any of the care areas to have a free-form shape, allowing the care areas to be larger than frame images and selecting two or more POIs for at least one of the care areas. The method also includes searching for POIs in images generated for the wafer using an inspection system. In addition, the method includes detecting defects on the wafer by determining positions of the care areas in the images and applying one or more defect detection methods to the images based on the positions of the care areas in the images.

Claims

1. A computer-implemented method for detecting defects on a wafer, comprising:

determining characteristics of care areas for a wafer based on wafer patterns, wherein determining the characteristics comprises determining the care areas, identifying at least one pattern of interest in the wafer patterns for each of the care areas, allowing any of the care areas to have a free-form shape, selecting two or more patterns of interest for at least one of the care areas, and allowing any of the care areas to be larger than any frame image;

searching for patterns of interest in images generated for the wafer using an inspection system; and

detecting defects on the wafer by determining positions of the care areas in the images and applying one or more defect detection methods to the images based on the positions of the care areas in the images, wherein said determining, said searching, and said detecting are performed using one or more computer systems.

2. The method of claim 1, wherein the free-form shape of one of the care areas is substantially the same as a shape of the wafer patterns included in the one of the care areas.

3. The method of claim 1, wherein the free-form shape is not a rectangular shape.

4. The method of claim 1, wherein determining the characteristics of the care areas for the wafer based on the wafer patterns comprises determining the characteristics of the care areas based on images of the wafer patterns acquired by imaging the wafer or another wafer with the inspection system.

5. The method of claim 1, wherein determining the characteristics further comprises storing one or more images of each of the at least one pattern of interest, and wherein determining the positions of the care areas in the images for the wafer comprises determining a position of each of the at least one pattern of interest in the images for the wafer.

6. The method of claim 1, wherein said determining the characteristics further comprises identifying a position of each of the at least one pattern of interest with respect to its corresponding care area.

7. The method of claim 1, wherein each of the at least one pattern of interest is associated with only one of the care areas.

8. The method of claim 1, wherein identifying the at least one pattern of interest comprises identifying one or more patterns of interest that are unique within a portion of the images corresponding to their respective care areas.

9. The method of claim 1, wherein identifying the at least one pattern of interest comprises identifying one or more patterns of interest that are unique from each other.

10. The method of claim 1, wherein identifying the at least one pattern of interest comprises identifying one or more patterns of interest that are asymmetric.

11. The method of claim 1, wherein said identifying the at least one pattern of interest comprises selecting the two or more patterns of interest for the at least one of the care areas such that each of the two or more patterns of interest can be used independently of each other to determine the position of the at least one of the care areas in the images.

12. The method of claim 1, wherein the two or more patterns of interest selected for the at least one of the care areas are selected such that when the at least one of the care areas spans two or more of the images for the wafer, at least one of the two or more patterns of interest is present in each of the two or more images.

13. The method of claim 12, wherein when the at least one of the care areas spans the two or more images, determining the positions of the care areas comprises determining a position of a first portion of the at least one of the care areas in a first of the two or more images based on any of the two or more patterns of interest located in the first of the two or more images and determining a position of a second portion of the at least one of the care areas in a second of the two or more images based on any of the two or more patterns of interest located in the second of the two or more images.

14. The method of claim 12, wherein when the at least one of the care areas spans the two or more images, the at least one of the care areas is split across the two or more images in an x-direction on the wafer, a y-direction on the wafer, or x- and y-directions on the wafer.

15. The method of claim 1, wherein determining the positions of the care areas comprises identifying positions of the at least one pattern of interest in the images for the wafer and determining the positions of the care areas in the images for the wafer based on the positions of the at least one pattern of interest in the images for the wafer.

16. The method of claim 1, wherein determining the positions of the care areas comprises matching images of the at least one pattern of interest with the images for the wafer and, for the at least one of the care areas, identifying which of the two or more patterns of interest has a best result for said matching and determining the position of the at least one of the care areas with the pattern of interest having the best result.

17. A non-transitory computer-readable medium, storing program instructions executable on a computer system for performing a computer-implemented method for detecting defects on a wafer, wherein the computer-implemented method comprises:

determining characteristics of care areas for a wafer based on wafer patterns, wherein determining the characteristics comprises determining the care areas, identifying at least one pattern of interest in the wafer patterns for each of the care areas, allowing any of the care areas to have a free-form shape, selecting two or more patterns of interest for at least one of the care areas, and allowing any of the care areas to be larger than any frame image;

searching for patterns of interest in images generated for the wafer using an inspection system; and

detecting defects on the wafer by determining positions of the care areas in the images and applying one or more defect detection methods to the images based on the positions of the care areas in the images.

18. A system configured to detect defects on a wafer, comprising:

an inspection subsystem configured to generate images for a wafer; and

a computer system configured for;

determining characteristics of care areas for the wafer based on wafer patterns, wherein determining the characteristics comprises determining the care areas, identifying at least one pattern of interest in the wafer patterns for each of the care areas, allowing any of the care areas to have a free-form shape, selecting two or more patterns of interest for at least one of the care areas, and allowing any of the care areas to be larger than any frame image;

searching for patterns of interest in the images generated for the wafer; and

detecting defects on the wafer by determining positions of the care areas in the images and applying one or more defect detection methods to the images based on the positions of the care areas in the images.

19. The system of claim 18, wherein the free-form shape of one of the care areas is substantially the same as a shape of the wafer patterns included in the one of the care areas.

20. The system of claim 18, wherein the free-form shape is not a rectangular shape.

21. The system of claim 18, wherein determining the characteristics of the care areas for the wafer based on the wafer patterns comprises determining the characteristics of the care areas based on images of the wafer patterns acquired by imaging the wafer or another wafer with the inspection subsystem.

22. The system of claim 18, wherein determining the characteristics further comprises storing one or more images of each of the at least one pattern of interest, and wherein determining the positions of the care areas in the images for the wafer comprises determining a position of each of the at least one pattern of interest in the images for the wafer.

23. The system of claim 18, wherein said determining the characteristics further comprises identifying a position of each of the at least one pattern of interest with respect to its corresponding care area.

24. The system of claim 18, wherein each of the at least one pattern of interest is associated with only one of the care areas.

25. The system of claim 18, wherein identifying the at least one pattern of interest comprises identifying one or more patterns of interest that are unique within a portion of the images corresponding to their respective care areas.

26. The system of claim 18, wherein identifying the at least one pattern of interest comprises identifying one or more patterns of interest that are unique from each other.

27. The system of claim 18, wherein identifying the at least one pattern of interest comprises identifying one or more patterns of interest that are asymmetric.

28. The system of claim 18, wherein said identifying the at least one pattern of interest comprises selecting the two or more patterns of interest for the at least one of the care areas such that each of the two or more patterns of interest can be used independently of each other to determine the position of the at least one of the care areas in the images.

29. The system of claim 18, wherein the two or more patterns of interest selected for the at least one of the care areas are selected such that when the at least one of the care areas spans two or more of the images for the wafer, at least one of the two or more patterns of interest is present in each of the two or more images.

30. The system of claim 29, wherein when the at least one of the care areas spans the two or more images, determining the positions of the care areas comprises determining a position of a first portion of the at least one of the care areas in a first of the two or more images based on any of the two or more patterns of interest located in the first of the two or more images and determining a position of a second portion of the at least one of the care areas in a second of the two or more images based on any of the two or more patterns of interest located in the second of the two or more images.

31. The system of claim 29, wherein when the at least one of the care areas spans the two or more images, the at least one of the care areas is split across the two or more images in an x-direction on the wafer, a y-direction on the wafer, or x- and y-directions on the wafer.

32. The system of claim 18, wherein determining the positions of the care areas comprises identifying positions of the at least one pattern of interest in the images for the wafer and determining the positions of the care areas in the images for the wafer based on the positions of the at least one pattern of interest in the images for the wafer.

33. The system of claim 18, wherein determining the positions of the care areas comprises matching images of the at least one pattern of interest with the images for the wafer and, for the at least one of the care areas, identifying which of the two or more patterns of interest has a best result for said matching and determining the position of the at least one of the care areas with the pattern of interest having the best result.