Semiconductor device and method for manufacturing the same

• US 9,171,808 B2
• Filed: 01/16/2014
• Issued: 10/27/2015
• Est. Priority Date: 04/25/2008
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Eguchi, Shingo
• Primary Examiner(s): BOOTH, RICHARD A
• Application Number:
  US14/156,744
• Publication Number:
  US 20140131852A1
• Time in Patent Office: 649 Days
• Field of Search: 257 59- 61
• US Class Current: 1/1
• CPC Class Codes: H01L 21/561 Batch processing
• CPC Class Codes: H01L 21/568 Temporary substrate used as encapsulation process aid H01L21/4832 and H01L21/566 take precedence
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/6835 used as a support during build up manufacturing of active devices
• CPC Class Codes: H01L 23/293 Organic, e.g. plastic
• CPC Class Codes: H01L 23/295 containing a filler H01L23/296 takes precedence
• CPC Class Codes: H01L 23/3114 the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/562 Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/19043 being a resistor
• CPC Class Codes: H01L 2924/30105 Capacitance

Abstract

In a semiconductor integrated circuit sandwiched between a pair of a first impact resistance layer and a second impact resistance layer, an impact diffusion layer is provided between the semiconductor integrated circuit and the second impact resistance layer. By provision of the impact resistance layer against the external stress and the impact diffusion layer for diffusing the impact, force applied to the semiconductor integrated circuit per unit area is reduced, so that the semiconductor integrated circuit is protected. The impact diffusion layer preferably has a low modulus of elasticity and high breaking modulus.

Claims

1. A semiconductor device comprising:

a first layer;

an aramid film over the first layer;

a first insulating layer over the first layer;

a circuit comprising a transistor over the first insulating layer;

a conductive layer over the transistor;

a second insulating layer over the conductive layer;

a second layer over the second insulating layer;

wherein the first layer comprises a fibrous body and an organic resin,

wherein the second layer comprises a fibrous body and an organic resin, and

wherein the aramid film has a lower modulus of elasticity and higher breaking strength than the first layer and the second layer.

2. The semiconductor device according to claim 1, further comprising:

an adhesive layer between the first insulating layer and the aramid film.

3. The semiconductor device according to claim 1, further comprising:

a second organic layer over the second layer,

wherein the second organic layer has a lower modulus of elasticity and higher breaking strength than the first layer and the second layer.

4. The semiconductor device according to claim 1, wherein the aramid film is a film having rubber elasticity.

5. The semiconductor device according to claim 1, wherein a thickness of the aramid film is from 5 μ

m to 20 μ

m.

6. The semiconductor device according to claim 1, further comprising an antenna provided between the second insulating layer and the second layer.

7. The semiconductor device according to claim 6, further comprising an inorganic insulating layer provided between the antenna and the second layer.

8. The semiconductor device according to claim 1,

wherein the first layer has a structure body in which the fibrous body is impregnated with the organic resin, and

wherein the second layer has a structure body in which the fibrous body is impregnated with the organic resin.

9. The semiconductor device according to claim 8, wherein the fibrous body is a woven fabric or a nonwoven fabric.

10. The semiconductor device according to claim 8, wherein the fibrous body is formed using one of a polyvinyl alcohol fiber, a polyester fiber, a polyamide fiber, a polyethylene fiber, an aramid fiber, a polyparaphenylene benzobisoxazole fiber, a glass fiber, and a carbon fiber.

11. The semiconductor device according to claim 8, wherein the organic resin comprises a thermosetting resin or a thermoplastic resin.

12. The semiconductor device according to claim 11, wherein the thermosetting resin is at least one from the group consisting of an epoxy resin, an unsaturated polyester resin, a polyimide resin, a bismaleimide-triazine resin, and a cyanate resin.

13. The semiconductor device according to claim 11, wherein the thermoplastic resin is at least one from the group consisting of a polyphenylene oxide resin, a polyetherimide resin, and a fluorine resin.

14. The semiconductor device according to claim 1, wherein the first insulating layer comprises at least one of silicon nitride, silicon oxynitride, and silicon nitride oxide.

29. The semiconductor device according to claim 1, wherein the transistor comprises a semiconductor layer comprising an oxide semiconductor, the semiconductor layer comprising a channel formation region.

30. The semiconductor device according to claim 29, wherein the oxide semiconductor is zinc oxide in which indium and gallium are added.

15. A semiconductor device comprising:

a first layer;

a first organic layer over the first layer;

a first insulating layer over the first layer;

a circuit comprising a transistor over the first insulating layer;

a conductive layer over the transistor;

a second insulating layer over the conductive layer;

a second layer over the second insulating layer;

wherein the first layer comprises a fibrous body and an organic resin,

wherein the second layer comprises a fibrous body and an organic resin, and

wherein the first organic layer has a lower modulus of elasticity and higher breaking strength than the first layer and the second layer.

16. The semiconductor device according to claim 15, further comprising:

an adhesive layer between the first insulating layer and the first organic layer.

17. The semiconductor device according to claim 15, further comprising:

a second organic layer over the second layer,

wherein the second organic layer has a lower modulus of elasticity and higher breaking strength than the first layer and the second layer.

18. The semiconductor device according to claim 15, wherein the first organic layer is a film having rubber elasticity.

19. The semiconductor device according to claim 15, wherein a thickness of the first organic layer is from 5 μ

m to 20 μ

m.

20. The semiconductor device according to claim 15, further comprising an antenna provided between the second insulating layer and the second layer.

21. The semiconductor device according to claim 20, further comprising an inorganic insulating layer provided between the antenna and the second layer.

22. The semiconductor device according to claim 15,

wherein the first layer has a structure body in which the fibrous body is impregnated with the organic resin, and

wherein the second layer has a structure body in which the fibrous body is impregnated with the organic resin.

23. The semiconductor device according to claim 22, wherein the fibrous body is a woven fabric or a nonwoven fabric.

24. The semiconductor device according to claim 22, wherein the fibrous body is formed using one of a polyvinyl alcohol fiber, a polyester fiber, a polyamide fiber, a polyethylene fiber, an aramid fiber, a polyparaphenylene benzobisoxazole fiber, a glass fiber, and a carbon fiber.

25. The semiconductor device according to claim 22, wherein the organic resin comprises a thermosetting resin or a thermoplastic resin.

26. The semiconductor device according to claim 25, wherein the thermosetting resin is at least one from the group consisting of an epoxy resin, an unsaturated polyester resin, a polyimide resin, a bismaleimide-triazine resin, and a cyanate resin.

27. The semiconductor device according to claim 25, wherein the thermoplastic resin is at least one from the group consisting of a polyphenylene oxide resin, a polyetherimide resin, and a fluorine resin.

28. The semiconductor device according to claim 15, wherein the first insulating layer comprises at least one of silicon nitride, silicon oxynitride, and silicon nitride oxide.

31. The semiconductor device according to claim 15, wherein the transistor comprises a semiconductor layer comprising an oxide semiconductor, the semiconductor layer comprising a channel formation region.

32. The semiconductor device according to claim 31, wherein the oxide semiconductor is zinc oxide in which indium and gallium are added.

33. A semiconductor device comprising:

a first layer;

an aramid film over the first layer, wherein the aramid film has a lower modulus of elasticity and higher breaking strength than the first layer;

a first insulating layer over the aramid film;

a circuit comprising a transistor over the first insulating layer;

a conductive layer over the transistor; and

a second insulating layer over the conductive layer,

wherein the transistor comprises a semiconductor layer comprising an oxide semiconductor, the semiconductor layer comprising a channel formation region.

34. The semiconductor device according to claim 33, wherein the oxide semiconductor is zinc oxide in which indium and gallium are added.

35. The semiconductor device according to claim 33, wherein the aramid film has a modulus of elasticity of higher than or equal to 5 GPa and lower than or equal to 12 GPa and breaking strength higher than 300 MPa.

36. The semiconductor device according to claim 33, further comprising:

an adhesive layer between the first insulating layer and the aramid film.

37. The semiconductor device according to claim 33, further comprising an antenna provided over the second insulating layer.

50. The semiconductor device according to claim 33, wherein the semiconductor device is flexible.

51. The semiconductor device according to claim 33, wherein the first layer has a structure body in which a fibrous body is impregnated with an organic resin.

52. The semiconductor device according to claim 51, wherein the fibrous body is a woven fabric or a nonwoven fabric.

53. The semiconductor device according to claim 51, wherein the fibrous body is formed using one of a polyvinyl alcohol fiber, a polyester fiber, a polyamide fiber, a polyethylene fiber, an aramid fiber, a polyparaphenylene benzobisoxazole fiber, a glass fiber, and a carbon fiber.

54. The semiconductor device according to claim 51, wherein the organic resin comprises a thermosetting resin or a thermoplastic resin.

38. A semiconductor device comprising:

a first layer;

an aramid film over the first layer, wherein the aramid film has a lower modulus of elasticity and higher breaking strength than the first layer; and

an integrated circuit comprising a transistor over the aramid film,

wherein the transistor comprises a semiconductor layer comprising an oxide semiconductor, the semiconductor layer comprising a channel formation region, and

wherein the semiconductor device is flexible.

39. The semiconductor device according to claim 38, wherein the oxide semiconductor is zinc oxide in which indium and gallium are added.

40. The semiconductor device according to claim 38, wherein the aramid film has a modulus of elasticity of higher than or equal to 5 GPa and lower than or equal to 12 GPa and breaking strength higher than 300 MPa.

41. The semiconductor device according to claim 38, further comprising:

an adhesive layer between the integrated circuit and the aramid film.

55. The semiconductor device according to claim 38, wherein the first layer has a structure body in which a fibrous body is impregnated with an organic resin.

56. The semiconductor device according to claim 55, wherein the fibrous body is a woven fabric or a nonwoven fabric.

57. The semiconductor device according to claim 55, wherein the fibrous body is formed using one of a polyvinyl alcohol fiber, a polyester fiber, a polyamide fiber, a polyethylene fiber, an aramid fiber, a polyparaphenylene benzobisoxazole fiber, a glass fiber, and a carbon fiber.

58. The semiconductor device according to claim 55, wherein the organic resin comprises a thermosetting resin or a thermoplastic resin.

42. A semiconductor device comprising:

an integrated circuit comprising a transistor;

a layer over the integrated circuit; and

an aramid film over the layer, wherein the aramid film has a lower modulus of elasticity and higher breaking strength than the layer,

wherein the transistor comprises a semiconductor layer comprising an oxide semiconductor, the semiconductor layer comprising a channel formation region, and

wherein the semiconductor device is flexible.

43. The semiconductor device according to claim 42, wherein the oxide semiconductor is zinc oxide in which indium and gallium are added.

44. The semiconductor device according to claim 42, wherein the aramid film has a modulus of elasticity of higher than or equal to 5 GPa and lower than or equal to 12 GPa and breaking strength higher than 300 MPa.

45. The semiconductor device according to claim 42, further comprising:

an adhesive layer between the integrated circuit and the aramid film.

59. The semiconductor device according to claim 42, wherein the layer has a structure body in which a fibrous body is impregnated with an organic resin.

60. The semiconductor device according to claim 59, wherein the fibrous body is a woven fabric or a nonwoven fabric.

61. The semiconductor device according to claim 59, wherein the fibrous body is formed using one of a polyvinyl alcohol fiber, a polyester fiber, a polyamide fiber, a polyethylene fiber, an aramid fiber, a polyparaphenylene benzobisoxazole fiber, a glass fiber, and a carbon fiber.

62. The semiconductor device according to claim 59, wherein the organic resin comprises a thermosetting resin or a thermoplastic resin.

46. A semiconductor device comprising:

a first layer;

a first aramid film over the first layer, wherein the first aramid film has a lower modulus of elasticity and higher breaking strength than the first layer;

an integrated circuit comprising a transistor over the first aramid film; and

a second aramid film over the integrated circuit,

wherein the transistor comprises a semiconductor layer comprising an oxide semiconductor, the semiconductor layer comprising a channel formation region, and

wherein the semiconductor device is flexible.

47. The semiconductor device according to claim 46, wherein the oxide semiconductor is zinc oxide in which indium and gallium are added.

48. The semiconductor device according to claim 46, wherein one of the first aramid film and the second aramid film has a modulus of elasticity of higher than or equal to 5 GPa and lower than or equal to 12 GPa and breaking strength higher than 300 MPa.

49. The semiconductor device according to claim 46, further comprising:

an adhesive layer between the integrated circuit and one of the first aramid film and the second aramid film.

63. The semiconductor device according to claim 46, wherein the first layer has a structure body in which a fibrous body is impregnated with an organic resin.

64. The semiconductor device according to claim 63, wherein the fibrous body is a woven fabric or a nonwoven fabric.

65. The semiconductor device according to claim 63, wherein the fibrous body is formed using one of a polyvinyl alcohol fiber, a polyester fiber, a polyamide fiber, a polyethylene fiber, an aramid fiber, a polyparaphenylene benzobisoxazole fiber, a glass fiber, and a carbon fiber.

66. The semiconductor device according to claim 63, wherein the organic resin comprises a thermosetting resin or a thermoplastic resin.