Edge termination configurations for high voltage semiconductor power devices
First Claim
1. A method to manufacture a semiconductor power device in a semiconductor substrate with an active cell area and an edge termination area comprising:
- open a wide trench in the edge termination area immediately adjacent to a body region disposed on an outer edge of the active cell area and filling the wide trench with a field-crowding reduction filler followed by etching the field-crowding reduction filler down to a level below a top surface of said wide trench; and
forming a buried field plate along a sidewall of said wide trench and extending vertically along the body region on the outer edge of the active area and cover a top surface of said field-crowing reduction filler followed by filling the wide trench with the field-crowding reduction filler thus burying the buried field plate in the wide trench below the top surface of the trench.
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Abstract
This invention discloses a semiconductor power device disposed in a semiconductor substrate and having an active cell area and an edge termination area wherein the edge termination area comprises a wide trench filled with a field-crowding reduction filler and a buried field plate buried under a top surface of the semiconductor substrate and laterally extended over a top portion of the field crowding field to move a peak electric field laterally away from the active cell area. In a specific embodiment, the field-crowding reduction filler comprises a silicon oxide filled in the wide trench.
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Citations
8 Claims
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1. A method to manufacture a semiconductor power device in a semiconductor substrate with an active cell area and an edge termination area comprising:
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open a wide trench in the edge termination area immediately adjacent to a body region disposed on an outer edge of the active cell area and filling the wide trench with a field-crowding reduction filler followed by etching the field-crowding reduction filler down to a level below a top surface of said wide trench; and forming a buried field plate along a sidewall of said wide trench and extending vertically along the body region on the outer edge of the active area and cover a top surface of said field-crowing reduction filler followed by filling the wide trench with the field-crowding reduction filler thus burying the buried field plate in the wide trench below the top surface of the trench. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification