Semiconductor element and method for manufacturing the same

• US 9,171,938 B2
• Filed: 09/23/2010
• Issued: 10/27/2015
• Est. Priority Date: 09/24/2009
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei, Sakata, Junichiro, Miyanaga, Akiharu, Sakakura, Masayuki, Koezuka, Junichi, Maruyama, Tetsunori, Imoto, Yuki
• Primary Examiner(s): Crawford, Latanya N
• Application Number:
  US12/888,835
• Publication Number:
  US 20110068336A1
• Time in Patent Office: 1,860 Days
• Field of Search: 257/43, 257/E21.411, 257/E29.08, 257/E29.296, 438/104, 438/586, 438/608, 438/158, 438/159
• US Class Current: 1/1
• CPC Class Codes: H01L 21/02565 Oxide semiconducting materials not being Group 12/16 materials, e.g. ternary compounds
• CPC Class Codes: H01L 27/1225 with semiconductor materials not belonging to the group IV of the periodic table, e.g. InGaZnO
• CPC Class Codes: H01L 29/66969 of devices having semiconductor bodies not comprising group 14 or group 13/15 materials comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide H01L21/02365
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate

Abstract

An object is to provide a thin film transistor and a method for manufacturing the thin film transistor including an oxide semiconductor with a controlled threshold voltage, high operation speed, a relatively easy manufacturing process, and sufficient reliability. An impurity having influence on carrier concentration in the oxide semiconductor layer, such as a hydrogen atom or a compound containing a hydrogen atom such as H₂O, may be eliminated. An oxide insulating layer containing a large number of defects such as dangling bonds may be formed in contact with the oxide semiconductor layer, such that the impurity diffuses into the oxide insulating layer and the impurity concentration in the oxide semiconductor layer is reduced. The oxide semiconductor layer or the oxide insulating layer in contact with the oxide semiconductor layer may be formed in a deposition chamber which is evacuated with use of a cryopump whereby the impurity concentration is reduced.

Claims

1. A method for manufacturing an oxide semiconductor element comprising the steps of:

forming a gate electrode over a substrate;

forming a gate insulating film over the gate electrode in a reaction chamber by using a first target provided in the reaction chamber;

forming an oxide semiconductor layer over the gate insulating film in the reaction chamber by using a second target provided in the reaction chamber;

forming a source electrode and a drain electrode, wherein the source electrode and the drain electrode are in contact with the oxide semiconductor layer, and wherein end portions of the source electrode and the drain electrode overlap with the gate electrode; and

forming an oxide insulating layer covering the oxide semiconductor layer between the source electrode and the drain electrode,

wherein the substrate is heated at a temperature lower than or equal to 600°

C. in the reaction chamber before forming the gate insulating film.

wherein a hydrogen concentration at an interface between the oxide semiconductor layer and the oxide insulating layer is more than or equal to 5 times and less than or equal to 100 times as high as a hydrogen concentration in a portion of the oxide insulating layer apart from the interface by 30 nm.

2. The method for manufacturing the oxide semiconductor element according to claim 1, wherein a purity of a sputtering gas introduced in the reaction chamber is 99.9999% or higher.

3. The method for manufacturing the oxide semiconductor element according to claim 1, wherein remaining moisture in the reaction chamber is removed by evacuation with use of a cryopump.

4. The method for manufacturing the oxide semiconductor element according to claim 1, wherein the second target is a metal oxide containing zinc oxide as a main component.

5. The method for manufacturing the oxide semiconductor element according to claim 1, wherein the second target is a metal oxide containing indium, gallium, and zinc.

6. The method for manufacturing the oxide semiconductor element according to claim 1, wherein the oxide semiconductor layer is formed without being exposed to air after forming the gate insulating film.

7. A method for manufacturing an oxide semiconductor element comprising the steps of:

forming a gate electrode over a substrate;

forming a gate insulating film over the gate electrode;

heating the substrate at a temperature lower than or equal to 600°

C. in a heat chamber after forming the gate insulating film;

forming an oxide semiconductor layer over the gate insulating film in a reaction chamber by using a target provided in the reaction chamber;

forming a source electrode and a drain electrode, wherein the source electrode and the drain electrode are in contact with the oxide semiconductor layer, and wherein end portions of the source electrode and the drain electrode overlap with the gate electrode; and

forming an oxide insulating layer covering the oxide semiconductor layer between the source electrode and the drain electrode,

wherein the substrate is heated at a temperature higher than or equal to 100°

C. and lower than or equal to 600°

C. in the reaction chamber.

wherein a hydrogen concentration at an interface between the oxide semiconductor layer and the oxide insulating layer is more than or equal to 5 times and less than or equal to 100 times as high as a hydrogen concentration in a portion of the oxide insulating layer apart from the interface by 30 nm.

8. The method for manufacturing the oxide semiconductor element according to claim 7, wherein remaining moisture in the reaction chamber is removed by evacuation with use of a cryopump.

9. The method for manufacturing the oxide semiconductor element according to claim 7, wherein the target is a metal oxide containing zinc oxide as a main component.

10. The method for manufacturing the oxide semiconductor element according to claim 7, wherein the target is a metal oxide containing indium, gallium, and zinc.

11. The method for manufacturing the oxide semiconductor element according to claim 7, wherein the oxide semiconductor layer is formed without being exposed to air after heating the substrate.

12. A thin film transistor comprising:

a gate electrode over a substrate;

a gate insulating film over the gate electrode;

an oxide semiconductor layer over the gate electrode with the gate insulating film therebetween;

a source electrode and a drain electrode, wherein the source electrode and the drain electrode are in contact with the oxide semiconductor layer, and wherein end portions of the source electrode and the drain electrode overlap with the gate electrode; and

an oxide insulating layer covering the oxide semiconductor layer between the source electrode and the drain electrode,

wherein a hydrogen concentration at an interface between the oxide semiconductor layer and the oxide insulating layer is more than or equal to 5 times and less than or equal to 100 times as high as a hydrogen concentration in a portion of the oxide insulating layer apart from the interface by 30 nm.

13. The thin film transistor according to claim 12, wherein the oxide semiconductor layer contains zinc.

14. The thin film transistor according to claim 12, wherein the oxide semiconductor layer is an In—

Ga—

Zn—

O-based film.