Systems and methods for a three-layer chip-scale MEMS device

• US 9,171,964 B2
• Filed: 11/15/2011
• Issued: 10/27/2015
• Est. Priority Date: 11/23/2010
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Horning, Robert D., Supino, Ryan
• Primary Examiner(s): Nicely, Joseph C
• Application Number:
  US13/296,642
• Publication Number:
  US 20120126349A1
• Time in Patent Office: 1,442 Days
• US Class Current: 1/1
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 7/0032 Packages or encapsulation processes for packaging MEMS B81C1/00261; packaging of smart-MEMS B81C1/0023
• CPC Class Codes: B81B 7/0038 using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: B81B 7/0077 Other packages not provided for in groups B81B7/0035 - B81B7/0074
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 29/84 controllable by variation of applied mechanical force, e.g. of pressure
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.

Claims

1. A micro-electromechanical system (MEMS) device, the device comprising:

a first outer layer;

a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer;

a second outer layer;

a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer; and

a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer, wherein the central layer comprises a continuous material between the first side and the second side.

2. The MEMS device of claim 1, wherein the MEMS device is an inertial sensor assembly (ISA).

3. The MEMS device of claim 1, wherein:

the first set of MEMS devices comprises a first set of accelerometers and a first set of gyroscopes; and

the second set of MEMS devices comprises a second set of accelerometers and a second set of gyroscopes.

4. The MEMS device of claim 3, wherein the first set of gyroscopes and the second set of gyroscopes are hermetically sealed in a first atmosphere type and the first set of accelerometers and the second set of accelerometers are hermetically sealed in a second atmosphere type.

5. The MEMS device of claim 4, wherein the first atmosphere type is a vacuum environment.

6. The MEMS device of claim 4, wherein the second atmosphere type is a gaseous environment.

7. The MEMS device of claim 6, further comprising a channel extending from an external surface of the MEMS device to one of the first set of gyroscopes, the second set of gyroscopes, the first set of accelerometers, and the second set of accelerometers.

8. The MEMS device of claim 7, further comprising a sealing layer attached to an external side of the MEMS device, the sealing layer hermetically sealing the channel.

9. The MEMS device of claim 8, wherein the sealing layer includes a getter to preserve a vacuum environment that encloses the first set of gyroscopes.

10. The MEMS device of claim 8, wherein electrical connections extend around the sealing layer such that the MEMS device is mountable in a plurality of different positions.

11. A micro-electromechanical system inertial measurement unit comprising:

a first outer glass layer;

a first device layer comprising a first set of accelerometers and a first set of gyroscopes, the first device layer bonded to the first outer glass layer;

a second outer glass layer;

a second device layer comprising a second set of accelerometers and a second set of gyroscopes, the second device layer bonded to the second outer glass layer; and

a central glass layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer, wherein the central glass layer comprises a continuous material between the first side and the second side,

wherein the first set of accelerometers and the second set of accelerometers are hermetically sealed in a first atmosphere and the first set of gyroscopes and the second set of gyroscopes are hermetically sealed in a second atmosphere,

wherein the first set of accelerometers and second set of accelerometers sense acceleration along three orthogonal axes and the first set of gyroscopes and the second set of gyroscopes sense rotation about three orthogonal axes.