Systems and methods for a three-layer chip-scale MEMS device
First Claim
1. A micro-electromechanical system (MEMS) device, the device comprising:
- a first outer layer;
a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer;
a second outer layer;
a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer; and
a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer, wherein the central layer comprises a continuous material between the first side and the second side.
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Abstract
Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.
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Citations
11 Claims
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1. A micro-electromechanical system (MEMS) device, the device comprising:
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a first outer layer; a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer; a second outer layer; a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer; and a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer, wherein the central layer comprises a continuous material between the first side and the second side. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A micro-electromechanical system inertial measurement unit comprising:
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a first outer glass layer; a first device layer comprising a first set of accelerometers and a first set of gyroscopes, the first device layer bonded to the first outer glass layer; a second outer glass layer; a second device layer comprising a second set of accelerometers and a second set of gyroscopes, the second device layer bonded to the second outer glass layer; and a central glass layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer, wherein the central glass layer comprises a continuous material between the first side and the second side, wherein the first set of accelerometers and the second set of accelerometers are hermetically sealed in a first atmosphere and the first set of gyroscopes and the second set of gyroscopes are hermetically sealed in a second atmosphere, wherein the first set of accelerometers and second set of accelerometers sense acceleration along three orthogonal axes and the first set of gyroscopes and the second set of gyroscopes sense rotation about three orthogonal axes.
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Specification