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Flip chip type light emitting diode and manufacturing method thereof

  • US 9,171,995 B2
  • Filed: 05/29/2012
  • Issued: 10/27/2015
  • Est. Priority Date: 05/30/2011
  • Status: Active Grant
First Claim
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1. A light emitting diode (LED), comprising:

  • a substrate that comprises;

    a body having a first surface and a second surface opposite to the first surface;

    a plurality of third pads disposed on the first surface;

    a fourth pad disposed on the first surface;

    a first electrode disposed on the second surface;

    a second electrode disposed on the second surface;

    a plurality of first vias traversing through the body and electrically coupling the third pads and the first electrode;

    a second via traversing through the body and electrically coupling the fourth pad and the second electrode; and

    a plurality of third vias; and

    an LED chip that is flip-chip bonded to the substrate, the LED chip comprising;

    a transparent substrate;

    a first type semiconductor layer disposed on the transparent substrate;

    an active semiconductor layer disposed on the first type semiconductor layer;

    a second type semiconductor layer disposed on the active semiconductor layer;

    a first pad disposed on the second type semiconductor layer and electrically coupled to the third pads; and

    a second pad disposed on the second type semiconductor layer and electrically coupled to the fourth pad;

    wherein the plurality of third vias traverse through the second type semiconductor layer and the active semiconductor layer, and wherein the plurality of third vias electrically couple the first pad and the first type semiconductor layer, andwherein a peripheral side of the LED chip is flush with a peripheral side of the body of the substrate.

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