Flip chip type light emitting diode and manufacturing method thereof

• US 9,171,995 B2
• Filed: 05/29/2012
• Issued: 10/27/2015
• Est. Priority Date: 05/30/2011
• Status: Active Grant

• Current Assignee: Everlight Electronics Company Limited
• Original Assignee: Everlight Electronics Company Limited
• Inventors: Yeh, Robert
• Primary Examiner(s): Lee, Cheung
• Assistant Examiner(s): Hargrove, Frederick B
• Application Number:
  US13/482,485
• Publication Number:
  US 20120305967A1
• Time in Patent Office: 1,246 Days
• Field of Search: 257/79, 257/81, 257 98-100, 438/42
• US Class Current: 1/1
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2933/0016 relating to electrodes
• CPC Class Codes: H01L 2933/0033 relating to semiconductor body packages
• CPC Class Codes: H01L 2933/0066 relating to arrangements for conducting electric current to or from the semiconductor body
• CPC Class Codes: H01L 33/0093 Wafer bonding; Removal of the growth substrate
• CPC Class Codes: H01L 33/382 the electrode extending partially in or entirely through the semiconductor body
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

The present disclosure provides a flip chip type light emitting diode which comprises a substrate and a light emitting diode chip. The substrate comprises a body, a plurality of third pads, a fourth pad, a first electrode, a second electrode, a plurality of first vias, and a second via. The body has a first surface and a second surface opposite to the first surface. The third pads and the fourth pad are disposed on the first surface of the body. The first electrode and the second electrode are disposed on the second surface of the body. The first vias traverse through the body and are each electrically coupled to a respective one of the third pads and the first electrode. The second via traverses through the body and is electrically coupled to the fourth pad and the second electrode.

Claims

1. A light emitting diode (LED), comprising:

a substrate that comprises;

a body having a first surface and a second surface opposite to the first surface;

a plurality of third pads disposed on the first surface;

a fourth pad disposed on the first surface;

a first electrode disposed on the second surface;

a second electrode disposed on the second surface;

a plurality of first vias traversing through the body and electrically coupling the third pads and the first electrode;

a second via traversing through the body and electrically coupling the fourth pad and the second electrode; and

a plurality of third vias; and

an LED chip that is flip-chip bonded to the substrate, the LED chip comprising;

a transparent substrate;

a first type semiconductor layer disposed on the transparent substrate;

an active semiconductor layer disposed on the first type semiconductor layer;

a second type semiconductor layer disposed on the active semiconductor layer;

a first pad disposed on the second type semiconductor layer and electrically coupled to the third pads; and

a second pad disposed on the second type semiconductor layer and electrically coupled to the fourth pad;

wherein the plurality of third vias traverse through the second type semiconductor layer and the active semiconductor layer, and wherein the plurality of third vias electrically couple the first pad and the first type semiconductor layer, and

wherein a peripheral side of the LED chip is flush with a peripheral side of the body of the substrate.

2. The LED as recited in claim 1, wherein the substrate comprises a silicon substrate or an electrically insulating substrate.

3. The LED as recited in claim 1, wherein the first type semiconductor layer and the second type semiconductor layer comprise a combination of an N-type semiconductor layer and a P-type semiconductor layer.

4. The LED as recited in claim 1, wherein the transparent substrate comprises sapphire.

5. The LED as recited in claim 1, further comprising:

an adhesive layer disposed between the LED chip and the substrate.

6. The LED as recited in claim 5, wherein the adhesive layer comprises an ohmic contact layer, a reflective layer, a bonding layer, a barrier layer, or any combination of one or more thereof.

7. The LED as recited in claim 1, wherein the transparent substrate comprises a regular profile roughened surface or an irregular profile roughened surface.

8. The LED as recited in claim 1, wherein a number of the third vias is equal to a number of the first vias.

9. The LED as recited in claim 1, wherein a distance between the first pad and the second pad is greater than either or, or equal to both of, a distance between the third pads and the fourth pad and a distance between the first electrode and the second electrode.

10. The LED as recited in claim 1, wherein an arrangement of the third pads, the first electrode and the first pad includes a combination of a single pad, multiple pads, a single electrode, multiple electrodes, a single contact layer or multiple contact layers.

11. The LED as recited in claim 1, further comprising:

an electrical insulation layer disposed between the third vias, the second type semiconductor layer and the active semiconductor layer to isolate the third vias, the second type semiconductor layer and the active semiconductor layer.

12. The LED as recited in claim 1, further comprising:

an electrical insulation layer disposed between the first vias and the body, between the second via and the body, on a side surface of the body, and on areas of the first surface of the body and the second surface of the body that are not traversed by the first vias and the second via.

13. The LED as recited in claim 1, further comprising:

a current distribution layer disposed between the second pad and the second type semiconductor layer, and between the electrical insulation layer and the second type semiconductor layer.

14. A light emitting diode (LED), comprising:

a substrate that comprises a body having a first surface and a second surface opposite to the first surface;

a transparent substrate;

a first type semiconductor layer disposed on the transparent substrate;

an active semiconductor layer disposed on the first type semiconductor layer;

a second type semiconductor layer disposed on the active semiconductor layer;

a plurality of first vias traversing through the body of the substrate, the second type semiconductor layer, and the active semiconductor layer;

a second via traversing through the body of the substrate;

a first electrode disposed on the second surface of the body;

a second electrode disposed on the second surface of the body;

an adhesive layer disposed between the second type semiconductor layer and the first surface of the substrate; and

an electrical insulation layer disposed between the first vias and the body of the substrate, between the first vias and the adhesive layer, between the first vias and the second type semiconductor layer and the active semiconductor layer, between the second via and the body of the substrate, and on a side surface of the body of the substrate,

wherein the first vias electrically couple the first type semiconductor layer and the first electrode, and wherein the second via electrically couple the second type semiconductor layer and the second electrode.

15. The LED as recited in claim 14, wherein the substrate comprises a silicon substrate or an electrically insulating substrate.

16. The LED as recited in claim 14, wherein the first type semiconductor layer and the second type semiconductor layer comprise a combination of an N-type semiconductor layer and a P-type semiconductor layer.

17. The LED as recited in claim 14, wherein the transparent substrate comprises sapphire.

18. The LED as recited in claim 14, wherein the adhesive layer comprises an ohmic contact layer, a reflective layer, a bonding layer, a barrier layer, or any combination of one or more thereof.

19. The LED as recited in claim 14, wherein the transparent substrate comprises a regular profile roughened surface or an irregular profile roughened surface.