Transmit/receive daughter card with integral circulator

• US 9,172,145 B2
• Filed: 10/03/2014
• Issued: 10/27/2015
• Est. Priority Date: 09/21/2006
• Status: Active Grant

• Current Assignee: Raytheon Company (Rtx Corporation)
• Original Assignee: Raytheon Company (Rtx Corporation)
• Inventors: Puzella, Angelo M., Bozza, Donald A., Francis, John B., Robbins, James A.
• Primary Examiner(s): DUONG, DIEU HIEN
• Application Number:
  US14/505,980
• Publication Number:
  US 20150015453A1
• Time in Patent Office: 389 Days
• Field of Search: 343/700.MS, 343/853
• US Class Current: 1/1
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2223/6683 for monolithic microwave integrated circuit [MMIC]
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01P 1/38 Circulators
• CPC Class Codes: H01Q 1/02 Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
• CPC Class Codes: H01Q 21/00 Antenna arrays or systems arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system H01Q3/00
• CPC Class Codes: H01Q 21/0025 Modular arrays
• CPC Class Codes: H01Q 21/0087 Apparatus or processes specially adapted for manufacturing antenna arrays manufacturing waveguides H01P11/00
• CPC Class Codes: H01Q 21/065 Patch antenna array
• CPC Class Codes: H01Q 9/0414 in a stacked or folded configuration
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 1/0207 using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes

Abstract

A mixed-signal, multilayer printed wiring board fabricated in a single lamination step is described. The PWB includes one or more radio frequency (RF) interconnects between different circuit layers on different circuit boards which make up the PWB. The PWB includes a number of unit cells with radiating elements and an RF cage disposed around each unit cell to isolate the unit cell. A plurality of flip-chip circuits are disposed on an external surface of the PWB and a heat sink can be disposed over the flip chip components.

Claims

1. A transmit receive (T/R) daughter card assembly comprising:

a printed circuit board (PCB) having first and second opposing surfaces and having a plurality unit cells with each unit cell having one or more electrical contacts on the first surface of said PCB and each unit cell having one or more electrical contacts on the second opposing surface of said PCB;

a plurality of radio frequency (RF) circulators disposed on a first one of the first and second surfaces of said PCB, each of said circulators disposed within the boundaries of a respective one of said plurality of unit cells, and each of said circulators electrically coupled to at least some of the one or more electrical contacts within the respective unit cell;

a thermally and electrically conductive layer disposed on the first one of the first and second surfaces of said PCB, said circulator thermally and electrically conductive layer in thermal and electrical contact with said plurality of circulators;

one or more RF integrated circuits disposed on a second, opposite one of the first and second surfaces of said PCB, each of said RF integrated circuits disposed within the boundaries of a respective one of said plurality of unit cells and each of said RF integrated circuits electrically coupled to at least some of the one or more electrical contacts on the second surface of said PCB within the unit cell in which the one or more RF integrated circuit is disposed;

one or more thermal vias disposed through said PCB to provide thermal paths from the said thermally and electrically conductive layer disposed on the first one of the first and second surfaces of said PCB to the second opposing surface of said PCB; and

one or more heat spreaders disposed on the second one of the first and second surfaces of said PCB which is opposite the surface on which the circulators are mounted, said one or more heat spreaders thermally coupled to said thermally and electrically conductive layer disposed on the first one of the first and second surfaces of said PCB through at least one of the one or more thermal vias.

2. The T/R daughter card assembly of claim 1 wherein:

each unit cell is provided having an RF circulator disposed within the boundaries thereof; and

each unit cell is provided having an RF integrated circuit disposed within the boundaries thereof.

3. The T/R daughter card assembly of claim 2 wherein:

each RF circulator corresponds to a surface mount component disposed within the boundaries of the unit cell; and

each RF integrated circuit is provided as a monolithic microwave integrated circuit (MMIC) disposed within the boundaries of the unit cell.

4. The T/R daughter card assembly of claim 3 wherein each of said RF circulators is provided having a high power handling capability and covers up to one-half of the surface area of the unit cell on the first surface of said PCB.

5. The T/R daughter card assembly of claim 1 wherein each of said plurality of unit cells are electrically isolated from each other at RF wavelengths.

6. The T/R daughter card assembly of claim 5 wherein said thermally and electrically conductive layer is provided as a conductive ground plane disposed on the first surface of said PCB and wherein said conductive ground plane spreads the dissipated heat and said thermal vias disposed through said PCB transfer heat from said RF circulators to said heat spreaders mounted on the surface of the daughter card which is opposite the surface on which the circulators are mounted.

7. The T/R daughter card assembly of claim 6 further comprising one or more additional cooling mechanisms thermally coupled to said heat spreaders.

8. The T/R daughter card assembly of claim 6 wherein:

said heat spreaders are provided as Silicon (Si) heat spreaders; and

said one or more additional cooling mechanisms includes an array cooling manifold.

9. The T/R daughter card assembly of claim 6 wherein at least some of the one or more electrical contacts on the first surface of said PCB are provided as radio frequency (RF) signal ports.

10. The T/R daughter card assembly of claim 9 further comprising conductive via holes in each of the unit cells in said PCB, each of the conductive via holes provided to complete electrical interconnections between at least one of:

RF;

DC power; and

/or logic circuits provided as part of the T/R daughter card.

11. The T/R daughter card assembly of claim 10 wherein said MMICs are flip-chip mounted and directly bonded to the second surface of said PCB.

12. The T/R daughter card assembly of claim 11 wherein said SiC heat spreaders are thermally coupled to said MMIC flip-chip circuits.

13. The T/R daughter card assembly of claim 11 comprising a heat sink thermally coupled to said the MMICs.

14. The T/R daughter card assembly of claim 13 wherein said heat sink is provided as a liquid cooled brazement thermally coupled to said MMICs.

15. A modular, scalable radio frequency (RF) circuit card array (CCA) assembly comprising:

(A) an eggcrate/feed beamformer assembly first and second opposing surfaces with a first surface corresponding to a radiator surface and the second surface corresponding to a feed beamformer surface, said eggcrate/feed beamformer assembly comprising;

(1) an outer patch printed wring board (PWB), having a first radiating surface and a second opposing surface and comprising a plurality of antenna elements configured to radiate RF energy from the radiating surface of said outer patch PWB;

(2) an outer PWB eggcrate having a first surface disposed over the second surface of said outer patch PWB and having a second opposing surface, wherein walls of said outer PWB eggcrate define a plurality of unit cells within at least some of the outer patch PWB antenna elements are disposed;

(3) an inner patch PWB having a first surface disposed over the second surface of said outer PWB eggcrate and having a second opposing surface and comprising a plurality of antenna elements configured to radiate RF energy from the radiating surface of said outer patch PWB with at least some of the inner patch PWB antenna elements disposed within ones of the plurality of unit cells;

(4) an inner PWB eggcrate having a first surface disposed over the second surface of said inner patch PWB and having a second opposing surface wherein walls of said inner PWB eggcrate are substantially aligned with wall of said outer PWB eggcrate to further define unit cell regions; and

(5) a feed beamformer PWB circuit having a first surface disposed over the second surface of said inner PWB eggcrate and having a second opposing surface; and

(B) a T/R assembly having a first surface disposed over the second surface of said feed beamformer PWB circuit and having a second opposing surface, said daughter card assembly comprising;

(1) an eggcrate interposer having a first surface corresponding to the first surface of said T/R daughter card assembly and a second opposing surface; and

(2) one or more T/R daughter card assemblies, each of the one or more daughter card assemblies having first and second opposing surfaces with the first surface corresponding to a circulator surface and the second surface corresponding to a MMIC surface and wherein the circulator surface of said one or more daughter card assemblies is disposed over the second surface of said eggcrate interposer and each of said daughter card assemblies having one or more unit cells with the total number of unit cells from said one or more daughter card assemblies corresponding to the number of unit cells defined by the walls of said outer PWB eggcrate, and wherein each of said one or more daughter card assemblies comprising;

(a) a multi-layer printed circuit board (PCB) having first and second opposing surface and having a plurality unit cells with each unit cell having one or more electrical contacts on the first surface of said PCB and having one or more electrical contacts on the second opposing surface of said PCB;

(b) a plurality of circulators disposed on a first one of the first and second surfaces of said PCB, said of circulators disposed within the boundaries of a respective one of said plurality unit cells, and each of said of circulators electrically coupled to at least some of the one or more electrical contacts within the respective unit cell;

(c) a thermally and electrically conductive layer disposed on the first one of the first and second surfaces of said PCB, said circulator thermally and electrically conductive layer in thermal and electrical contact with said circulator;

(d) one or more monolithic microwave integrated circuits (MMICs) disposed on a second, opposite one of the first and second surfaces of said PCB, said MMICs electrically coupled to at least some of the one or more electrical contacts on the second surface of said PCB;

(e) one or more thermal vias disposed through the PCB to provide thermal paths from the thermally and electrically conductive layer disposed on the first one of the first and second surfaces of said PCB to the second opposing surface of the PCB;

(f) one or more heat spreaders disposed on a second one of the first and second surfaces of said PCB which is opposite the surface on which the circulators are mounted, said one or more heat spreaders thermally coupled to said thermally and electrically conductive layer disposed on the first one of the first and second surfaces of said PCB.

16. The modular, scalable RF CCA assembly of claim 15 wherein:

each unit cell is provided having an RF circulator disposed within the boundaries thereof; and

each unit cell is provided having an RF integrated circuit disposed within the boundaries thereof.

17. The modular, scalable RF CCA assembly of claim 16 wherein:

each RF circulator corresponds to a surface mount component disposed within the boundaries of the unit cell; and

each RF integrated circuit is provided as a monolithic microwave integrated circuit (MMIC) disposed within the boundaries of the unit cell.

18. A modular, scalable radio frequency (RF) circuit card array (CCA) assembly comprising:

an eggcrate/feed beamformer assembly first and second opposing surfaces with a first surface corresponding to a radiator surface and the second surface corresponding to a feed beamformer surface, said eggcrate/feed beamformer assembly comprising;

an outer patch printed wring board (PWB), having a first radiating surface and a second opposing surface and comprising a plurality of antenna elements configured to radiate RF energy from the radiating surface of said outer patch PWB;

an outer PWB eggcrate having a first surface disposed over the second surface of said outer patch PWB and having a second opposing surface;

an inner patch PWB having a first surface disposed over the second surface of said outer PWB eggcrate and having a second opposing surface and comprising a plurality of antenna elements configured to radiate RF energy from the radiating surface of said outer patch PWB;

an inner PWB eggcrate having a first surface disposed over the second surface of said inner patch PWB and having a second opposing surface; and

a feed beamformer PWB circuit having a first surface disposed over the second surface of said inner PWB eggcrate and having a second opposing surface; and

a T/R assembly having a first surface disposed over the second surface of said feed beamformer PWB circuit and having a second opposing surface, said daughter card assembly comprising;

an eggcrate interposer having a first surface corresponding to the first surface of said T/R assembly and a second opposing surface; and

one or more daughter card assemblies, each of the one or more T/R daughter cards having a first surface with surface mounted circulators disposed thereon and a second, opposing surface with a plurality of RF integrated circuits disposed therein wherein the circulator surface of said one or more T/R daughter cards is disposed over the second surface of said eggcrate interposer and wherein each of said surface mount circulators are disposed within the boundary of a respective one of said plurality of unit cells of the modular, scalable RF CCA assembly and the plurality of RF integrated circuits are disposed within the boundary of a respective one of said plurality of unit cells of the modular, scalable RF CCA assembly on a surface of the T/R daughter card which is opposite the surface on which the plurality of circulators is disposed.

19. The modular, scalable RF CCA assembly of claim 18 wherein at least some of said one or more daughter card assemblies comprise:

a multilayer laminated circuit board assembly having first and second opposing surfaces, said multilayer laminated circuit board assembly comprising at least one layer having an RF feed circuit disposed thereon, at least one layer having logic circuits disposed thereon and at least one layer having a DC circuit disposed thereon and wherein the first surface of said multilayer laminated circuit board assembly corresponds to a top-most layer of said multilayer laminated circuit board assembly and the second surface of said multilayer laminated circuit board assembly corresponds to a bottom-most layer of said multilayer laminated circuit board assembly and wherein said multilayer laminated circuit board assembly further includes a plurality of plated through holes extending from the top-most layer to the bottom-most layer of said multilayer laminated circuit board assembly with the plurality of plated through holes forming a plurality of unit cells; and

a plurality of circulators disposed on the top-most layer of said multilayer laminated circuit board assembly with each of said plurality of circulators disposed within the boundaries of a respective one of said plurality of unit cells; and

a plurality of integrated circuits disposed on the bottom-most layer of said multilayer laminated circuit board assembly with each of said plurality of integrated circuits disposed within the boundaries of a respective one of said plurality of unit cells such that one surface of the multilayer laminated circuit board assembly has a plurality of circulators disposed thereon and the opposite surface of the multilayer laminated circuit board assembly has one or more integrated circuits disposed thereon and each of said circulators and integrated circuits are disposed within the boundaries of respective ones of unit cells provided in the multilayer laminated circuit board assembly.

20. The modular, scalable RF CCA assembly of claim 18 wherein each of said daughter card assemblies comprises a first plurality of waveguide cages, each of said first plurality of waveguide cages disposed about a perimeter of said first plurality of circulators wherein each of said first plurality of waveguide cages formed from plated-through holes extending from a first outermost layer of the daughter card assembly to a second outermost layer of the daughter card assembly.