Package carrier for a microelectronic element

• US 9,173,315 B2
• Filed: 12/07/2012
• Issued: 10/27/2015
• Est. Priority Date: 11/09/2005
• Status: Active Grant

• Current Assignee: Koninklijke Philips N.V.
• Original Assignee: Koninklijke Philips N.V.
• Inventors: Weekamp, Johannes Wilhelmus, Van Den Ackerveken, Antonius Constant Johanna Cornelis, Ansems, Will J. H.
• Primary Examiner(s): Chen, Xiaoliang
• Application Number:
  US13/707,713
• Publication Number:
  US 20130094128A1
• Time in Patent Office: 1,054 Days
• Field of Search: 361/820, 257/99, 257/668, 257/690, 257/700, 257/701, 174/542, 174/551, 174/560, 737/27
• US Class Current: 1/1
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0627 Sensor or part of a sensor is integrated
• CPC Class Codes: B01L 2300/0645 Electrodes
• CPC Class Codes: B01L 2300/0816 Cards, e.g. flat sample carriers usually with flow in two horizontal directions
• CPC Class Codes: B01L 2300/0838 Capillaries
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: H01L 2224/85385 Shape, e.g. interlocking features
• CPC Class Codes: H05K 1/0284 Details of three-dimensional rigid printed circuit boards H05K1/119 takes precedence; shaping of the substrate H05K3/0014
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 13/046 Surface mounting surface mounted components H05K3/341
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2201/10151 Sensor
• CPC Class Codes: H05K 3/0014 Shaping of the substrate, e.g. by moulding
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 7/00 Constructional details common to different types of electric apparatus casings, cabinets, drawers H05K5/00
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49004 including measuring or testing of device or component part
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49147 Assembling terminal to base
• CPC Class Codes: Y10T 29/49169 Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/4981 : Utilizing transitory attached element or associated separate material

Abstract

A package carrier enclosing at least one microelectronic element has a pattern of electrically conductive connection pads for electric connection of the microelectronic element to the package carrier. The package carrier is manufactured by providing a sacrificial carrier; applying an electrically conductive pattern to one side of the carrier; bending the carrier to create a shape having an elevated portion and a recessed portion; forming a body member on the carrier at the side where the electrically conductive pattern is present; removing the sacrificial carrier; and placing a microelectronic element in a recess created in the body member at the position where the elevated portion of the carrier has been, and connecting the microelectronic element to the electrically conductive pattern. Furthermore, a hole in the package provides access to a sensitive surface of the microelectronic element.

Claims

1. A package carrier, comprising:

a single layer body member having a first side;

a first recess in the first side of the body member, the first recess being configured to accommodate a microelectronic element; and

a circuit pattern of electrically conductive connection pads and electrically conductive tracks, the circuit pattern being configured on an upper surface of the single layer body member, the circuit pattern being integral with the body member, and at least one of the electrically conductive connection pads of the circuit pattern is present in the first recess and extends outside of the recess; and

wherein the single layer body member has at least one hole, and wherein the first recess extends to the hole, and

wherein the body member has a second side having a second recess, the second side of the body member being different than the first side of the body member and the second recess in the second side of the body member being different than the first recess in the first side of the body member where the first recess and the electrically conductive pattern are present, and wherein the at least one hole of the body member is also present at a bottom of the second recess of the second side of the body member.

2. The package carrier of claim 1, comprising the microelectronic element which is positioned in the first recess of the body member, and which is connected to the at least one of the electrically conductive connection pads.

3. The package carrier of claim 1, comprising a covering member which is applied to the body member and through which the at least one hole of the body member extends.

4. The package carrier of claim 2, wherein the first recess with the microelectronic element is filled with an encapsulant.

6. The package carrier of claim 2, comprising a member configured to conduct a fluid toward the at least one hole through which the microelectronic element is accessible.

7. The package carrier of claim 6, wherein the body member of the package has a second side having a second recess from which the microelectronic element is accessible through the at least one hole, wherein this hole is present in a bottom of the second recess, and wherein at least a part of the member which is configured to conduct a fluid is positioned in the second recess.

8. The package carrier of claim 6, wherein the member which is configured to conduct a fluid comprises a hose having a hole at a position where the hose covers the hole through which the microelectronic element is accessible.

9. The package carrier of claim 6, wherein the member which is configured to conduct a fluid comprises a plate having a pattern of channels for conducting a fluid, at one side of the plate.

10. The package carrier of claim 6, comprising at least one reagent which is positioned on the body member of the package, wherein the member which is configured to conduct a fluid is configured to put the fluid in contact with the at least one reagent.

11. The package carrier according to claim 1, wherein the microelectronic element is a sensor die.

12. The package carrier according to claim 4, wherein the encapsulant is an epoxy resin.

5. The package carrier of claim, wherein the first recess has a first longitudinal axes on the first side of the body member and the second recess has a second longitudinal axis on the second side of the body member and wherein the first and second longitudinal axis extend in different directions.