Heat sink-integrated double-sided cooled power module
First Claim
1. A heat sink-integrated double-sided cooled power module that is used in an inverter for a vehicle, comprising:
- heat sinks disposed in upper and lower portions of the power module; and
direct bonding materials (DBMs) that are deposited between the upper and lower heat sinks where a chip is interposed between the DBMs,wherein faces between the heat sinks, the chip, and the DBMs are bonded to one another by a solder, and an entire circumference of the chip and the DBMs is finished by a mold portion,wherein the heat sinks comprise a plurality of apertures through which cooling water flows and which are formed in the heat sinks,wherein several power modules comprising the mold portion and the upper and lower heat sinks are connected to one another by a module connector, andwherein the module connector comprises a cooling water path through which cooling water flows and which communicates with the plurality of apertures inside the heat sinks in a state where the heat sinks contact both sides of the module connector.
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Accused Products
Abstract
A power module for an inverter that is used in an eco-friendly vehicle, such as a hybrid vehicle, an electrical vehicle, or a fuel cell vehicle, i.e., a heat sink-integrated double-sided cooled power module in which cooling efficiency is maximized by adopting a double-sided direct cooling method that uses a heat sink manufactured by an extrusion method. In particular, the heat sink is disposed in upper and lower portions of the power module, and direct bonding materials (DBMs) are deposited between the upper and lower heat sinks where a chip is interposed between the DBMs. Faces between the heat sinks, the chip, and the DBMs are bonded to one another by a solder, and an entire circumference of the chip and the DBMs is finished by a mold portion.
6 Citations
5 Claims
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1. A heat sink-integrated double-sided cooled power module that is used in an inverter for a vehicle, comprising:
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heat sinks disposed in upper and lower portions of the power module; and direct bonding materials (DBMs) that are deposited between the upper and lower heat sinks where a chip is interposed between the DBMs, wherein faces between the heat sinks, the chip, and the DBMs are bonded to one another by a solder, and an entire circumference of the chip and the DBMs is finished by a mold portion, wherein the heat sinks comprise a plurality of apertures through which cooling water flows and which are formed in the heat sinks, wherein several power modules comprising the mold portion and the upper and lower heat sinks are connected to one another by a module connector, and wherein the module connector comprises a cooling water path through which cooling water flows and which communicates with the plurality of apertures inside the heat sinks in a state where the heat sinks contact both sides of the module connector. - View Dependent Claims (2, 3, 4, 5)
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Specification