Fabrication of implantable fully integrated electrochemical sensors
First Claim
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1. A method for fabricating a miniaturized implantable device:
- fabricating an electronic system by monolithically integrating the electronic system on a first face of a substrate, the electronic system being configured, during operation of the implantable device, to communicate with an external device over a wireless communication link and to extract power for the implantable device from the wireless communication link;
fabricating a coil by monolithically integrating the coil on the first face of the substrate, the coil being configured to provide the wireless communication link;
fabricating a plurality of electrodes of an electrochemical sensor on a first metal layer separate from metal layers used to fabricate the electronic system by monolithically integrating the plurality of electrodes on the first face of the substrate, the plurality of electrodes being configured to provide electrical interface between the electrochemical sensor of the implantable device and the electronic system; and
creating a plurality of wells in correspondence of the plurality of electrodes.
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Abstract
A fully integrated small size implantable sensing device is described, which can include a sensor and an electronic circuit to interface with the sensor and communicate with an external device. Various fabrication methods for the sensing device are described, including provision of wells, created using same fabrication technology as the electronic circuit, to contain electrodes of the sensor and corresponding functionalization chemicals. Such implantable sensing device can be used for a variety of electrochemical measuring applications within a living body as well as actuation by injecting a current into the living body.
15 Citations
40 Claims
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1. A method for fabricating a miniaturized implantable device:
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fabricating an electronic system by monolithically integrating the electronic system on a first face of a substrate, the electronic system being configured, during operation of the implantable device, to communicate with an external device over a wireless communication link and to extract power for the implantable device from the wireless communication link; fabricating a coil by monolithically integrating the coil on the first face of the substrate, the coil being configured to provide the wireless communication link; fabricating a plurality of electrodes of an electrochemical sensor on a first metal layer separate from metal layers used to fabricate the electronic system by monolithically integrating the plurality of electrodes on the first face of the substrate, the plurality of electrodes being configured to provide electrical interface between the electrochemical sensor of the implantable device and the electronic system; and creating a plurality of wells in correspondence of the plurality of electrodes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A monolithically integrated miniaturized implantable device comprising:
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a substrate for monolithic integration of the miniaturized implantable device comprising a plurality of metal layers separated via a plurality of insulating layers; a monolithically integrated electrochemical sensor comprising a plurality of electrodes; a monolithically integrated electronic system; a plurality of wells in correspondence of the plurality of electrodes, wherein a depth of a well of the plurality of wells extends across one or more metal layers of the plurality of metal layers and/or one or more insulating layers of the plurality of insulating layers; and a monolithically integrated coil, wherein during operation of the implantable device, the electronic system is configured to; interface with the electrochemical sensor and sense a current in correspondence of a reaction, communicate with an external device over a wireless communication link provided by the coil, and, extract power for the miniaturized implantable device from the wireless communication link. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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Specification